Results 31 to 40 of about 102,570 (230)
Process variables in the reflow soldering of surface mount
, 1990 The variety of surface mount device (SMD) terminations, solder pad shape and surface properties, soldering processes, and properties of solder pastes currently leads to ill-understood and ad hoc methods of specifying component terminations, joint ...
P.M. Sargent (7210025) +4 more
core +6 more sources
Joining of Electrodes to Ultra-Thin Metallic Layers on Ceramic Substrates in Cryogenic Sensors
Sensors, 2021 Microjoining technologies are crucial for producing reliable electrical connections in modern microelectronic and optoelectronic devices, as well as for the assembly of electronic circuits, sensors, and batteries.
Marcin Lebioda +2 more
doaj +1 more source
Stress warpage analysis of IGBT module package reflow soldering
Xi'an Gongcheng Daxue xuebao, 2021 In order to explore the impact of reflow soldering process on power device packaging, a 3D package model based on insulated gate bipolar transistor (IGBT) module was established using DesignModeler, and then ANSYS software was used to perform thermal ...
Lipeng TAN +4 more
doaj +1 more source
IEEE Access, 2021 As the environmental concern is being raised over residues of lead, the trend of transferring from the conventional lead-based soldering to lead-free soldering is overwhelming. Lead-free solders require the peak temperature to be about 30 degrees Celsius
Tin Lun Lam
doaj +1 more source
A simplified model of the reflow soldering process [PDF]
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258), 2003 Previous models of the reflow soldering process have used commercial finite difference (FD) or computational fluid dynamics simulation software to create detailed representations of the product and/or the reflow furnace. Such models have been shown to be highly accurate at predicting the temperatures a PCB design will achieve during the reflow process.
David C. Whalley, Stuart M. Hyslop
openaire +2 more sources
A simplified model of the reflow soldering process [PDF]
, 2002 Previous models of the reflow soldering process have used commercial finite difference (FD) or computational fluid dynamics simulation software to create detailed representations of the product and/or the reflow furnace. Such models have been shown to be
David Whalley (1248297)
core +6 more sources
Journal of Materials Research and TechnologyLaser soldering has attracted attention in microbumps joining field due to its noncontact and localized heating, a short joining time, fluxless and easy automation. In this study, Sn-3.0Ag-0.5Cu/Ni–P microbumps were prepared by laser soldering and reflow
Yang Wu +3 more
doaj +1 more source
Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG
MATEC Web of Conferences, 2016 In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance.
Saliza Azlina O., Ourdjini A.
doaj +1 more source
The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering
Archives of Metallurgy and Materials, 2015 In lead-free reflow soldering, the presence of voids should be taken into account. For this reason, the effect of the applied heating profiles was examined via the characterization of voids in galvanic and immersion Sn coatings. According to EU Directive
Koncz-Horváth D., Gergely G., Gácsi Z.
doaj +1 more source
Applied Sciences, 2021 Electronic manufacturing principles are continuously developing, further improving assembly quality and productivity. There is a continuous need to apply novel and improved methods of process monitoring to provide accurate measurement and control during ...
Mohamed Amine Alaya +3 more
doaj +1 more source