Results 21 to 30 of about 4,969 (222)

Inverse Design for Low Warpage Ultra-Thin Packages Using Constrained Particle Swarm Optimization

open access: yesIEEE Access, 2021
Warpage of electronic packages is the result of mismatch in the coefficient of thermal expansion (CTE) between the silicon die (CTE = 2.6ppm/°C) and the substrate (CTE = 15–25 ppm/°C).
Cheryl Selvanayagam   +3 more
doaj   +1 more source

Stress warpage analysis of IGBT module package reflow soldering

open access: yesXi'an Gongcheng Daxue xuebao, 2021
In order to explore the impact of reflow soldering process on power device packaging, a 3D package model based on insulated gate bipolar transistor (IGBT) module was established using DesignModeler, and then ANSYS software was used to perform thermal ...
Lipeng TAN   +4 more
doaj   +1 more source

Warpage Behavior on Silicon Semiconductor Device: The Impact of Thick Copper Metallization

open access: yesApplied Sciences, 2021
Electrochemical deposited (ECD) thick film copper on silicon substrate is one of the most challenging technological brick for semiconductor industry representing a relevant improvement from the state of art because of its excellent electrical and thermal
Michele Calabretta   +3 more
doaj   +1 more source

Increase in Warpage Prediction Accuracy for Glass Filled Polyamide Material (PA66) through Integrative Simulation Approach

open access: yesASM Science Journal, 2021
The warpage prediction accuracy of the simulation software depends on part geometry, material model and methodology. However, the material model in the existing simulation software’s does not consider factors such as nonlinear mechanical properties ...
Vivek Ramdas Gaval   +3 more
doaj   +1 more source

Optimizing fused filament fabrication process parameters for quality enhancement of PA12 parts using numerical modeling and taguchi method

open access: yesHeliyon, 2023
Fused Filament Fabrication (FFF) is an Additive Manufacturing (AM) technique implemented in widespread applications and several components. Despite its benefits, the physics behind the FFF process is quite complicated and requires fast heating and ...
Hussein Alzyod, Peter Ficzere
doaj   +1 more source

Differentiating Keratoconus and Corneal Warpage by Analyzing Focal Change Patterns in Corneal Topography, Pachymetry, and Epithelial Thickness MapsDifferentiating Keratoconus and Corneal Warpage [PDF]

open access: yes, 2016
PurposeTo differentiate between keratoconus and contact lens-related corneal warpage by combining focal change patterns in anterior corneal topography, pachymetry, and epithelial thickness maps.MethodsPachymetry and epithelial thickness maps of normal ...
Louie, Derek J   +5 more
core   +1 more source

Simulation-Based Optimization of Injection Molding Process Parameters for Minimizing Warpage by ANN and GA

open access: yesInternational Journal of Technology, 2023
Plastic injection molding is one of the most used methods for producing plastic products because it can be produced at a high production rate, low cost, and ease in manufacturing. However, one defect that affects product quality is namely warpage.
Chiwapon Nitnara, Kumpon Tragangoon
doaj   +1 more source

Investigating Moisture Gradient-Induced Warpage of Veneers

open access: yes, 2021
Flatness of wood composite panels, such as Laminated Veneer Lumber, is often difficult to control during the manufacturing process. Out-of-plane deformation, or warpage, of wood veneers caused by changes in moisture content affects the ability to press ...
Strong, Kerrigan Ann
core  

Additive Manufacturing of Continuous Fibre Reinforced Composites: Process, Characterisation, Modelling, and Sustainability

open access: yesAdvanced Engineering Materials, EarlyView.
Additive manufacturing provides precise control over the placement of continuous fibres within polymer matrices, enabling customised mechanical performance in composite components. This article explores processing strategies, mechanical testing, and modelling approaches for additive manufactured continuous fibre‐reinforced composites.
Cherian Thomas, Amir Hosein Sakhaei
wiley   +1 more source

Viscoelastic Warpage and Stress Analysis in SIP Packaging: Numerical simulation and experimental validation

open access: yesResults in Engineering
In this study, we use Moldex3D warpage and stress analysis to predict strip warpage by focusing on the PMC process and applying three distinct material models to ensure simulation accuracy, since deformation under high-temperature loading is highly ...
Ting-Yu Lee   +4 more
doaj   +1 more source

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