Results 61 to 70 of about 4,969 (222)

Stress Analysis of the Interface Reaction Layer Between Ni–P Films and GaAs Substrate After Annealing

Electrochemistry
Electroless Ni–P plating films, used as the seed layers for the backside electrodes of gallium arsenide (GaAs) semiconductor devices, cause substrate warping (wafer warpage) during annealing, leading to substrate cracking and chipping.
Koichiro NISHIZAWA, Ayumu MATSUMOTO, Yasuyuki NAKAGAWA, Hitoshi SAKUMA, Yoshiki KOJIMA, Naoki FUKUMURO, Shinji YAE   +6 more
doaj   +1 more source

Two‐Phase Flow Simulations for Injection Molding Applications: Comparison between COMSOL Multiphysics and XNS In‐House Solver

Proceedings in Applied Mathematics and Mechanics, Volume 26, Issue 2, June 2026.
ABSTRACT Injection molding is a manufacturing process for plastic components where precise geometries and part properties, such as local strength and stiffness, are critical. The mold filling phase, during which the hot molten polymer is rapidly injected into the cooled mold cavity, presents significant simulation challenges due to steep temperature ...
Blanca Ferrer Fabón, Jonathan Alms, Marek Behr, Christian Hopmann   +3 more
wiley   +1 more source

Warpage minimisation on side arm using response surface methodology (RSM)

, 2021
Master of Science in Manufacturing Systems EngineeringCatheter manufacturing process requires the use of mould called side arm through latex dipping process.
Shazzuan, Shahari
core  

Effects of UV‐Thermal Exposure Sequence on the Compressive Performance of FDM‐Printed Polymers

Polymer Engineering &Science, Volume 66, Issue 6, Page 4107-4126, June 2026.
These findings establish aging sequence as a key design parameter for FDM polymers, enabling safer material selection and improved durability of load‐bearing printed components. ABSTRACT Ultraviolet (UV) radiation and elevated temperatures can alter the compressive performance of fused deposition modeled (FDM) polymers, but the combined effects, and ...
Eugene Anachebe, Naser A. Alsaleh, Hany Hassanin, Mahmoud A. El‐Sayed, Abdullah A. Elfar, Khamis Essa   +5 more
wiley   +1 more source

Thermal Aspects for Composite Structures - From Manufacturing to In-Service PredictionsI

, 2009
Manufacturing of composite structures with a high degree of dimensional accuracy remains a challenge in modern fabrication. Residual stresses in fibre reinforced laminates which develop during the autoclav processing lead to a variety of process ...
Spröwitz, T., Kappel, E., Huehne, Chr.
core  

The simulation of the warpage rule of the thin-walled part of polypropylene composite based on the coupling effect of mold deformation and injection molding process

Science and Engineering of Composite Materials, 2018
Aiming at the problem that a thin-walled plastic part easily produces warpage, an orthogonal experimental method was used for multiparameter coupling analysis, with mold structure parameters and injection molding process parameters considered ...
Zhang Jixiang, Yin Xiaoyi, Liu Fengzhi, Yang Pan   +3 more
doaj   +1 more source

Multilayer Cellulose Acetate–Viscose Films for Bio‐Based, Bio‐Degradable Packaging Applications

Packaging Technology and Science, Volume 39, Issue 6, Page 685-695, June 2026.
Cellulose acetate (CA) and cellulose foils stick together comprehensively after mild cellulose sodium hydroxide treatment and heated compression. For combined foils, water barrier properties correlate with CA thickness. Oxygen permeation suffers due to the sodium hydroxide pre‐treatment induced foil changes. The composite represents a biodegradable and
Florian Wurm, Anja Rosenzopf, Tung Pham, Thomas Bechtold   +3 more
wiley   +1 more source

Warpage of Powder Injection Molded Copper Structure

, 2019
Powder injection molding (PIM) is an advanced manufacturing technology with advantages including shape complexity, high production rate, and high physical/mechanical properties.
CHO, HANLYUN, PARK, JAE MAN, PARK, SEONG JIN, RHO, JUNSUK   +3 more
core   +1 more source

Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent Modeling Methodology With Sub-Modeling

IEEE Access, 2020
The coupled thermo-mechanical field analysis of three-dimensional (3D) stacked integrated circuits (ICs) is evaluated by an efficient and accurate simulation strategy that combines equivalent homogenization modeling methodology and sub-modeling technique.
Zhiqiang Cheng, Yingtao Ding, Ziyue Zhang, Mingrui Zhou, Zhiming Chen   +4 more
doaj   +1 more source

Trueness of the apical and middle root portion segments of 3D‐printed removable die and alveolar cast designs manufactured using stereolithographic 3D printing

Journal of Prosthodontics, Volume 35, Issue 5, Page 768-775, June 2026.
Abstract Purpose The present study evaluated the effects of the root portion design, segment (middle vs. apical), and part (die vs. cast) on the trueness of three‐dimensional (3D)‐printed removable die‐cast complex. Material and Methods The trueness of apical and middle segments of the root portion of 45 3D‐printed removable dies and casts with three ...
Francisco X. Azpiazu‐Flores, William M. Johnston, Dean Morton, Wei‐Shao Lin, Burak Yilmaz   +4 more
wiley   +1 more source