Results 1 to 10 of about 1,501 (219)
Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process
Metals, 2021 This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed
Muhammad Iqbal Ahmad +2 more
exaly +4 more sources
Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications
Energies, 2023 This paper gives a review of different applications in the numerical modelling of reflow soldering technology from recent years. The focus was on detailing the different process types, the physical background, and related mathematical models.
Attila Geczy, Balázs Illés
exaly +4 more sources
Reflow Soldering Capability Improvement by Utilizing TaN Interfacial Layer in 1Mbit RRAM Chip [PDF]
Micromachines, 2022 We investigated the thermal stability of a 1Mbit OxRRAM array embedded in 28 nm COMS technology. A back-end-of-line (BEOL) solution with a TaN–Ta interfacial layer was proposed to eliminate the failure rate after reflow soldering assembly at 260 °C.
Peng Yuan +4 more
doaj +2 more sources
Optimization of reflow soldering temperature curve based on genetic algorithm
Energy Reports, 2021 The current SMT reflow soldering process usually adopts experimental methods to predict the temperature curve, and the disadvantages of high cost and low efficiency are urgent problems.
Pengzhi Yin
exaly +3 more sources
Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs [PDF]
Scientific ReportsThis paper investigates the climatic reliability of realistic PCBA component geometries soldered using reflow process, from the perspective of the interaction between component design parameters, reflow residue and humidity.
Anish Rao Lakkaraju +3 more
doaj +2 more sources
Study on warpage stress in SiP packages during reflow soldering [PDF]
Scientific ReportsWith the ongoing trend toward miniaturization and high-density integration in electronic packaging, System-in-Package (SiP) has become a key research focus for large-scale AI model integration.
R. N. Qu +5 more
doaj +2 more sources
Journal of Materials Research and TechnologyIn this study, the properties of solder joints were compared after bonding process using different energy sources. Various soldering methods were employed, including reflow, laser, and Intense Pulsed Light (IPL) soldering.
Eun-Chae Noh +2 more
exaly +3 more sources
Low temperature soldering technology based on superhydrophobic copper microlayer [PDF]
HeliyonCu–Cu soldering is realized under certain pressure and low temperature conditions by using a surface silver film to modify the copper microlayer structure, thus solving the problems of high thermal stress and signal delay aggravation caused by high ...
Jin Xiao, Qian Zhai, Wei Cheng
doaj +2 more sources
IEEE Access, 2021 In order to use mechanism model analysis instead of experimental test to control and adjust the temperature and oven temperature curve of each part of the integrated circuit board reflow oven to make it meet the process requirements, a fitting algorithm ...
Geng Ma, Xiaoqing Huang, Shihao Liu
doaj +1 more source
Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders
Metals, 2022 Sn–Bi alloys are desirable candidates for soldering components on printed circuit boards (PCBs) because of their low melting point and reduced cost.
Karel Dušek +5 more
doaj +1 more source