Results 211 to 220 of about 17,986 (235)

Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling. [PDF]

J Mater Sci Mater Electron
Hsieh CL, Coyle RJ, Belyakov SA, Xian JW, Gourlay CM.   +4 more
europepmc   +1 more source

Wettability Study of Soldered Joints in SiC Ceramics and Combined Ni-SiC Using SnSbTi-Based Solder and Electron Beam Heating. [PDF]

Materials (Basel)
Melus T, Kolenak R, Drapala J, Gogola P, Pasak M, Drimal D, Sloboda M.   +6 more
europepmc   +1 more source

Sintering for High Power Optoelectronic Devices. [PDF]

Micromachines (Basel)
Schwan H, Mohan N, Schmid M, Saha RK, Klassen H, Müller K, Elger G.   +6 more
europepmc   +1 more source

Packaging Design and Thermal Characterization of 3D Double-Sided Cooling Automotive SiC Power Modules with Reliable Junction Temperature Sensing. [PDF]

Sensors (Basel)
Li C, Lin T, Guo X, Wang R, Chen Y, Zhou S.   +5 more
europepmc   +1 more source

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Review: Special brazing and soldering

Journal of Manufacturing Processes, 2020
Yi Ruixiang, Chao Chen
exaly  

Soldering of Carbon Materials Using Transition Metal Rich Alloys

ACS Nano, 2015
Agnieszka Lekawa-Raus, Krzysztof K Koziol   +1 more
exaly  

Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad

Journal of Materials Processing Technology, 2015
Hiroshi Nishikawa
exaly