Results 81 to 90 of about 4,969 (222)

Substrate Warpage analysis During Solger Reflow Process

open access: yes, 2004
Organic substrate is a composite panel consists of several materials such as BT core, copper, dielectric, solder resist and plugging material. As different material has different material property, when the organic substrate is exposed to thermal ...
Beh, Keh Shin
core  

Warpage Prediction of RHCM Crystalline Parts Based on Multi-Layers

open access: yes, 2021
Warpage is a typical defect for injection-molded parts, especially for crystalline parts molded by rapid heat cycle molding (RHCM). In this paper, a prediction method is proposed for predicting the warpage of crystalline parts molded by the RHCM process.
Bida Zhou   +6 more
core   +1 more source

ANALYSIS OF SHRINKAGE AND WARPAGE ON FRONT PANEL HOUSING USING GENETIC ALGORITHM [PDF]

open access: yesEuropean Journal of Materials Science and Engineering, 2016
This study focuses on the optimisation of the injection moulding parameters to minimise the shrinkage and warpage on moulded parts using Autodesk Moldflow Insight (AMI) 2012 software.
Muhammad Ezuddin SHAFIEE   +4 more
doaj  

Interpretation of warpage simulation results in AMSI

open access: yes, 2015
The article describes the problematic of interpretation of warpage simulation results in Autodesk Simulation Moldflow Insight. Warpage results are relatively easy to obtain from injection molding analysis, but the result interpretation demands higher ...
Jachowicz, T.   +3 more
core  

Spring-in and Warpage — Progress in Simulating Manufacturing Aspects

open access: yesMechanics of Composite Materials, 2013
After demolding, plane structures made of fibrous polymer-matrix composites often show a warpage and, owing to spring-in angles, do not reach the designed shape. Considerable effort has been put into the development of methods for simulating the distortions in order to avoid them by countermeasures. Besides the empirical trial-and-error-based procedure,
Kappel, Erik   +3 more
openaire   +5 more sources

Optimization of the Manufacturing Process of Natural Fibre Thermoplastic Composites in order to Minimize Warpage [PDF]

open access: yesInternational Journal of Advanced Design and Manufacturing Technology, 2009
In this study, the effective factors on warpage in short fibre reinforced thermoplastic composites has been studied. First of all, the effective factors in manufacturing process were detected and then in order to decrease the number of experiments, the ...
Mahmoud Shokrieh, Saman Safari
doaj  

Simulation of Shrinkage and Warpage of Rotationally Moulded Polymer Parts

open access: yes, 2020
The rotomoulding industry is impeded by long manufacturing cycle times, due to insufficient time required for the materials to achieve a stable state on cooling. Thermal residual stresses are induced in rotomoulded parts due to uncontrolled heat transfer,
Menary, Gary   +4 more
core   +1 more source

Reduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compound

open access: yesMaterials & Design
Warpage in semiconductor packages is a critical issue that affects their reliability and performance. This study aims to minimize the warpage of a bi-material dummy package by optimizing the post-mold curing (PMC) temperature profile.
Hui-Jin Um   +4 more
doaj   +1 more source

WARPAGE ANALYSIS ON FRONT PANEL HOUSING USING RESPONSE SURFACE METHODOLOGY (RSM) [PDF]

open access: yesEuropean Journal of Materials Science and Engineering, 2016
The work reported herein is about a study to establish the best combination of injection moulding parameters in minimising warpage over a front panel housing using a simulation software.
Mohd Afiq HARUN   +3 more
doaj  

Warpage prediction of integrated circuits packages

open access: yes, 1997
Warpage is formed as a result of the thermal mismatch between the IC package components. The warpage problem becomes a critical issue particularly in large and thin packages such as thin quad flat package (TQFP).
Yeung, T. S
core  

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