Results 1 to 10 of about 15,046 (211)

Industrial Soldering Process Simulator

Applied Sciences, 2023
Determination of the physico-chemical interactions between liquid and solid substances is a key technological factor in many industrial processes in metallurgy, electronics or the aviation industry, where technological processes are based on soldering ...
Marcin Bąkała
doaj   +2 more sources

Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering

Journal of Materials Research and Technology
In this study, the properties of solder joints were compared after bonding process using different energy sources. Various soldering methods were employed, including reflow, laser, and Intense Pulsed Light (IPL) soldering.
Eun-Chae Noh, Seung-Boo Jung, Jeong-Won Yoon   +2 more
exaly   +3 more sources

Research of terminal soldering technology for auto glass heating systems [PDF]

E3S Web of Conferences, 2023
The paper considers the issues of technology for soldering a terminal (contactor) to auto-glass heating systems for cars, i.e. technology of soldering metal to non-metal bodies.
Abdurakhmonov Sultonali, Sayitov Shavkatjon, Mirzajonov Makhmud, Bilolov Inomjon, Khaydarov Abbos   +4 more
doaj   +1 more source

Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere

Journal of Advanced Joining Processes, 2022
In 3D packaging, an increase in the solder bump density and reductions in solder-bump height are the roadblocks to using gel or liquid fluxes for the soldering process.
Siliang He, Yuhao Bi, Yu-An Shen, Zhikuan Chen, Gao Yue, Chuan Hu, Hiroshi Nishikawa   +6 more
doaj   +1 more source

Cu3Sn joint based on transient liquid phase bonding of Cu@Cu6Sn5 core–shell particles

Scientific Reports, 2023
With the development of high-integration and high-power electronics, the lack of matching chip connecting materials that can withstand high temperatures has been a challenge. In this manuscript, a Cu@Cu6Sn5 core–shell bimetallic particles (approx.
Jintao Wang, Jianqiang Wang, Fangcheng Duan, Hongtao Chen   +3 more
doaj   +1 more source

Path Planning of Laser Soldering System Based on Intelligent Algorithm

Sensors, 2022
Laser soldering has been gradually applied to the soldering of electronic components due to the rapid development of microelectronics. However, it is inefficient to use a mechanical shaft to move a laser beam.
Cong Zhang, Zige Fan, Yaonan Dai, Hang Chen, Sikai Wang, Xubing Chen   +5 more
doaj   +1 more source

Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit

Micromachines, 2023
Laser soldering is a crucial soldering technique in the realm of electronic assembly. The temperature of the solder joint is intimately connected with the quality of the solder.
Mingchao Li, Pengbin Cao, Cong Zhang, Kuan Yan, Yuquan Zhang   +4 more
doaj   +1 more source

Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder

Crystals, 2020
In this study, soldering is conducted between a chip and a CLCC-3 shell base with a sheet-like AuGa0.03 alloy solder as the encapsulating material. X-ray images of chip soldering samples, XRD diffraction analysis of the joints, SEM images reflecting the ...
Zhihuan Zhao, Guanghao Gong, Mingming Jiang, Chuanzhong Chen, Yingyue Pan, Weili Liu, Li Zhang   +6 more
doaj   +1 more source

Influences of soldering time on wettability and intermetallic phase between Sn-3.0Cu solder and copper substrate [PDF]

MATEC Web of Conferences, 2018
In this paper, the influences of soldering time on the wettability and intermetallic phase between Sn-3.0Cu lead-free solder and copper substrate were investigated.
Mookam Niwat, Kanlayasiri Kannachai
doaj   +1 more source

Influence of Sn on Microstructure and Performance of Electric Vacuum Ag-Cu Filler Metal

Cailiao gongcheng, 2016
Influence of Sn on microstructure, melting characteristic and brazing performance of electric vacuum Ag-Cu filler metal was studied by using scanning electronic microscope (SEM) with energy disperse spectroscopy (EDS), differential scanning calorimetry ...
SHI Lei, CUI Liang, ZHOU Fei, GU Xiao-long, HE Peng   +4 more
doaj   +1 more source