Results 211 to 220 of about 180,495 (314)

Ti3C2Tx MXene/Silver Composite Foams For Lightweight, High‐Performance Electromagnetic Interference Shielding and Joule Heating

Advanced Materials Interfaces, EarlyView.
Ultrathin MXene/EMF composite foams achieve a specific shielding efficiency of 749.6 dB.dB·cm3$\mathrm{dB}\cdot {\mathrm{cm}}^{3}$/g, while the silver‐enhanced MXene/Ag/EMF reaches 81.4 dB shielding effectiveness at just 1.0 mm thickness. Both composites exhibit rapid Joule heating, retain stability up to 250∘C$^\circ{\rm C}$, and withstand 1000 ...
Abdullah A. Mahmood, Mingxuan Li, Vahid Rad, Mehdi Zarei, Chen‐Yu Yeh, Masoud Soroush, Guangyong Li, Paul W. Leu   +7 more
wiley   +1 more source

From Zombies to Smart Devices: The Evolution of Dye-Sensitized Solar Cells for IoT Applications. [PDF]

ACS Appl Energy Mater
Sasitharan K, Freitag M.
europepmc   +1 more source

Interfacial Electronic Restructuring in MAPbBr3/rGO Hybrids Enabling Improved Charge Extraction for Efficient Photodetection

Advanced Materials Interfaces, EarlyView.
MAPbBr3/rGO hybrids exhibit interfacial electronic restructuring that enhances charge extraction in photodetectors. The incorporation of rGO modifies the surface chemical environment, enhances electron‐dominated transport, and suppresses performance degradation, resulting in higher responsivity, detectivity, and photostability than in pristine MAPbBr3 ...
Mohammed Misbah Uddin, Wisnu Tantyo Hadmojo, Zeyad M. Abdulhamid, Marwa Abd‐Ellah, Ahmed L. Abdelhady   +4 more
wiley   +1 more source

AI and Smart Devices in Cardio-Oncology: Advancements in Cardiotoxicity Prediction and Cardiovascular Monitoring. [PDF]

Diagnostics (Basel)
Nechita LC, Tutunaru D, Nechita A, Voipan AE, Voipan D, Tupu AE, Musat CL.   +6 more
europepmc   +1 more source

Thermal Radiation Emission From 3D Graphene Networks

Advanced Materials Interfaces, EarlyView.
Three‐dimensional graphene networks are demonstrated as exceptional broadband thermal emitters, exhibiting high‐intensity, spectrally homogeneous emission and strong mechanical flexibility compared to conventional emitters like silicon carbide.
Maria Chiara Paolozzi, Emanuele Scoppi, Jacopo Sera, Salvatore Macis, Antonio Grilli, Samuel Jeong, Yoshikazu Ito, Stefano Lupi   +7 more
wiley   +1 more source

Light Switchable Ionic Conductivity of Arylazopyrazole Modified Polysiloxanes

Advanced Materials Technologies, EarlyView.
We present a polysiloxane functionalized with a novel arylazopyrazole dye that undergoes reversible photoisomerization. Upon lithium bis(trifluoromethanesulfonyl)imide addition and UV irradiation, the polymer exhibits a shift in tan(d) toward higher frequencies and enhanced ionic conductivity.
Malte S. Beccard, Thulasinath Raman Venkatesan, Michael Bauer, Valentin Razvan Lupu, Philipp Scheidegger, Francesco Taddei, Frank A. Nüesch, Dorina M. Opris   +7 more
wiley   +1 more source

Correction: Highly Efficient Back-End-of-Line Compatible Flexible Si-Based Optical Memristive Crossbar Array for Edge Neuromorphic Physiological Signal Processing and Bionic Machine Vision

Nano-Micro Letters
Dayanand Kumar, Hanrui Li, Dhananjay D. Kumbhar, Manoj Kumar Rajbhar, Uttam Kumar Das, Abdul Momin Syed, Georgian Melinte, Nazek El-Atab   +7 more
doaj   +1 more source

Harnessing AI forward and backward chaining with telemetry data for enhanced diagnostics and prognostics of smart devices. [PDF]

Sci Rep
Farooq MS, Mir RP, Alvi A, Tutusaus K, Villena EG, Alrowais F, Karamti H, Ashraf I.   +7 more
europepmc   +1 more source

Micropillar‐Engineered Hybrid Adhesive Patch for Surface‐Conformable and Directional Adhesion

Advanced Materials Technologies, EarlyView.
This work presents a surface‐conformable hybrid adhesive integrating height‐optimized hexagonal micropillars with open‐rectangular cuts. The micropillars enhance rough‐surface contact and microscale crack arrest, while the cuts guide and reverse interfacial cracks for strong and directional adhesion. The multiscale architecture achieves robust pull‐off
Seongjin Park, Dong Kwan Kang, Haejin Bae, Ho‐Sup Jung, Hoon Eui Jeong   +4 more
wiley   +1 more source

Overcoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics

Advanced Materials Technologies, EarlyView.
Liquid metal direct writing is advanced from a technological and fundamental point. Utilizing a kinematic bed, printing on large surfaces with irregularities is enabled. Furthermore, a pressure‐driven flow during printing is discovered that affects the thickness of traces.
Maximilian Krack, Lennert Purnal, Parth Vinayakrao Sewlikar, Sam Cuyvers, Gus Geurts, Rathul Nengminza Sangma, Derese Desta, Dieter Reenaers, Bart Ruttens, Iris De Graeve, Tom Hauffman, Seppe Terryn, Bram Vanderborght, Michaël Daenen, Wim Deferme, Monika Rai   +15 more
wiley   +1 more source