Results 41 to 50 of about 1,501 (219)
Advanced Materials Technologies, EarlyView.A self‐healing and electrically conductive liquid metal elastomer enables robust self‐soldering of surface mount devices for soft electronics. Photothermally activated conductive pathways, strong pressure‐sensitive adhesion, and stable package‐integrated contacts provide high conductivity and extreme stretchability.
Su Thiri San +5 more
wiley +1 more source
Genesis Analysis of Common Defects of Reflow Soldering and Research for Solutions
, 2011 To guarantee the quality of surface mounting electronic products, this article analyzes the process features of its four working zones, discusses some main factors which influences the soldering quality of reflow soldering, analyzes the common soldering ...
Wan Gang Wang, Yong Peng, Xiao Ping Wang
core +1 more source
Advanced Science, EarlyView.A reconfigurable physical unclonable function is developed using CMOS‐integrated SOT‐MRAM chips, leveraging a dual‐pulse strategy and offering enhanced environmental robustness. A temperature‐compensation effect arising from the CMOS transistor and SOT‐MTJ is revealed and established as a key prerequisite for thermal resilience.
Min Wang +7 more
wiley +1 more source
Advanced Science, EarlyView.Current technologies for spinal cord optogenetic stimulation rely on external power sources and face reliability constraints in freely behaving animals. Here, a fully implantable, battery‐powered optoelectronic device is introduced, enabling operation in any selected environment with wireless recharging for months‐long stimulation.
Shahriar Shalileh +8 more
wiley +1 more source
Materials & Design, 2019 The Sn-0.7Cu-10Bi-xCo/Co (SCB-xCo/Co) interface reaction during soldering process, and the growth and evolution of intermetallic compounds (IMCs) after multiple reflow were investigated.
He Gao +3 more
doaj +1 more source
Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity
Acta Electrotechnica et Informatica, 2021 The main purpose of this paper is the analysis of the electrical resistivity of solder joints depending on various surface finishes and on the number of reflow processes. The electrical resistivity was determined after 1, 2, 3, 5 and 6 reflow cycles as a
Dzivy Daniel +3 more
doaj +1 more source
Electric‐Current‐Induced Phase Transformation in Cu6Sn5 Below Its Equilibrium Transition Temperature
Advanced Science, EarlyView.Electric current induces a monoclinic‐to‐hexagonal phase transformation in Cu6Sn5 at a measured bulk temperature of ∼120°C, below the equilibrium transition temperature. Ex situ synchrotron x‐ray diffraction, TEM, and matched thermal controls show that current stressing promotes the formation of a retained hexagonal η‐phase post‐stress state not ...
Shih‐kang Lin +3 more
wiley +1 more source
Advanced Electronic Materials, EarlyView.Composite‐based flexible electronics integrate biodegradable polymers, conductive networks, and multilayer device architectures to balance electrical performance, mechanical durability, and controlled degradation. Interfacial engineering and encapsulation regulate transport stability and operational lifetime, while programmed disassembly enables ...
Sayam, Sangho Cho
wiley +1 more source
Reflow soldering process simulation: a simplified model [PDF]
, 2002 Established models of temperature development during reflow soldering have used general purpose, finite difference (FD) or computational fluid dynamics modelling tools to create detailed representations of both the product and the reflow furnace.
David Whalley (1248297)
core
Advanced Intelligent Systems, EarlyView.This work presents a flexible, battery‐free sensor that forms a closed‐loop feedback system for smart compression therapy devices. Its scalable surface‐mount manufacturing, compact form factor, and wireless communication enable seamless integration with a wide range of active compression garments, improving user experience and therapeutic outcomes ...
Sinuo Zhao +11 more
wiley +1 more source