Results 31 to 40 of about 17,986 (235)
Advanced Functional Materials, EarlyView.ABSTRACT Chitosan, a polysaccharide upcycled from biowaste, has long promised sustainable, biocompatible, and antimicrobial films and devices, an appeal reinforced by its recent regulatory recognition, with several chitosan‐based antibacterial dressings gaining clearance through the Food and Drug Administration's 510(k) pathway.
Jacopo Nicoletti +16 more
wiley +1 more source
Amphoteric Cu‐Doping Leading to High Thermoelectric Performance in p‐Type Bismuth Antimony Telluride
Advanced Functional Materials, EarlyView.This study shows that Cu plays two opposite roles in p‐type Bi0.5Sb1.5Te3 depending on the processing route. Under thermodynamic‐equilibrium bulk‐synthesis, Cu mainly occupies cation sites, increases hole concentration, preserves mobility, and slightly reduces lattice heat transport. The best‐performing composition among the investigated series reaches
Moritz Thiem +15 more
wiley +1 more source
Materials & Design, 2022 Cu-based component/aluminum substrate solder joint is achieved through laser soldering technology in this paper. The solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum substrate laser soldering joint are
Peng-Cheng Huan +8 more
doaj +1 more source
Advanced Healthcare Materials, EarlyView.NeuroVisio SyncPatch integrates skin‐conformal electromyography (EMG) electrodes with camera‐tracked markers to jointly assess muscle activity and three‐dimensional knee kinematics during rehabilitation. Parallel feedback pathways provide real‐time kinematic guidance during movement and post‐trial neuromuscular feedback.
Bohyung Choi +11 more
wiley +1 more source
Sealing by soldering of microblock packages made of diamagnetic alloys using high-frequency heating
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2018 The main difficulties of application of high-frequency (HF) heating for sealing by soldering of microblock packages made of aluminum alloys is the low efficiency of heating, long processing time and considerable heating of the internal electronic module ...
V. L. Lanin, Yu. N. Grishchenko
doaj +1 more source
Stretchable Microelectrode Arrays for Electro‐Mechanical Probing of Brain Spheroids
Advanced Healthcare Materials, EarlyView.A multimodal device featuring kirigami‐patterned stretchable microelectrode arrays enables concurrent mechanical actuation and electrophysiological recording of brain spheroids. The platform supports multiple loading regimes and reveals mechanically induced modulation of spontaneous network activity in 3D neural tissue models.
Eleonora Martinelli +17 more
wiley +1 more source
Characterization and solderability of cold sprayed Sn-Cu coatings on Al and Cu substrates [PDF]
, 2010 Cold sprayed Sn-Cu coatings approximately 40 and 25 μm in average thickness were deposited on aluminium and direct bonded copper (DBC) substrates respectively.
Agyakwa, P. A. +5 more
core +1 more source
Leaftronics: Bio‐Fractal Scaffolds From Leaf Venation for Low‐Waste Electronics
Advanced Materials, EarlyView.“Leaftronics” transforms naturally evolved leaf venation into quasi‐fractal scaffolds for sustainable electronics. Polymer‐infiltrated leaf skeletons can be used to fabricate ultra‐smooth, reflow‐ and thin‐film‐compatible decomposable substrates, while making the same lignocellulose networks conducting results in flexible transparent electrodes.
Rakesh Rajendran Nair +3 more
wiley +1 more source
IEEE Access, 2021 In order to use mechanism model analysis instead of experimental test to control and adjust the temperature and oven temperature curve of each part of the integrated circuit board reflow oven to make it meet the process requirements, a fitting algorithm ...
Geng Ma, Xiaoqing Huang, Shihao Liu
doaj +1 more source
Radiative Thermal Management for Extreme Environments: Mechanisms and Design Strategies
Advanced Materials, EarlyView.In this review, we discuss the fundamental mechanisms of radiative cooling and solar heating, material and structural design strategies, hybrid approaches integrating additional heat transfer pathways, and durability‐oriented designs addressing environmental stresses.
Hyung Rae Kim +5 more
wiley +1 more source