Results 31 to 40 of about 1,501 (219)

Comparative study on the bonding property of laser and reflow soldered Sn-3.0Ag-0.5Cu/Ni–P microbumps after isothermal aging and multiple reflowing

Journal of Materials Research and Technology
Laser soldering has attracted attention in microbumps joining field due to its noncontact and localized heating, a short joining time, fluxless and easy automation. In this study, Sn-3.0Ag-0.5Cu/Ni–P microbumps were prepared by laser soldering and reflow
Yang Wu, Zhijie Zhang, Leida Chen, Shuye Zhang   +3 more
doaj   +1 more source

Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

MATEC Web of Conferences, 2016
In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance.
Saliza Azlina O., Ourdjini A.
doaj   +1 more source

The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering

Archives of Metallurgy and Materials, 2015
In lead-free reflow soldering, the presence of voids should be taken into account. For this reason, the effect of the applied heating profiles was examined via the characterization of voids in galvanic and immersion Sn coatings. According to EU Directive
Koncz-Horváth D., Gergely G., Gácsi Z.
doaj   +1 more source

Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors

Applied Sciences, 2021
Electronic manufacturing principles are continuously developing, further improving assembly quality and productivity. There is a continuous need to apply novel and improved methods of process monitoring to provide accurate measurement and control during ...
Mohamed Amine Alaya, Balázs Illés, David Bušek, Attila Géczy   +3 more
doaj   +1 more source

Swelling‐Induced Stress‐Assisted Transfer of Nanodiamond Arrays With a PVA Carrier Tape for Conformal Bio‐Integrated Sensing and Labelling

Advanced Functional Materials, EarlyView.
This work introduces a swelling‐induced, stress‐assisted water‐soluble PVA tape strategy to transfer‐print nanodiamond quantum‐sensor arrays onto soft, curved biological interfaces. The room‐temperature, water‐triggered process achieves >98% fidelity and residue‐free integration, enabling conformal quantum sensing on contact lenses, neural probes, and ...
Luyao Zhang, Lingzhi Wang, Xinhao Hu, Tai Nam Yip, Mingze Sun, Jixiang Jing, Lizhi Xu, Yuan Lin, Yong Hou, Zhiqin Chu   +9 more
wiley   +1 more source

A color-coded light-induced heating technology for Pb-free solder joints of advanced multi-semiconductor packaging

Journal of Materials Research and Technology
The complexity of semiconductor packaging is increasing due to artificial intelligence, heterogeneous integration, and chiplet technology, necessitating precise thermal control in multi-component soldering. Conventional reflow soldering requires multiple
Taejoon Noh, Ho-Gyeong Seong, Minjae Sung, Jaejun Yoon, Jong-Woong Kim, Seung-Boo Jung   +5 more
doaj   +1 more source

Flexible Hybrid Electronics via Near‐Infrared Radiation‐Assisted Soldering of Surface Mount Devices on Screen Printed Circuits

Advanced Electronic Materials, 2023
The development of flexible hybrid electronics (FHEs) with high‐throughput integration of electrical components onto digitally printed circuits has a wide range of applications, such as asset tracking, wearable electronics, and structural health ...
Venkat Kasi, Amin Zareei, Sarath Gopalakrishnan, Alejandro M. Alcaraz, Shantanu Joshi, Babak Arfaei, Rahim Rahimi   +6 more
doaj   +1 more source

Leaftronics: Bio‐Fractal Scaffolds From Leaf Venation for Low‐Waste Electronics

Advanced Materials, EarlyView.
“Leaftronics” transforms naturally evolved leaf venation into quasi‐fractal scaffolds for sustainable electronics. Polymer‐infiltrated leaf skeletons can be used to fabricate ultra‐smooth, reflow‐ and thin‐film‐compatible decomposable substrates, while making the same lignocellulose networks conducting results in flexible transparent electrodes.
Rakesh Rajendran Nair, Hrisheekesh Thachoth Chandran, Karl Leo, Hans Kleemann   +3 more
wiley   +1 more source

Reflow Soldering Technology [PDF]

, 2010
Bakalářská práce se zabývá problematikou technologie pájení přetavením. V teoretické části se snaží seznámit s obecným principem pájení, významem použití tavidel, pájitelností povrchu, dále potom samotnou metodikou pájení přetavením, teplotním profilem a
Filáková, Denisa
core  

Weaving Intelligence: Thermally Drawn Multimaterial Fibers Toward AI‐Enabled Smart Textiles

Advanced Materials, EarlyView.
Thermally drawn multimaterial fibers are rapidly advancing as intelligent structural units for next‐generation smart textiles. Integrating multimaterial architectures with neuromorphic and spiking‐neural‐network principles enables fabrics that can sense, compute, and adapt autonomously.
Vuong Dinh Trung, Jiaxiang Yi, Hieu Nguyen‐Duc, Tien Nu Hoang Lo, Weili Zhao, Chaoqun Dong, Fabien Sorin, Baris Caglar, Lei Wei, Tung Nguyen‐Dang   +9 more
wiley   +1 more source