Results 81 to 90 of about 17,986 (235)
Advanced Electronic Materials, EarlyView.A compact resistively loaded metamaterial absorber captures RF energy at 2.4 GHz and directs most of the accepted power to modeled loads. The resonant response is confirmed experimentally for the fabricated absorber, while an impedance‐matched rectifier is evaluated through simulation. The stage‐wise results distinguish absorber, rectifier, and cascade
Md. Murad Kabir Nipun, Md. Jahedul Islam
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The Impact of Baseplate Bow on Vacuum Reflow Soldering
Kongzhi Yu Xinxi Jishu, 2011 The impact of IGBT baseplate bow on reflow soldering is analyzed. And the process parameters are adjusted to eliminate the influence of baseplate bow on soldering quality.
曾雄, 张泉
doaj
Harnessing the VO2 Phase Transition for Automatic Gain Control in Transimpedance Amplifiers
Advanced Electronic Materials, EarlyView.A nanoscale VO2‐based volatile switch integrated into a transimpedance‐amplifier feedback loop dynamically lowers gain when input current rises, preventing saturation and extending dynamic range. Rapid self‐recovery restores high sensitivity without external reset circuitry.
Amir Gildor +3 more
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Technological developments for high quality soldering and brazing
, 1985 SIGLEAvailable from British Library Document Supply Centre- DSC:87/09248(Technological) / BLDSC - British Library Document Supply CentreGBUnited ...
British Association for Brazing and Soldering (BABS), London (United Kingdom)
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Advanced Intelligent Discovery, EarlyView.This article implements a unified human digital twin framework that integrates cutting edge actuation, sensing, simulation, and bidirectional feedback capability. The approach includes integrating multimodal sensing, AI, and biomechanical simulation into one compact system.
Tajbeed Ahmed Chowdhury +4 more
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Joining in Microelectronics as an Open-System Problem: from Silicides to Direct Bonding
Успехи физики металловJoining processes in microelectronics are traditionally analysed within separate technological frameworks, including silicide formation, soldering, intermetallic growth, direct bonding, and reliability degradation.
S.O. Abakumov, Ch. Chen, and A.M. Gusak
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Mechanism of die soldering during aluminum die casting [PDF]
China Foundry, 2015 Soldering is a unique casting defect associated with die casting or metal mold casting of aluminum alloys. It occurs when molten aluminum sticks or solders the surface of the die steel and remains there after the ejection of the casting, causing a ...
Qing-you Han
doaj
Advanced Intelligent Systems, EarlyView.A hybrid mobile robot with a modular Variable‐Stiffness Bridge transitions between a rigid locomotion platform and a flexible, shape‐conforming body. By enclosing objects within its deformable structure rather than relying on dedicated end effectors, the robot achieves orientation‐regulated planar transport, with conformal contact quality shown to ...
Luiza Labazanova +5 more
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Single‐Step Analog In‐Memory Matrix Computation in Three‐Dimensional Circuits
Advanced Intelligent Systems, EarlyView.A wooden model illustrates a 3D memristive array designed for single‐step kernel convolutions. It shows how two‐dimensional input data are mapped into the 3D array and convolved in parallel with stored kernels. Color‐coded connection points represent programmed memory‐element values, with each color corresponding to a specific kernel weight.
Alireza Jaberi Rad +8 more
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Plasma assisted wave soldering
, 2022 S.690-697For many years, wave soldering has been used as a production technology in the electronics industry. A flux was always used to make soldering of devices and circuit boards possible.
Scheel, W.
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