Results 11 to 20 of about 4,969 (222)

Corneal Biomechanical Findings in Contact Lens Induced Corneal Warpage

open access: yesJournal of Ophthalmology, 2016
Purpose. To evaluate the difference in biomechanical properties between contact lens induced corneal warpage and normal and keratoconic eyes. Method. Prospective observational case control study, where 94 eyes of 47 warpage suspicious and 46 eyes of 23 ...
Fateme Alipour   +6 more
doaj   +2 more sources

Casting warpage study [PDF]

open access: yes, 1976
Because of a need to reduce warpage in investment castings, and because of reported success in the use of aqueous polyalkylene glycol solutions for reducing warpage in heat-treated sheet-metal parts, particularly for aluminum alloys, an experiment was designed to include these solutions along with polyethylene glycol solutions in a study of quenching ...
Patterson, E. P.
openaire   +3 more sources

Effect of Overmolding Injection Parameters on Warpage of PMMA-PC Composite Board

open access: yesCailiao gongcheng, 2018
The influence of overmolding injection parameters such as packing pressure, racking time, melt temperature, mold temperature and the injection speed on the warpage of PMMA-PC composite boards was investigated. The result shows that the warpage of PMMA-PC
SUN Qi-wei   +5 more
doaj   +2 more sources

INTERPRETATION OF WARPAGE SIMULATION RESULTS IN ASMI [PDF]

open access: yesApplied Computer Science, 2015
The article describes the problematic of interpretation of warpage simula-tion results in Autodesk Simulation Moldflow Insight. Warpage results are relatively easy to obtain from injection molding analysis, but the result in-terpretation demands higher ...
Ivan GAJDOŠ   +3 more
doaj   +1 more source

Residual stress analysis and warpage control of 0Cr17Ni7Al spring steel wire [PDF]

open access: yesJournal of Hebei University of Science and Technology
In order to solve the problem of residual stresses in the drawing process of 0Cr17Ni7Al spring steel wire and the rebound phenomenon after the wire curling, the effects of drawing process parameters on residual stresses and wire warpage were analyzed ...
Lei HUANG   +8 more
doaj   +2 more sources

Predictive ANN Modeling and Optimization of Injection Molding Parameters to Minimize Warpage in Polypropylene Rectangular Parts

open access: yesJournal of Manufacturing and Materials Processing
Injection molding is a fundamental process for transforming plastics into various industrial components. Among the critical aspects studied in this process, volumetric contraction and warpage of plastic parts are of particular importance.
Juan Luis Gámez   +4 more
doaj   +2 more sources

Warpage of rubber pressed composites [PDF]

open access: yes, 2002
The rubber pressing process is applied for the rapid production of thermoplastic composite products. However, rubber pressed products show geometrical distortions, such as warpage, due to process-induced residual stresses. It is believed that these stresses build up as a result of the large thermal gradients that are present during consolidation.
Wijskamp, Sebastiaan   +3 more
openaire   +2 more sources

Molded Part Warpage Optimization Using Inverse Contouring Method. [PDF]

open access: yesPolymers (Basel)
Warpage is among the most prevalent defects affecting injection molded parts. In this study, we aimed to develop methods to minimize warpage through mold design.
Godec D, Panđa F, Tujmer M, Monkova K.
europepmc   +2 more sources

Optimal Dummy Pattern Design Method for PWB Warpage Control Using the Human-Based Genetic Algorithm

open access: yesMicromachines, 2020
In this work, a method that minimizes printed wiring board (PWB) warpage by dummy pattern design is proposed. This work suggests that dummy patterns are placed on a preset discretized location in the PWB to reduce the warpage.
Sun Kyoung Kim, Sang-Hyuk Lee
doaj   +1 more source

Experimental study of panel level packaging warpage

open access: yes, 2022
S.634-637This paper presents an analysis on panel warpage as the growth of the panel exceeds beyond current wafer sizes. This work is a part of iNemi working group "Wafer/Panel Level Package Flowability and Warpage Project".
Fu, H.   +5 more
core   +1 more source

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