Results 31 to 40 of about 15,046 (211)
Journal of Materials Research and TechnologyAdvanced semiconductor packaging demands low-temperature soldering and high soldering strength to mitigate thermal warpage challenges. This study developed the mechanical, thermal, and soldering properties of a novel Sn–Bi–In low-temperature alloy (LTA),
Yu-An Shen, Chih-Hsiang Liu, Hao-Zhe Kao
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, 1957 One of Its Monograph Series, The Industrial Atom.'' The joining of uranium to uranium has been done successfully using a number of commercial soft solders and fusible alloys.
Taub, J. M. +3 more
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Sealing by soldering of microblock packages made of diamagnetic alloys using high-frequency heating
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2018 The main difficulties of application of high-frequency (HF) heating for sealing by soldering of microblock packages made of aluminum alloys is the low efficiency of heating, long processing time and considerable heating of the internal electronic module ...
V. L. Lanin, Yu. N. Grishchenko
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IEEE Access, 2021 In order to use mechanism model analysis instead of experimental test to control and adjust the temperature and oven temperature curve of each part of the integrated circuit board reflow oven to make it meet the process requirements, a fitting algorithm ...
Geng Ma, Xiaoqing Huang, Shihao Liu
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Xibei Gongye Daxue XuebaoIn order to solve the problem that the selection of key process parameters of a flexible soldering robot depends on manual experience, the empirical model of its THT assembly process parameters is established with the response surface method and the ...
YU Tao +6 more
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Research of Joining Brittle Nonmetallic Materials with an Active Solder
Advances in Materials Science and Engineering, 2014 This paper deals with soldering high-purity brittle, nonmetallic materials such as SiO2, Si, and C (graphite). However, these materials exert poor wettability when using tin solder. Therefore, to reduce the wetting angle, an Sn solder alloyed with active
Roman Koleňák, Michal Prach
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Solder spread: A criterion for evaluation of soldering [PDF]
Gold Bulletin, 1990 Quantitative measurements of the intrinsic spread characteristics of solders used in electronics applications can be carried out by making use of the beneficial properties of gold.
Humpston, G., Jacobson, D. M.
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Analysis of Ball Soldering Parameters on the Properties of a BGA Packaged Semiconductor [PDF]
Materials Research, 2018 Integrated circuits have several applications, including medicine and the aerospace industry, where reliability is essential. Packaging is an important step in the manufacturing of integrated circuits, and ball soldering is one of the most critical ...
Dario G. Rosa +5 more
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Automation of a PCB Reflow Oven for Industry 4.0
Automation, 2023 With the rise of Industry 4.0, its pillars (which include Internet of Things, “Big Data”, data analytics, augmented reality, cybersecurity, etc.) have become unavoidable tendencies for the automated manufacturing industry.
Isaí Vilches +4 more
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EPJ PhotovoltaicsSoldering copper wires to the electrodes of solar cells is a crucial stage in the fabrication of silicon photovoltaic modules. Photovoltaic industries use infrared radiation for soldering because of its high throughput.
Joseph Daniel Christopher +6 more
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