Results 61 to 70 of about 1,501 (219)
Non‐destructive orientation tracking of individual β‐Sn grains in die‐attach solder joints
Journal of Synchrotron Radiation, Volume 33, Issue 3, Page 617-631, May 2026.This study introduces inclined scanning three‐dimensional X‐ray diffraction microscopy (i‐S3DXRD) that enables three‐dimensional orientation mapping of planar polycrystalline materials, revealing the thermal fatigue mechanism of Pb‐free solder joints.Understanding the failure mechanisms of Pb‐free solder joints during thermal cycling is a critical ...
Jaemyung Kim +4 more
wiley +1 more source
A simplified model of the reflow soldering process [PDF]
, 2002 Previous models of the reflow soldering process have used commercial finite difference (FD) or computational fluid dynamics simulation software to create detailed representations of the product and/or the reflow furnace. Such models have been shown to be
David Whalley (1248297)
core
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
Advanced Functional Materials, Volume 36, Issue 33, 23 April 2026.This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source
Analysis of surface mount technology solder joints
, 1996 This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex.
Hui, Ip Kee, Hui, I.K.
core
Advanced Materials Technologies, Volume 11, Issue 7, 6 April 2026.The 4R principle—Resilience, Repairability, Recyclability, and Renewability—enables sustainable liquid‐metal transistors. LM materials provide stretchable, damage‐tolerant architectures, allow rapid circuit repair, permit full material recovery through dissolution, and support renewable fabrication cycles, forming a closed‐loop pathway toward ...
Elahe Parvini, Abdollah Hajalilou
wiley +1 more source
Smart Optogenetics for Real‐Time Automated Control of Cardiac Electrical Activity
Advanced Science, Volume 13, Issue 20, 9 April 2026.We are able to stop dangerous heart‐rhythm spirals before they fully form. Within about 100 ms, it pinpoints the spiral's tiny central tip (≈0.9 mm) using light‐based sensing and machine learning, then shines targeted light to shut it down. This fast, precise, closed‐loop approach detects, targets, and terminates arrhythmias in real time.
Shanliang Deng +15 more
wiley +1 more source
Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C)
Journal of Materials Research and TechnologyThis study investigates Cu single-sided solder joints using hybrid soldering (In + Sn58Bi) at reflow temperatures ranging from 80 to 130 °C. The wetting angles of 27° at 90 °C and 22° at 130 °C demonstrated good wettability.
Yu-An Shen
doaj +1 more source
Recent Developments in Sustainable Composites for Printed Circuit Boards (PCBs): A Review
Macromolecular Materials and Engineering, Volume 311, Issue 4, April 2026.This review presents the potential of using natural plant fibers and biodegradable polymers as sustainable printed circuit boards (PCBs). This review provides future directions in innovation and sustainable PCBs development. Bio‐composites PCBs are both environmentally friendly and sustainable due to the natural fibres they contain.
Erdem Selver +7 more
wiley +1 more source
Flux Residues after Reflow Soldering
, 2012 The aim of this bachelor thesis is to solve flux residue characteristics on PCBś after reflow soldering and compare different solder pastes. The first part deals with the issue of solder paste application and flux residues. The second part focuses on the
Uhlář, Vít
core
Forecasting and Parameters Optimization of Reflow Soldering Profile Based on BPNN and GA
, 2010 This paper proposes an effective method to determine the optimal parameters settings of reflow soldering profile and helps reduce the try-and-error time in practical application.
Wen Zhu Liao +3 more
core +1 more source