Results 101 to 110 of about 4,969 (222)
Warpage in plastic packages: Effects of process conditions, geometry and materials
, 2003 The effects of several important parameters, including processing conditions, package geometry and materials, are specifically studied on the occurrence of warpage and coplanarity for a plastic package.
Kong, JWY, Kim, Jang Kyo, Yuen, MMF
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Warpage eliminated in copper-clad microwave circuit laminates
, 1967 Cryogenic treatment of laminated copper-clad microwave circuit boards eliminates stresses that cause warpage when a circuit is etched on one side of the board.
Boone, W. L., Jr.
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Warpage study of plastic endapsulated IC package
, 2000 This project is to study and optimize the warpage of IC packages using statistical analysis. Design of Experiment is used and experiments are carried out to identify the factors that have significant effect on the warpage of packages.
Gan, Swee Lee
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Next MaterialsPlastic injection molding is widely utilized for the production of a variety of plastic products. However, defects can arise during the production process due to incorrect settings of process parameters, which are crucial for ensuring the quality of the ...
Rozeena Aslam +4 more
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Warpage analysis of plastic ball grid array packages
, 1997 An analytical model is presented in this paper to study the warpage of plastic ball grid array (PBGA) packages subjected to uniform thermal loading. This model was derived from the classical laminated plate theory (CLPT).
Lee, Shi Wei Ricky
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Effect Of Injection Moulding Parameters On Warpage Deflection [PDF]
, 2015 Injection moulding is a process that can be characterised as their ability to produce high production rates with accurately product size and complex part shape.
Mohd Sani, Siti Salmah
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Polymers and Polymer CompositesFused filament fabrication (FFF) is commonly utilised for 3D printing of semi-crystalline polymers, i.e., polypropylene (PP), while warpage deformation can often be observed in the printed products, with significantly reduced surface quality and ...
Yuesheng Yu +3 more
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Investigation of warpage induced on molded strip of QFN package
, 2008 Warpage is known to be one of the primary molding issues during assembly of QFN package. It affects the package sawing process, and cause reliability issues.
Husna Zayadi
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Study on Residual Warpage with Curing Reaction of Epoxy Resin Caused in Viscoelasticity Laminated Body [PDF]
, 2010 application/pdfEpoxy resin is usually used as an encapsulation of electronic parts. Epoxy resin is transformed from liquid to solid by the chemical curing reaction, and then residual stress and warpage are generated in the electronic parts.
中村, 省三 +5 more
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Handbook of molded part shrinkage and warpage
, 2013 How easy life would be if only moldings were the same size and shape as the mold. But they never are, as molders, toolmakers, designers and end users know only too well.
Fischer, Jerry M.
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