Results 91 to 100 of about 4,969 (222)
Prediction of process-induced warpage in injection molded thermoplastics
, 1996 The main cause of warpage in injection moldings is the imbalance of the thermal residual stresses that are caused by a non-uniform temperature distribution through the thickness of the moldings resulting from variation in cross sections, part geometries,
S. Ozden +5 more
core +1 more source
MATEC Web of Conferences, 2017 Nowadays, there are various of optimisation methods that have been explored by many researchers to find the appropriate processing parameters setting for the injection moulding process.
Hazwan M.H.M. +4 more
doaj +1 more source
Effect of die configurations on warpage issues for QFN packages
, 2008 One of the latest developments in packaging technology is QFN (Quad Flat Non-lead) package. This paper describes a warpage study on a QFN package. The objectives of this study to investigate the warpage issues for QFN package with different die sizes. It
Husna Zayadi
core
The Prediction Method on Warpage of Injection Molded Parts
, 2011 Warpage is a common defect resulted from uneven thermal shrinkage during injection molding process. In this paper, the authors investigated finite element method to predict the warpage of injection moldings with thin shell theory.
Hong Yu Zhu +2 more
core +1 more source
, 2001 Wireless communication products require thinner and small packaging to allow for reductions in Cell Phone and PDA product sizes. Currently, the Film-BGA (Ball Grid Array) package is in production for thinner and small case. The Film-BGA package is a thin
Chen, Wen-Bin
core
AI-Based Prediction of Warpage in Organic Substrates
IEEE AccessIn substrate fabrication, thermal mismatch between materials and structural configurations can readily induce warpage deformation, which severely impacts subsequent chip mounting and solder joint alignment processes, ultimately compromising the ...
Jingyi Zhao, Meiying Su, Rui Ma
doaj +1 more source
Warpage in casting- A Review.pdf
, 2016 Foundry industries in developing countries suffer from poor quality and productivity due to involvement of number ofprocess parameter. Even in completely controlled process, defect in casting are observed and hence casting process is alsoknown as process of uncertainty which challenges explanation about the cause of casting defects.
openaire +1 more source
Viscoelastic analysis of IC package warpage
, 1996 Package warpage was studied previously using thermoelastic finite element analysis. Epoxy Molding Compound (EMC) was assumed to be thermal-elastic with temperature dependent mechanical properties (usually assigned values above and below the glass ...
Yuen, M. M.F., Yeung, T. S.
core
, 2017 The warpage orientation, which refers to the direction of maximum and minimum curvatures in a cylindrical warpage, was observed to have changed by flipping from a concave to a convex shape during thermal processing.
Lee, Tae-Ik +7 more
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Reduction of the residual warpage of fused deposition modeling by negative thermal expansion filler
Materials & DesignWe investigated the suppression of residual warpage using a negative thermal expansion (NTE) material filler, Zn1.6Mg0.4P2O7. To focus on the effect of thermal expansion on residual warpage, we used acrylonitrile-butadiene-styrene, which is an amorphous ...
Masaya Sakagami +3 more
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