Results 51 to 60 of about 102,570 (230)

Suitability of Different Anodic Aluminum Oxide Layer Morphologies and Metallization Processes for the Assembly of Surface Mount Devices by Reflow Soldering on Aluminum-Based Substrates

open access: yesJournal of Manufacturing and Materials Processing
Circuit carriers perform various functions within electrical systems and products. This includes being the assembly platform for various components. To mount these components, soldering processes are predominantly used because of economic and technical ...
Simon Petillon   +5 more
doaj   +1 more source

Surface and Interfacial Engineering toward Durable Mechanically Coupled Flexible Electronics

open access: yesAdvanced Science, Volume 13, Issue 49, 3 September 2026.
This Review highlights how surface and interfacial engineering governs the reliability, durability, and functional stability of mechanically coupled flexible electronics. By integrating fundamental interfacial theory, failure mechanisms, multiscale engineering strategies, and representative applications, it provides a design‐oriented framework for ...
Qian Wang, Fangfang Dai, Wei Wu
wiley   +1 more source

Transient Thermal-Electric Simulation and Experiment of Heat Transfer in Welding Tip for Reflow Soldering Process

open access: yesMathematical Problems in Engineering, 2018
Welding tip is an appliance for making footprint to connect the arm and head gimbal assembly (HGA) together in reflow soldering process. The welding tip is made from 3 materials: copper alloy, stainless steel, and haynes 230.
J. Thongsri
semanticscholar   +1 more source

Growth behaviors of intermetallic compounds on the Sn-0.7Cu-10Bi-xCo/Co interface during multiple reflow

open access: yesMaterials & Design, 2019
The Sn-0.7Cu-10Bi-xCo/Co (SCB-xCo/Co) interface reaction during soldering process, and the growth and evolution of intermetallic compounds (IMCs) after multiple reflow were investigated.
He Gao   +3 more
doaj   +1 more source

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

open access: yesActa Electrotechnica et Informatica, 2021
The main purpose of this paper is the analysis of the electrical resistivity of solder joints depending on various surface finishes and on the number of reflow processes. The electrical resistivity was determined after 1, 2, 3, 5 and 6 reflow cycles as a
Dzivy Daniel   +3 more
doaj   +1 more source

Weaving Intelligence: Thermally Drawn Multimaterial Fibers Toward AI‐Enabled Smart Textiles

open access: yesAdvanced Materials, Volume 38, Issue 40, 17 July 2026.
Thermally drawn multimaterial fibers are rapidly advancing as intelligent structural units for next‐generation smart textiles. Integrating multimaterial architectures with neuromorphic and spiking‐neural‐network principles enables fabrics that can sense, compute, and adapt autonomously.
Vuong Dinh Trung   +9 more
wiley   +1 more source

Reflow soldering method with gradient energy band generated by optical system.

open access: yesOptics Express, 2018
Laser reflow soldering is an important technology in electronic components processing. In this paper, we presented a simple but efficient method to achieve reflow soldering process with gradient energy band created by just two parallel mirrors.
Yong-Qi Chen   +5 more
semanticscholar   +1 more source

Self‐Soldering, Stretchable and Self‐Healing Liquid Metal Elastomer Interconnections for Soft Electronics Platforms

open access: yesAdvanced Materials Technologies, Volume 11, Issue 14, 22 July 2026.
A self‐healing and electrically conductive liquid metal elastomer enables robust self‐soldering of surface mount devices for soft electronics. Photothermally activated conductive pathways, strong pressure‐sensitive adhesion, and stable package‐integrated contacts provide high conductivity and extreme stretchability.
Su Thiri San   +5 more
wiley   +1 more source

Temperature‐Resilient Reconfigurable Physical Unclonable Function Driven by Pulse Modulation Using CMOS‐Integrated Spintronic Chips

open access: yesAdvanced Science, Volume 13, Issue 37, 3 July 2026.
A reconfigurable physical unclonable function is developed using CMOS‐integrated SOT‐MRAM chips, leveraging a dual‐pulse strategy and offering enhanced environmental robustness. A temperature‐compensation effect arising from the CMOS transistor and SOT‐MTJ is revealed and established as a key prerequisite for thermal resilience.
Min Wang   +7 more
wiley   +1 more source

Wireless, Adaptable and Fully Implantable Battery‐powered Devices for Optical Stimulation of the Spinal Cord in Small Rodents

open access: yesAdvanced Science, Volume 13, Issue 40, 17 July 2026.
Current technologies for spinal cord optogenetic stimulation rely on external power sources and face reliability constraints in freely behaving animals. Here, a fully implantable, battery‐powered optoelectronic device is introduced, enabling operation in any selected environment with wireless recharging for months‐long stimulation.
Shahriar Shalileh   +8 more
wiley   +1 more source

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