Results 61 to 70 of about 102,570 (230)

Atomic-scale study of Cu3Sn and Cu6Sn5 intermetallic layers growth after soldering

Materials & Design
Advanced microscopy and elemental analysis techniques were employed to investigate the atomic-scale characteristics of intermetallic compound (IMC) layers of Cu3Sn and Cu6Sn5, which commonly form on copper-based surfaces during reflow soldering with lead-
Farzad Khodabakhshi, Irina Wodak, Shabnam Taheriniya, Andriy Yakymovych, Michael K. Eusterholz, Gerhard Wilde, Golta Khatibi   +6 more
doaj   +1 more source

Electric‐Current‐Induced Phase Transformation in Cu6Sn5 Below Its Equilibrium Transition Temperature

Advanced Science, Volume 13, Issue 41, 22 July 2026.
Electric current induces a monoclinic‐to‐hexagonal phase transformation in Cu6Sn5 at a measured bulk temperature of ∼120°C, below the equilibrium transition temperature. Ex situ synchrotron x‐ray diffraction, TEM, and matched thermal controls show that current stressing promotes the formation of a retained hexagonal η‐phase post‐stress state not ...
Shih‐kang Lin, Shubhayan Mukherjee, Yu‐chen Liu, Jun Mizuno   +3 more
wiley   +1 more source

Reflow Soldering [PDF]

, 2015
V diplomskem delu je predstavljena izdelava pečice za spajkanje s pretaljevanjem (angl. Reflow soldering) in mobilne aplikacije za njeno upravljanje. Naprava je primerna predvsem za izdelavo prototipnih izdelkov. Pretaljevalna pečica (angl. Reflow oven)
LEVIČNIK, MARKO
core  

Modular Electronic Microrobots With Onboard Sensor‐Program‐Steered Locomotion

Advanced Intelligent Systems, Volume 8, Issue 7, July 2026.
Modular electronic smartlet microrobots integrate ambient‐light energy harvesting, photodetection, programmable CMOS control, and bubble‐based actuation within a sub‐millimeter fold‐up architecture. A 58‐bit on‐board CMOS chiplet enables sensor–program steered switching between independently addressable actuators, achieving closed‐loop 2D navigation in
Vineeth K. Bandari, Yeji Lee, Pranathi Adluri, Daniil Karnaushenko, Dmitriy D. Karnaushenko, John S. McCaskill, Oliver G. Schmidt   +6 more
wiley   +1 more source

Effect of Flux onto Intermetallic Compound Formation and Growth

MATEC Web of Conferences, 2016
In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn-3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow ...
Idris Siti Rabiatull Aisha, Farihan Noor, Kahar Hardinnawirda   +2 more
doaj   +1 more source

Anode‐Free All‐Solid‐State Batteries: Understanding Limitations and Charting a Path to Enhanced Performance

Small, Volume 22, Issue 40, 17 July 2026.
This review examines four factors that drive interfacial instability in sulfide‐based anode‐free all‐solid‐state batteries and thoroughly reviews corresponding performance‐enhancing strategies. The strategies are organized as follows: (1) interlayer engineering, (2) pressure‐regulating buffer layers, (3) other methods, including sacrificial cathodes ...
Sion Kim, Jaechan Lee, Jihyun Jang
wiley   +1 more source

Development of Flux for Lead free Soldering of High Power Devices

Journal of Harbin University of Science and Technology, 2018
Halogen-free low-Rosin flux was applied to lead-free soldering of the high-power devices with orthogonal test method. The compositions of flux such as active agent, solvents, film-forming agent were optimized and the spreading rate, corrosion resistance ...
SUN Feng-lian, PENG Li-juan
doaj   +1 more source

Sustainable Photovoltaics: Optimising Material Consumption, Cost and Environmental Performance Through Smart Sustainability Approaches for Crystalline Silicon Solar Photovoltaics

Solar RRL, Volume 10, Issue 11, 15 June 2026.
A sustainability framework shows that photovoltaics can simultaneously improve material security, reduce costs, and improve environmental performance. Updated learning curves reveal declining material intensity and emissions alongside rising energy return on investment, EROI (> 25).
Moonyong Kim, Catherine Chan, Li Wang, Hasret Sahin, Bruno Vicari Stefani, Nathan Chang, Ran Chen, Christian Breyer, Brett Hallam   +8 more
wiley   +1 more source

The effect of multiple reflow on intermetallic layer of Sn- 4.0AgCu/Cu by using microwave and reflow soldering

, 2017
Soldering method is a general trend in demand that can be used to analyse different process parameter and their relationship in faster and easier way. Different soldering methods will influence the growth of intermetallic layer.
Jaya I Rasbudin, M. Rabiatul Adawiyah, O. Saliza Azlina   +2 more
semanticscholar   +1 more source

Hot‐Film and Calorimetric Methods With Transient Heating for Measurement of High Biofluid Flow Rate

Advanced Functional Materials, Volume 36, Issue 50, 22 June 2026.
Accurate measurement of biofluid flow rate is vital for clinical diagnostics. We propose a transient heating strategy using short thermal pulses and peak temperature tracking to enhance the flow sensitivity of the hot‐Film and calorimetric methods. Simulations show how optimal heating time maximizes sensitivity across flow rates.
Yuanting Wei, Shupeng Li, Kyung Rok Pyun, Tianyu Yang, Bosung Kim, Haotian Yang, John A. Rogers, Yonggang Huang, Haohui Zhang   +8 more
wiley   +1 more source