Results 71 to 80 of about 102,570 (230)
Advanced Functional Materials, Volume 36, Issue 50, 22 June 2026.This work introduces a swelling‐induced, stress‐assisted water‐soluble PVA tape strategy to transfer‐print nanodiamond quantum‐sensor arrays onto soft, curved biological interfaces. The room‐temperature, water‐triggered process achieves >98% fidelity and residue‐free integration, enabling conformal quantum sensing on contact lenses, neural probes, and ...
Luyao Zhang +9 more
wiley +1 more source
Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C)
Journal of Materials Research and TechnologyThis study investigates Cu single-sided solder joints using hybrid soldering (In + Sn58Bi) at reflow temperatures ranging from 80 to 130 °C. The wetting angles of 27° at 90 °C and 22° at 130 °C demonstrated good wettability.
Yu-An Shen
doaj +1 more source
Advanced Intelligent Systems, Volume 8, Issue 6, June 2026.This work presents a flexible, battery‐free sensor that forms a closed‐loop feedback system for smart compression therapy devices. Its scalable surface‐mount manufacturing, compact form factor, and wireless communication enable seamless integration with a wide range of active compression garments, improving user experience and therapeutic outcomes ...
Sinuo Zhao +11 more
wiley +1 more source
Genesis Analysis of Common Defects of Reflow Soldering and Research for Solutions
, 2011 To guarantee the quality of surface mounting electronic products, this article analyzes the process features of its four working zones, discusses some main factors which influences the soldering quality of reflow soldering, analyzes the common soldering ...
Wan Gang Wang, Yong Peng, Xiao Ping Wang
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Journal of Materials Research and TechnologyThis study introduces a novel method for integrating aluminum flexible printed circuit boards (FPCBs) and copper FPCBs into battery management systems (BMS) using and instantaneous large area facial laser source soldering.
Seoah Kim +8 more
doaj +1 more source
Investigating the self-alignment of chip components during reflow soldering [PDF]
, 2009 Since the application of lead-free soldering has become obligatory in the electronic industry by the 1st of July 2006, the in-depth analysis of the soldering process is more important than ever.
Krammer, Olivér +1 more
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Analysis of the quality of the welding process in the exchange of component of BGA technology
Revista Facultad de Ingeniería Universidad de Antioquia, 2016 In recent years, many efforts have been expended by companies in the search for technological improvement of their products by adding features such as lightweight materials, reduced size and high levels of performance at the lowest cost, to meet a ...
Robson Marques-Costa +4 more
doaj +1 more source
Low temperature soldering technology based on superhydrophobic copper microlayer
HeliyonCu–Cu soldering is realized under certain pressure and low temperature conditions by using a surface silver film to modify the copper microlayer structure, thus solving the problems of high thermal stress and signal delay aggravation caused by high ...
Jin Xiao, Qian Zhai, Wei Cheng
doaj +1 more source
Nanomaterials, 2019 In this study, the effects of adding Sn nanopowder (particle size < 150 nm) to three solder pastes SAC3-X(H)F3+, SCAN-Ge071-XF3+, and water washable WW50-SAC3 are evaluated regarding microstructure, morphology, joint strength, and electrical ...
Anas M. Atieh +6 more
doaj +1 more source
Flux Residues after Reflow Soldering
, 2012 The aim of this bachelor thesis is to solve flux residue characteristics on PCBś after reflow soldering and compare different solder pastes. The first part deals with the issue of solder paste application and flux residues. The second part focuses on the
Uhlář, Vít
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