Results 1 to 10 of about 7,646 (117)

Process Phase Estimation and Deviation Detection for Manual Soldering Based on Motion Analysis [PDF]

open access: yesBiomimetics
Manual soldering requires phase-dependent coordination of posture, hand movement, tool position, and visual attention. We propose a depth-camera framework that estimates the work phase and detects deviations using three-dimensional upper-body and hand ...
Kyohei Wakabayashi, Tetsuya Oda
doaj   +2 more sources

Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering

open access: yesJournal of Materials Research and Technology
In this study, the properties of solder joints were compared after bonding process using different energy sources. Various soldering methods were employed, including reflow, laser, and Intense Pulsed Light (IPL) soldering.
Jeong-Won Yoon   +2 more
exaly   +3 more sources

Sn–31Bi–19In alloy: A golden ratio design for exceptional elongation, high strength, and low-temperature soldering

open access: yesJournal of Materials Research and Technology
Advanced semiconductor packaging demands low-temperature soldering and high soldering strength to mitigate thermal warpage challenges. This study developed the mechanical, thermal, and soldering properties of a novel Sn–Bi–In low-temperature alloy (LTA),
Yu-An Shen
exaly   +3 more sources

Research of terminal soldering technology for auto glass heating systems [PDF]

open access: yesE3S Web of Conferences, 2023
The paper considers the issues of technology for soldering a terminal (contactor) to auto-glass heating systems for cars, i.e. technology of soldering metal to non-metal bodies.
Abdurakhmonov Sultonali   +4 more
doaj   +1 more source

Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere

open access: yesJournal of Advanced Joining Processes, 2022
In 3D packaging, an increase in the solder bump density and reductions in solder-bump height are the roadblocks to using gel or liquid fluxes for the soldering process.
Siliang He   +6 more
doaj   +1 more source

Cu3Sn joint based on transient liquid phase bonding of Cu@Cu6Sn5 core–shell particles

open access: yesScientific Reports, 2023
With the development of high-integration and high-power electronics, the lack of matching chip connecting materials that can withstand high temperatures has been a challenge. In this manuscript, a Cu@Cu6Sn5 core–shell bimetallic particles (approx.
Jintao Wang   +3 more
doaj   +1 more source

Path Planning of Laser Soldering System Based on Intelligent Algorithm

open access: yesSensors, 2022
Laser soldering has been gradually applied to the soldering of electronic components due to the rapid development of microelectronics. However, it is inefficient to use a mechanical shaft to move a laser beam.
Cong Zhang   +5 more
doaj   +1 more source

Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit

open access: yesMicromachines, 2023
Laser soldering is a crucial soldering technique in the realm of electronic assembly. The temperature of the solder joint is intimately connected with the quality of the solder.
Mingchao Li   +4 more
doaj   +1 more source

Industrial Soldering Process Simulator

open access: yesApplied Sciences, 2023
Determination of the physico-chemical interactions between liquid and solid substances is a key technological factor in many industrial processes in metallurgy, electronics or the aviation industry, where technological processes are based on soldering ...
Marcin Bąkała
doaj   +1 more source

Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder

open access: yesCrystals, 2020
In this study, soldering is conducted between a chip and a CLCC-3 shell base with a sheet-like AuGa0.03 alloy solder as the encapsulating material. X-ray images of chip soldering samples, XRD diffraction analysis of the joints, SEM images reflecting the ...
Zhihuan Zhao   +6 more
doaj   +1 more source

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