Results 71 to 80 of about 1,501 (219)
Journal of Materials Research and TechnologyThis study introduces a novel method for integrating aluminum flexible printed circuit boards (FPCBs) and copper FPCBs into battery management systems (BMS) using and instantaneous large area facial laser source soldering.
Seoah Kim +8 more
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, 2015 V diplomskem delu je predstavljena izdelava pečice za spajkanje s pretaljevanjem (angl. Reflow soldering) in mobilne aplikacije za njeno upravljanje. Naprava je primerna predvsem za izdelavo prototipnih izdelkov. Pretaljevalna pečica (angl. Reflow oven)
LEVIČNIK, MARKO
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, 1988 In surface mount technology, electronic components are soldered directly onto printed wiring boards without having to insert the component leads into the board.
Goh, Robert Teck Lee, 1956-
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Analysis of the quality of the welding process in the exchange of component of BGA technology
Revista Facultad de Ingeniería Universidad de Antioquia, 2016 In recent years, many efforts have been expended by companies in the search for technological improvement of their products by adding features such as lightweight materials, reduced size and high levels of performance at the lowest cost, to meet a ...
Robson Marques-Costa +4 more
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Process variables in the reflow soldering of surface mount
, 1990 The variety of surface mount device (SMD) terminations, solder pad shape and surface properties, soldering processes, and properties of solder pastes currently leads to ill-understood and ad hoc methods of specifying component terminations, joint ...
P.M. Sargent (7210025) +4 more
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Nanomaterials, 2019 In this study, the effects of adding Sn nanopowder (particle size < 150 nm) to three solder pastes SAC3-X(H)F3+, SCAN-Ge071-XF3+, and water washable WW50-SAC3 are evaluated regarding microstructure, morphology, joint strength, and electrical ...
Anas M. Atieh +6 more
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Investigating the self-alignment of chip components during reflow soldering
, 2009 Since the application of lead-free soldering has become obligatory in the electronic industry by the 1st of July 2006, the in-depth analysis of the soldering process is more important than ever.
Krammer, Olivér +1 more
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Materials & Design, 2019 Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process ...
Yu-An Shen +6 more
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Modelling thermal behavior of surface mounted components during reflow soldering
, 2009 Nowadays reflow soldering is the most widespread technology used for electrical and mechanical attachment of surface mount devices (SMDs) to printed wiring boards (PWBs).
Sinkovics, Bálint, Harsányi, Gábor
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CrystalsIn this study, intense pulsed light (IPL) soldering was employed on Sn-58Bi solder pastes with two distinct particle sizes (T3: 25–45 μm and T9: 1–8 μm) to investigate the correlation between the solder microstructure and mechanical properties as a ...
Hyeri Go +3 more
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