Results 31 to 40 of about 4,969 (222)

Experimental and Numerical Study Determining the Warpage Phenomenon of Thin-Wall Injection Molding

Advances in Polymer Technology, 2020
This study emphasizes the warpage phenomenon of thin-walled parts using acrylonitrile-butadiene styrene (ABS) plus polycarbonate (PC) plastics for optimal processing by thin-wall injection molding.
Yueh-Tzu Huang, Chiung-Fang Huang, Bou-Yue Peng, Chun-Wei Chang, Hsing-Chung Cheng, Yi Lin, Yung-Kang Shen, Hao Wang   +7 more
doaj   +1 more source

Global Optimization of Surface Warpage for Inverse Design of Ultra-Thin Electronic Packages Using Tensor Train Decomposition

IEEE Access, 2022
As laptops get thinner and thinner, the electronic packages that go into these devices must shrink along the $z$ -dimension as well. High warpage in these ultra-thin packages is the result of mismatch of coefficients of thermal expansion (CTE) between ...
Cheryl Selvanayagam, Pham Luu Trung Duong, Brett Wilkerson, Nagarajan Raghavan   +3 more
doaj   +1 more source

Designing Polymer Nanocomposites for X‐Ray Shielding: Mechanisms, Architectures, and Scalable Processing

Advanced Engineering Materials, EarlyView.
This review highlights advances in lightweight, lead‐free polymer nanocomposites for diagnostic X‐ray shielding. By linking filler chemistry, dispersion, architecture, and photon interaction mechanisms, it establishes structure–performance relationships guiding material design.
Aklilu G. Messele, Hossein Ipakchi, Tizazu H. Mekonnen   +2 more
wiley   +1 more source

Designable van der Waals Crystal for Artificial Neuronal Cell Mimicking

Advanced Materials, EarlyView.
Designable van der Waals crystal has been demonstrated for device‐scale neuronal cell mimicking. The structural similarity between ion‐channel in biological membranes and layered vdW lattices is realized with nano‐crystallization via Ar + H2S plasma sulfurization.
Jinhyoung Lee, Gunhyoung Kim, Dongho Lee, Seowoo Son, Hyunho Seok, Sihoon Son, Hyunbin Choi, Geonwook Kim, Geumji Back, Hyunkyu Kim, Chaerin Park, Junmin Ahn, Seongyun Je, Chaeyoung Im, Junil Cho, Magdalena Grzeszczyk, Seongho Kim, Eunseo Go, Hyunwoo Shim, Donghwan Choi, Muyoung Kim, Hyoeng‐U. Kim, Won‐Jun Jang, Taesung Kim   +23 more
wiley   +1 more source

Research on Warpage of Polystyrene in Selective Laser Sintering

, 2010
Warpage is a crucial factor to accuracy of sintering part in selective laser sintering (SLS) process. In this paper, The influence of process parameters on warpage when sintering polystyrene(PS) materials in SLS are investigated.
C.Y. Wang, X.X. Shen, Q. Dong
core   +1 more source

Support design of overhanging structure for laser powder bed fusion

Journal of Materials Research and Technology, 2023
Warpage deformation inevitably occurs when laser powder bed fusion (LPBF) is applied on an overhanging structure. An effective support added to the system can mitigate warpage and improve the accuracy of formed parts. Four types of support structures are
Gaolin Yang, Hejie Li, Zishan Li, Zhaoheng Zhu, Rong Liu, Qunli Zhang, Yunfeng Liu, Jianhua Yao   +7 more
doaj   +1 more source

Toward Knowledge‐Guided AI for Inverse Design in Manufacturing: A Perspective on Domain, Physics, and Human–AI Synergy

Advanced Intelligent Discovery, EarlyView.
This perspective highlights how knowledge‐guided artificial intelligence can address key challenges in manufacturing inverse design, including high‐dimensional search spaces, limited data, and process constraints. It focused on three complementary pillars—expert‐guided problem definition, physics‐informed machine learning, and large language model ...
Hugon Lee, Hyeonbin Moon, Junhyeong Lee, Seunghwa Ryu   +3 more
wiley   +1 more source

Numerical/Experimental Hybrid Approach to Predict Substrate Warpage [PDF]

, 2018
A hybrid approach is proposed to enhance warpage predictability of thin advanced substrates. Experimental warpage data of thin advanced substrates is first obtained under various conditions.
Kim, Byung Yub
core   +1 more source

Prediction of In‐Plane Shear Mechanical Properties Through Degree of Bonding Characterization as a Function of Automated Fiber Placement Processing Parameters for Carbon Fiber/PEKK Composite Laminates

Polymer Composites, EarlyView.
Graphical abstract demonstrating manufacturing process and property characterization used in process modelling of interlaminar behavior across the range of process parameters. ABSTRACT Automated Fiber Placement (AFP) of fiber‐reinforced thermoplastic tapes enables rapid manufacturing by leveraging precise robotic lamination and in situ consolidation ...
Abd‐Elrahman Korayem, Chandra Kishore Reddy Emani, Saratchandra Kundurthi, Karthik Venkatesan, Si Chen, Javed Mapkar, Mahmoodul Haq   +6 more
wiley   +1 more source

Deep Learning Study on Memory IC Package Warpage Using Deep Neural Network and Finite Element Simulation

Chips
In recent years, many electronic device industries have shown interest in using artificial intelligence (AI) to quickly estimate package warpage. Machine learning is one of the AI techniques which will give an express prediction on package warpage with ...
Sunil Kumar Panigrahy, Fa Xing Che, Yeow Chon Ong, Hong Wan Ng, Gokul Kumar   +4 more
doaj   +1 more source