Results 71 to 80 of about 4,969 (222)
Isolation process induced wafer warpage
, 1998 Wafer warpage behavior during a local oxidation of silicon isolation process was investigated. Anisotropic etching of the front side nitride produced unbalanced stress states between front and back side nitride films, and caused a large wafer warpage ...
Yeo, IS +4 more
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, 2022 This article investigates whether the extension–twist and bend–twist coupling performance of practically warpage-free laminates can be improved by layup hybridization (carbon/epoxy–glass/epoxy hybrids) compared to non-hybrid (mono) laminates.
Czigany, Tibor +3 more
core +1 more source
Stress control in trench field-plate power MOSFETs and its impact on on-resistance reduction
Power Electronic Devices and ComponentsThe limitations regarding lateral cell pitch narrowing and on-resistance reduction were investigated. Trench field plate MOSFETs feature deep trenches with thick oxide films.
Hiroaki Kato +2 more
doaj +1 more source
A study on matching of Si3N4 substrate for SiC module based on stress difference improvement
机车电传动, 2023 The rapid development of power semiconductor devices, especially the widespread application of SiC power modules, has put forward higher requirements for ceramic copper-coated substrate in modules, and the warpage of the substrate in module packaging ...
HUANG Shidong +4 more
doaj
Polymer Composites, Volume 47, Issue 9, Page 7909-7923, 10 May 2026.Fused Filament Fabrication and Recycling of Bio‐Based Polyamide 11 Reinforced With Recycled Short Carbon Fibers. Sample preparation, mechanical properties improvement after rCF addition and properties retainment after recycling. ABSTRACT This research investigates the fused filament fabrication (FFF) and recycling of bio‐based polyamide 11 (PA11 ...
Mirko Coser +2 more
wiley +1 more source
Rapid mold optimization based on ultraviolet curing 3D printing technology
Frontiers in MaterialsInjection molding is the most common method for making plastic products. However, quick molds made with ultraviolet (UV) curing 3D printing frequently employ photosensitive resins with low mechanical strength, rendering plastic components prone to ...
Hanyu Rao, Xinyu Bai, Wen Yan, Jie Liu
doaj +1 more source
Development of Liquid Compression Molding (LCM) Material for Low Warpage
, 2017 This paper reports on the study of flexible epoxy resin which lowers modulus to minimize warpage while maintaining high filler content. Liquid Compression Molding (LCM) material is an encapsulation material applied at the wafer level.
Tsuyoshi Kamimura +8 more
core +1 more source
Reducing Warpage In Stereolithography Through Novel Draw Styles
, 1994 A consistent problem with stereolithography has been part distortion and dimensional inaccuracies caused by resin shrinkage. Resin shrinkage and, thus, warpage occurs during the build process and during the postcure.
Murphy, John P. +4 more
core +1 more source
Reducing warpage in foldable OLED screens
, 2019 Organic light-emitting diode (OLED) screens are becoming popular in consumer devices due to the ability to fold such screens. However, repeated folding and unfolding is known to cause bending (warpage) at the fold.
Tseng, Chun, Tan, Wenli, Ou, Davis
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Warpage Prediction of Electronic Underfill Components During Curing
, 2021 To ensure the shelf life of a semiconductor, the integrated circuits are usually embedded in an epoxy molding compound (EMC) to shield it from stress and corrosion. The EMC is a viscoelastic material and is categorized as a thermoset.
Lindblom, David
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