Results 1 to 10 of about 4,969 (222)
Polymer Testing, 2023 The warpage behavior of electronic packages has become complicated in recent years owing to the miniaturization and heterogeneous integration technologies.
Junmo Kim, Myoung Song, Chang-Yeon Gu
exaly +4 more sources
Study on warpage stress in SiP packages during reflow soldering [PDF]
Scientific ReportsWith the ongoing trend toward miniaturization and high-density integration in electronic packaging, System-in-Package (SiP) has become a key research focus for large-scale AI model integration.
R. N. Qu +5 more
doaj +2 more sources
Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing [PDF]
MicromachinesThe development of chip manufacturing and advanced packaging technologies has significantly changed redistribution layers (RDLs), leading to shrinking line width/spacing, increasing the number of build-up layers and package size, and introducing organic ...
Xianglong Chu +7 more
doaj +2 more sources
CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage [PDF]
Scientific ReportsThe rapid advancement of high-performance computing (HPC) and artificial intelligence (AI) has driven escalating demands for chip performance and integration.
Winston Wong +3 more
doaj +2 more sources
Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
Frontiers in ElectronicsWafer-level packaging (WLP) is a pivotal semiconductor packaging technology that enables heterogeneously integrated advanced semiconductor packages with high-density electrical interconnections through its efficient and highly reliable manufacturing ...
Chris Bailey
exaly +3 more sources
Optimization of injection molding process parameters based on GA-ELM-GA [PDF]
MATEC Web of Conferences, 2022 The most common optimization method for the optimization of injection mold process parameters is range analysis, but there is often a nonlinear coupling relationship between injection molding process parameters and quality indicators.
Mei Yi, Xue Maoyuan
doaj +1 more source
Micromachines, 2023 This study aims to establish an accurate prediction model using artificial neural networks (ANNs) to effectively and efficiently predict the process-induced warpage of a flip-chip chip-scale package (FCCSP).
Hsien-Chie Cheng +2 more
doaj +1 more source
Advances in Materials Science and Engineering, 2021 A plastic back door car panel was considered as the research object. In order to obtain optimal injection molding simulation parameters, Moldflow2018 is used to simulate injection molding process of plastic back door car panel.
Guoqing Wang, Youmin Wang, Deyu Yang
doaj +1 more source
Warpage deformation behavior of metal laminates
工程科学学报, 2021 The layered characteristics of the material in the thickness direction of the metal laminate make it more prone to uneven plastic extension during the thinning, rolling, flattening, and straightening process, resulting in plate-shaped warpage defects and
Chun-hai WANG +4 more
doaj +1 more source
Mathematics, 2022 As a vital component of electronic products, the quality of the printed circuit board (PCB) assembly directly affects the applications and service life. During the reflow soldering process, the PCB assembly may suffer excessive warpage.
Yu Guo +3 more
doaj +1 more source