Results 41 to 50 of about 17,986 (235)
In order to solve the problem that the selection of key process parameters of a flexible soldering robot depends on manual experience, the empirical model of its THT assembly process parameters is established with the response surface method and the ...
YU Tao +6 more
doaj +1 more source
Microfabrication of Soft Millirobots Propelled by Low Voltage Electrohydraulic Actuators
Manual layer‐by‐layer assembly is replaced by wafer‐level MEMS batch fabrication for compliant polymer‐based electrohydraulic actuators. The microfabricated devices integrate sacrificially defined microcavities, Parylene‐C‐sealed inlets, and multilayer polymer–metal films.
Shai Shmulevich +2 more
wiley +1 more source
Research of Joining Brittle Nonmetallic Materials with an Active Solder
This paper deals with soldering high-purity brittle, nonmetallic materials such as SiO2, Si, and C (graphite). However, these materials exert poor wettability when using tin solder. Therefore, to reduce the wetting angle, an Sn solder alloyed with active
Roman Koleňák, Michal Prach
doaj +1 more source
Microscale 3D‐Printed Digital Strain Switches for Embedded Mechanical Computation
Microscale 3D‐printed strain switches on flexible films convert deformation into native digital signals at geometry defined thresholds. A closed form model predicts switching from 3000 to 15 000 microstrain and is validated across 110 devices. Reliable ohmic closure and strain activated AND, OR, and XOR logic point toward low‐power mechanical ...
Regan Kubicek +3 more
wiley +1 more source
A magnetically reconfigurable airflow sensor integrated with an airway stent enables tunable sensitivity and dynamic sensing range. Airflow‐induced cantilever deformation generates resistance changes, while an external magnetic field modulates sensor stiffness, enhancing sensitivity at low airflow velocities and extending the sensing range at higher ...
Darren Wang +10 more
wiley +1 more source
Study on the reliability of novel Au–30Ga solder for high-temperature packaging
As a novel high-temperature solder with suitable eutectic temperature and excellent solderability, Au–30Ga eutectic alloy shows high application potential as a packaging material for high-power devices.
Han Liu +5 more
doaj +1 more source
Analysis of Ball Soldering Parameters on the Properties of a BGA Packaged Semiconductor [PDF]
Integrated circuits have several applications, including medicine and the aerospace industry, where reliability is essential. Packaging is an important step in the manufacturing of integrated circuits, and ball soldering is one of the most critical ...
Dario G. Rosa +5 more
doaj +1 more source
Differential Tissue‐Coupled Powering for Battery‐Free Injectable Electroceuticals
A thread‐like injectable neural stimulator is powered through differential tissue‐coupled powering (DTCP), which harvests RF‐frequency tissue potentials with an elongated receiver while preserving a injectable cross‐section. The system integrates an ASIC, stimulation electrodes, and a portable transmitter, enabling wireless peripheral nerve stimulation,
Han Wu +13 more
wiley +1 more source
Soldering copper wires to the electrodes of solar cells is a crucial stage in the fabrication of silicon photovoltaic modules. Photovoltaic industries use infrared radiation for soldering because of its high throughput.
Joseph Daniel Christopher +6 more
doaj +1 more source
Reactive nano-multilayers (RNMLs), which are able to undergo a self-heating exothermal reaction, can, e.g., be utilised as a local heat source for soldering or brazing.
Bastian Rheingans +6 more
doaj +1 more source

