Results 51 to 60 of about 1,501 (219)

Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

Crystals, 2021
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were
Lu Liu, Songbai Xue, Ruiyang Ni, Peng Zhang, Jie Wu   +4 more
doaj   +1 more source

Modular Electronic Microrobots With Onboard Sensor‐Program‐Steered Locomotion

Advanced Intelligent Systems, EarlyView.
Modular electronic smartlet microrobots integrate ambient‐light energy harvesting, photodetection, programmable CMOS control, and bubble‐based actuation within a sub‐millimeter fold‐up architecture. A 58‐bit on‐board CMOS chiplet enables sensor–program steered switching between independently addressable actuators, achieving closed‐loop 2D navigation in
Vineeth K. Bandari, Yeji Lee, Pranathi Adluri, Daniil Karnaushenko, Dmitriy D. Karnaushenko, John S. McCaskill, Oliver G. Schmidt   +6 more
wiley   +1 more source

Anode‐Free All‐Solid‐State Batteries: Understanding Limitations and Charting a Path to Enhanced Performance

Small, EarlyView.
This review examines four factors that drive interfacial instability in sulfide‐based anode‐free all‐solid‐state batteries and thoroughly reviews corresponding performance‐enhancing strategies. The strategies are organized as follows: (1) interlayer engineering, (2) pressure‐regulating buffer layers, (3) other methods, including sacrificial cathodes ...
Sion Kim, Jaechan Lee, Jihyun Jang
wiley   +1 more source

Solder Selection of Lead-Free Reflow Soldering and Optimization of Craft Curve

, 2011
Lead-free reflow soldering craft is the most important solder craft in surface mount technology at present. However, the great reduction of crafting window brings challenges to the soldering quality and also poses higher requirement for the stability and
Wan Gang Wang, Yong Peng
core   +1 more source

Atomic-scale study of Cu3Sn and Cu6Sn5 intermetallic layers growth after soldering

Materials & Design
Advanced microscopy and elemental analysis techniques were employed to investigate the atomic-scale characteristics of intermetallic compound (IMC) layers of Cu3Sn and Cu6Sn5, which commonly form on copper-based surfaces during reflow soldering with lead-
Farzad Khodabakhshi, Irina Wodak, Shabnam Taheriniya, Andriy Yakymovych, Michael K. Eusterholz, Gerhard Wilde, Golta Khatibi   +6 more
doaj   +1 more source

Sustainable Photovoltaics: Optimising Material Consumption, Cost and Environmental Performance Through Smart Sustainability Approaches for Crystalline Silicon Solar Photovoltaics

Solar RRL, Volume 10, Issue 11, 15 June 2026.
A sustainability framework shows that photovoltaics can simultaneously improve material security, reduce costs, and improve environmental performance. Updated learning curves reveal declining material intensity and emissions alongside rising energy return on investment, EROI (> 25).
Moonyong Kim, Catherine Chan, Li Wang, Hasret Sahin, Bruno Vicari Stefani, Nathan Chang, Ran Chen, Christian Breyer, Brett Hallam   +8 more
wiley   +1 more source

Process Window Optimization for Roll‐to‐Roll Slot‐Die Coating of High‐Resolution Dry Film Solder Resists for HDI PCB Applications

Polymer Engineering &Science, Volume 66, Issue 6, Page 4095-4106, June 2026.
A hydrodynamic process window for roll‐to‐roll slot‐die coating of photosensitive solder resist (PSR) was established by systematically varying the slot‐die gap and pump flow rate. Under the optimized conditions, a highly uniform 26 μm dry‐film solder resist (DFSR) layer with a thickness variation of ±3.74% was obtained without coating defects.
Geonu Kim, Woo Cheol Choi, Min Kwak, Jin Ho Shin, Jin Yong Seok, Ki‐Seok Jeon, Mincheol Chang, Chaehwan Jeong   +7 more
wiley   +1 more source

Hierarchical Reconfigurable Metasurface Based on Scenario‐Guided Functional Modules and Programmable Core

Advanced Science, Volume 13, Issue 28, 18 May 2026.
This paper proposes a hierarchical reconfigurable metasurface architecture (HRMA) to achieve comprehensive electromagnetic parameter modulation and on‐demand polymorphic function switching. The reconfigurable metasurface is divided into a programmable core (PC) and scenario‐guided functional modules (FMs), exhibiting significant flexibility and ...
Lihao Zhu, Jiaqi Han, Zhe Zheng, Qiang Feng, Dexiao Xia, Xiangjin Ma, Yajie Mu, Guoliang Luo, Rui Li, Haixia Liu, Hao Xue, Long Li   +11 more
wiley   +1 more source

Effect of Flux onto Intermetallic Compound Formation and Growth

MATEC Web of Conferences, 2016
In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn-3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow ...
Idris Siti Rabiatull Aisha, Farihan Noor, Kahar Hardinnawirda   +2 more
doaj   +1 more source

Development of Flux for Lead free Soldering of High Power Devices

Journal of Harbin University of Science and Technology, 2018
Halogen-free low-Rosin flux was applied to lead-free soldering of the high-power devices with orthogonal test method. The compositions of flux such as active agent, solvents, film-forming agent were optimized and the spreading rate, corrosion resistance ...
SUN Feng-lian, PENG Li-juan
doaj   +1 more source