Results 61 to 70 of about 17,986 (235)

Properties of Sn-Ag-Cu Solder Joints Prepared by Induction Heating

Advances in Materials Science and Engineering, 2020
In the present work, one near-eutectic and three hypoeutectic Sn-Ag-Cu alloys have been employed for soldering by induction heating. The alloys were produced by induction melting of high purity Ag, Cu, and Sn lumps. The melting behavior of the alloys was
Marian Drienovsky, Marián Palcut, Pavol Priputen, Eva Cuninková, Ondrej Bošák, Marián Kubliha, Lýdia Rízeková Trnková   +6 more
doaj   +1 more source

Adaptive Conductive Systems: Enabling Deformable Electronics Through Engineered Materials, Circuits, and Intelligent Systems

Advanced Science, EarlyView.
This review presents the research advances of adaptive conductive systems from the perspective of materials, circuits, systems, and applications. Deformable conductors consist of substrates/matrices and conductive materials, structural design of circuit interconnections, fabrication of circuit interconnections, as well as intelligent systems ...
Yufei Lu, Siyu Liang, Jingyi Niu, Jie Chen, Shuo Zhang, Hongjian Zhang, Dongsheng Jia, Wei Huang   +7 more
wiley   +1 more source

Research on Substrate Soldering of High-voltage IGBT Modules

Kongzhi Yu Xinxi Jishu, 2011
It is analyzed physical process and temperature characteristics of vacuum reflow soldering, and also summarized the influence of variables for vacuum reflow soldering process on the quality of IGBT substrate soldering through experiments analysis.
赵洪涛
doaj  

Local Surface Potential Modification of Few‐Layer MoS2 Via Optical Soldering Induced n‐Doping Process

Advanced Materials Interfaces
Local surface potential modification by defect structures in 2D transition metal dichalcogenide (2D‐TMDC) is of particular interest for engineering of their optoelectronic and surface chemical properties.
Daeho Kim, Hanwoong Choi, Dong Hyun Seo, Taewan Kim, ChaeHo Shin, Hyunwoo Kim   +5 more
doaj   +1 more source

Study of Titanium based Composite Coatings for Resistance against Molten Aluminium Soldering on H13 Tool Steel [PDF]

, 2011
The service life of industrial components is limited predominantly by chemical corrosion, mechanical failure or mechanical wear. In the aluminium high pressure die casting industry, liquid aluminium is extremely reactive with the constituents of H13 die ...
Salman, Asma Siddiq
core  

Achieving High‐Instantaneous Pulse Power in Contact‐Separation TENG via Series Capacitive Voltage Control Architecture

Advanced Science, EarlyView.
Conventional contact‐separation triboelectric nanogenerators generate high voltage but deliver limited power due to premature charge dissipation. Here, a capacitive charge reservoir architecture decouples charge accumulation from discharge triggering, enabling sequential voltage amplification via floating‐layer capacitive coupling.
Ajay Haridas CP, Prosenjit Das, Kinsuk Naskar, Titash Mondal   +3 more
wiley   +1 more source

Spatiotemporal Thermal Modulation and Patterning using a Programmable 1024 Element Microheater Array

Advanced Science, EarlyView.
Programmable microheater arrays are essential for a variety of applications. However, large arrays have thus far not been realized. We introduce a programmable 32×$\times$32 microheater array consisting of heating elements – each smaller than 300 μm$\umu{\rm m}$.
Rahul Goyal, Jang‐Hwan Han, Sadaf Pashapour, Peer Fischer   +3 more
wiley   +1 more source

Reflow Soldering Technology [PDF]

, 2010
Bakalářská práce se zabývá problematikou technologie pájení přetavením. V teoretické části se snaží seznámit s obecným principem pájení, významem použití tavidel, pájitelností povrchu, dále potom samotnou metodikou pájení přetavením, teplotním profilem a
Filáková, Denisa
core   +2 more sources

Soldering of Uranium [PDF]

, 1957
One of Its Monograph Series, The Industrial Atom.'' The joining of uranium to uranium has been done successfully using a number of commercial soft solders and fusible alloys.
Taub, J. M., Brundige, E. L., Doll, D. T., Hanks, G. S.   +3 more
core   +1 more source

Printing‐Assisted Integration of Thermal, Fluidic and Electrical Components in Implants for Focal Brain Cooling

Advanced Science, EarlyView.
Extrusion‐based 3D printing of silicones and discrete electronic components are combined to create cortical implants for rodents that integrate thermal neuromodulation and electrical recording. Linked to an autonomous auxiliary driver unit, the system enables rapid, stable and localized hypothermia alongside ECoG recording.
Spencer Ryan Moore, Naomi King, Aruã Clayton Da Silva, Clare Howarth, Jason Berwick, Thomas E. Paterson, Ivan R. Minev   +6 more
wiley   +1 more source