Results 41 to 50 of about 102,570 (230)

The combined effect of reflow soldering time and Bi doping on the interfacial behavior and shear properties of Sn-0.7Cu-0.8Zn/Cu solders joint

Journal of Materials Research and Technology
The interfacial intermetallic compounds (IMC) layers evolution and shear properties in Sn-0.7Cu-0.8Zn/Cu and Sn-0.7Cu-0.8Zn–5Bi/Cu solder joint at different reflow soldering time were investigated.
Wenbin Tu, Shanlin Wang, Weihua Chen, Pengfei Wang, Jilin Xie, Si Chen, Min Zheng, Mingwei Wei, Yuhua Chen, Fan Wu   +9 more
doaj   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

Advanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová, Markéta Klimtová, Mohd Faizul Mohd Sabri, Yew Hoong Wong, Petr Veselý, Martin Plaček, Karel Dušek   +6 more
wiley   +1 more source

A color-coded light-induced heating technology for Pb-free solder joints of advanced multi-semiconductor packaging

Journal of Materials Research and Technology
The complexity of semiconductor packaging is increasing due to artificial intelligence, heterogeneous integration, and chiplet technology, necessitating precise thermal control in multi-component soldering. Conventional reflow soldering requires multiple
Taejoon Noh, Ho-Gyeong Seong, Minjae Sung, Jaejun Yoon, Jong-Woong Kim, Seung-Boo Jung   +5 more
doaj   +1 more source

Wearable Smart Patches on Sustainable Chitosan With Reversible Microbial Growth‐Inhibitory Properties

Advanced Functional Materials, EarlyView.
ABSTRACT Chitosan, a polysaccharide upcycled from biowaste, has long promised sustainable, biocompatible, and antimicrobial films and devices, an appeal reinforced by its recent regulatory recognition, with several chitosan‐based antibacterial dressings gaining clearance through the Food and Drug Administration's 510(k) pathway.
Jacopo Nicoletti, Kubra Kocak, Andrea Michel, Enrico Cavarzerani, Ali Raza, Petr Rohzin, Nouha Loudhaief, Saimir Frroku, Nicolò Baldovin, Hazrat Bilal, Alvise Perosa, Maurizio Selva, Flavio Rizzolio, Luca Sbuelz, Sabrina Tamburini, Domenico De Fazio, Giovanni Antonio Salvatore   +16 more
wiley   +1 more source

Flexible Hybrid Electronics via Near‐Infrared Radiation‐Assisted Soldering of Surface Mount Devices on Screen Printed Circuits

Advanced Electronic Materials, 2023
The development of flexible hybrid electronics (FHEs) with high‐throughput integration of electrical components onto digitally printed circuits has a wide range of applications, such as asset tracking, wearable electronics, and structural health ...
Venkat Kasi, Amin Zareei, Sarath Gopalakrishnan, Alejandro M. Alcaraz, Shantanu Joshi, Babak Arfaei, Rahim Rahimi   +6 more
doaj   +1 more source

Leaftronics: Bio‐Fractal Scaffolds From Leaf Venation for Low‐Waste Electronics

Advanced Materials, EarlyView.
“Leaftronics” transforms naturally evolved leaf venation into quasi‐fractal scaffolds for sustainable electronics. Polymer‐infiltrated leaf skeletons can be used to fabricate ultra‐smooth, reflow‐ and thin‐film‐compatible decomposable substrates, while making the same lignocellulose networks conducting results in flexible transparent electrodes.
Rakesh Rajendran Nair, Hrisheekesh Thachoth Chandran, Karl Leo, Hans Kleemann   +3 more
wiley   +1 more source

Bridging Performance and Fate: A Framework for Sustainable, Composite‐Based Flexible Electronic Systems

Advanced Electronic Materials, EarlyView.
Composite‐based flexible electronics integrate biodegradable polymers, conductive networks, and multilayer device architectures to balance electrical performance, mechanical durability, and controlled degradation. Interfacial engineering and encapsulation regulate transport stability and operational lifetime, while programmed disassembly enables ...
Sayam, Sangho Cho
wiley   +1 more source

A Knowledge‐Augmented Wearable System for Interpretable Plant Health Monitoring

FlexTech, EarlyView.
We present K‐Wear, a knowledge‐augmented wearable system for interpretable plant health monitoring. A soft multimodal sensing platform continuously captures spectral, humidity, and temperature signals from plant leaves, which are processed through a knowledge‐guided large language model reasoning framework to generate mechanistic diagnoses and ...
Xingxing Dong, Yihan Luo, Qin Jiang, Jie Ye, Yihui Fan, Menghao Pu, Zisheng Zong, Guoqiang Xu, Han Ding, Zhigang Wu   +9 more
wiley   +1 more source

Research on Substrate Soldering of High-voltage IGBT Modules

Kongzhi Yu Xinxi Jishu, 2011
It is analyzed physical process and temperature characteristics of vacuum reflow soldering, and also summarized the influence of variables for vacuum reflow soldering process on the quality of IGBT substrate soldering through experiments analysis.
赵洪涛
doaj  

A Geometrically Transient Platform for Bioelectronic Implants

Advanced Materials, Volume 38, Issue 55, 1 October 2026.
Minimally invasive bioelectronic implants often compromise performance for smaller sizes. To resolve this optimization dilemma, a wireless bioelectronic implant with a transient geometry is introduced (MiFi). The origami‐inspired device miniaturizes up to sixfold for syringe insertion and autonomously unfolds post‐implantation.
Selin Olenik, John D. Goodwin, Atharv Naik, Philip Coatsworth, Ioi Chit Cheung, Farbod Amirghasemi, Anies Sohi, Ehsan Abedi, Tayeb Tadlaoui, Maral P. S. Mousavi, Andriy S. Kozlov, Victoria Salem, Andrew S. Cowburn, Firat Guder   +13 more
wiley   +1 more source