Results 161 to 170 of about 77,385 (296)

Enhancing Grayscale E‐Beam Lithography: Thermal Treatment of Novolak‐Based Resist for 3D Nanostructures

open access: yesAdvanced Materials Interfaces, EarlyView.
Surface roughness and chemistry of novolak‐based grayscale resists are dependent on both exposure dose and post‐exposure thermal treatment. The observed trends align with the viscoelastic phase separation model and underscore the need to consider both thermodynamic and kinetic factors in resist processing. By tailoring thermal treatment, it is possible
Rahul Singh   +4 more
wiley   +1 more source

Increased levels of IAA are required for system 2 ethylene synthesis causing fruit softening in peach (Prunus persica L. Batsch) [PDF]

open access: hybrid, 2013
Miho Tatsuki   +8 more
openalex   +1 more source

Designing Defect Structure and Interfacial Strain in an Epitaxial VN Bilayer Film by Tailoring N Concentration

open access: yesAdvanced Materials Interfaces, EarlyView.
The N concentration in an epitaxial VN bilayer is tailored from overstoichiometric V0.49N0.51 to understoichiometric V0.56N0.44. Based on ab initio, diffraction, and microscopy data, the overstoichiometric V0.49N0.51 layer contains V vacancies, N Frenkel pairs, and a high density of dislocations.
Marcus Hans   +7 more
wiley   +1 more source

Hard water softening effect of a baby cleanser

open access: green, 2016
Walters RM   +6 more
openalex   +1 more source

Two‐Way Shape Memory Polymer Composite Gripper for Adaptive Robotic Applications

open access: yesAdvanced Materials Technologies, EarlyView.
A two‐way shape memory polymer (SMP) composite is developed with intrinsic shape‐changing capability driven solely by temperature, eliminating external actuation loads. Embedding the SMP in a low‐stiffness elastomeric matrix enabled reversible transformations during heating and cooling cycles.
Aamna Hameed, Kamran Ahmed Khan
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

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