Results 51 to 60 of about 4,969 (222)

Development and Characterization of ZnO‐Filled and Maleic Anhydride‐Compatibilized PP/SEBS Blends for 3D‐Printing Filaments

Journal of Applied Polymer Science, Volume 143, Issue 29, August 5, 2026.
PP/SEBS/MA/ZnO filaments produced by bench‐top single‐screw extrusion show refined morphology, increased crystallinity, improved thermal robustness, and preliminary FFF printability, demonstrating a practical route for functional filament development. ABSTRACT Currently, single‐screw extrusion offers a versatile and accessible route to produce polymer ...
Chiara das Dores do Nascimento, Cesar Aguzzoli, Everton Granemann Souza, Ana Cristina Beitia Kraemer Moraes, Fabricio Celso, Patricia Oliveira Schmitt, Lincoln Audrew Cordeiro, Fernanda Langone, Marlon Bender Bueno Rodrigues, Luana Vaz Tholozan, Neftali Lenin Villarreal Carreno, André Luiz Missio, Amanda Dantas de Oliveira   +12 more
wiley   +1 more source

Taguchi analysis of shrinkage and warpage of injection-moulded polypropylene/multiwall carbon nanotubes nanocomposites

eXPRESS Polymer Letters, 2009
This paper focuses on the effect of multi-walled carbon nanotube (MWNT) addition on shrinkage and warpage properties of polypropylene (PP) injection mouldings before and after annealing.
doaj   +1 more source

Investigation of Process Parameters, Gate Position and its Shape Effect on Dimensional Accuracy of Injected Plastic Part [PDF]

International Journal of Advanced Design and Manufacturing Technology, 2009
Injection molding is the most widely used process for producing plastic parts.In this process, an important issue is to predict and optimize the warpage before manufacturing.
Payman Shahi, AmirHosein Behravesh, Behrouz Arezou, Mehdi Mahmoudi   +3 more
doaj  

Simplified Movement Model to Predict the Thickness Distribution of Products Made by Robomould®

SPE Polymers, Volume 7, Issue 3, July 2026.
Simplified movement model uses robot movement and CAD geometry to compute powder‐mould contact time via counting the active nodes each timestep, predicting layer thickness distribution for Robomould and products. ABSTRACT Robotic rotational molding represents a major advancement over conventional techniques by integrating automation, electric heating ...
Jarne Vanherck, Mathijs Goris, Johan Potargent, Elke Deckers   +3 more
wiley   +1 more source

Mechanistic Optimization of Pressure Transmission for Defect Mitigation in Thick‐Walled Aerospace‐Grade Polyetherimide

SPE Polymers, Volume 7, Issue 3, July 2026.
Gate freeze time (GFT) controls internal void formation in thick‐walled injection‐molded polyetherimide (PEI). Extending GFT by optimizing cooling time and mold temperature reduces void size from the baseline (large voids) to an optimized condition (voids reduced), as confirmed by ultrasonic C‐scan inspection.
Chirag Thummar
wiley   +1 more source

Theoretical Model of Residual Stress and Warpage for Wire and Arc Additive Manufacturing Stiffened Panels

Metals, 2020
Wire and arc additive manufacturing of stiffened ribs for fabricating large integral panel components holds promise for lightweight construction, but stress and warpage remain intractable problems.
Haibin Geng, Jinglong Li, Jianjun Gao, Xin Lin   +3 more
doaj   +1 more source

Evaluation of Mechanical, Thermal, Rheological, and Biocompatibility Properties of Additively Manufactured Metal‐Reinforced Biocomposites Optimized by Reinforcement Ratios and Printing Parameters

Polymer Composites, Volume 47, Issue 11, Page 10258-10281, 10 June 2026.
Schematic illustration of PLA/316L stainless steel composite filament production via fused deposition modeling, demonstrating the trade‐off between stainless steel content, mechanical enhancement, and biocompatibility. ABSTRACT Polylactic acid (PLA) is a biodegradable thermoplastic widely used in biomedical devices; however, its inherent brittleness ...
İbrahim Baki Sahin, Bayram Sercan Bayram, Begum Pinarbasi, Pınar Yilgor, Berzah Yavuzyegit, İhsan Korkut   +5 more
wiley   +1 more source

Investigation of Transfer Mold Process Effects on Semiconductor Package Warpage

, 2009
In recent years, Package on Package (PoP) is increasingly used for high density package solutions. Generally the top package is a stacked memory packaging system connected to a bottom logic packaging system via solder joint: this is representative of PoP
Myung J. Yim, Ravi Kumar, Jason M. Brand
core   +1 more source

Process-Induced Warpage Behavior in Backside Power Delivery Network Fabrication

IEEE Journal of the Electron Devices Society
As semiconductor devices continue to scale, backside power delivery networks (BSPDNs) have emerged as a promising alternative to conventional front-side power delivery networks (FSPDNs), offering improved routing flexibility and power integrity. However,
Seong-Ji Min, Haeyong Park, Hyeong-Kyu Jin, Won-Chan Kim, Eun-Young Park, Sang-Pill Kim, Jun-Hyeok Lee, Sung Kyu Lim, Hyun-Yong Yu   +8 more
doaj   +1 more source

Cyclic Olefin Copolymers as Versatile Materials for Advanced Engineering Applications

Advanced Functional Materials, Volume 36, Issue 47, 11 June 2026.
Cyclic olefin copolymers (COCs) are presented as highly versatile materials combining tunable synthesis, excellent optical properties, and mechanical robustness. Their potential spans microfluidics, bioengineering, and advanced electronics, while emerging self‐healing and sustainable solutions highlight future opportunities.
Giulia Fredi, Norma Mallegni, Andrea Dorigato, Mario Milazzo   +3 more
wiley   +1 more source