Results 21 to 30 of about 17,986 (235)

EVALUATION OF SOLDERING RESISTANCE OF CrAlN COATINGS INTENDED FOR APPLICATION ON HIGH PRESSURE DIE CASTING TOOLS [PDF]

Proceedings on Engineering Sciences, 2019
During high-pressure die casting (HPDC) of aluminum alloys the tool surfaces are exposed to extreme conditions as high temperatures, molten metal impact at high velocities, high pressure, corrosive environment, alternate heating and cooling cycles and ...
Dragan KUKURUZOVIĆ, Pal TEREK, Lazar KOVAČEVIĆ, Branko ŠKORIĆ, Aleksandar MILETIĆ, Peter PANJAN , Miha ČEKADA   +6 more
doaj   +1 more source

Microstructural Evolution and Growth Morphology During Formation Process of Full Cu₃Sn Solder Joint in Microelectronic Packaging

Cailiao gongcheng, 2018
The full Cu3Sn solder joint has been widely used in 3D packaging gradually. 270℃ and 1N were chosen as soldering temperature and pressure respectively to fabricate solder joints under different soldering time in order to analyze the process of ...
LIANG Xiao-bo, LI Xiao-yan, YAO Peng, LI Yang, JIN Feng-yang   +4 more
doaj   +1 more source

Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling

Metals, 2020
In this work, we have investigated the role of high-energy ball milling (HEBM) on the evolution of microstructure, thermal, and wetting properties of an Sn-0.7Cu alloy.
Ashutosh Sharma, Min Chul Oh, Myoung Jin Chae, Hyungtak Seo, Byungmin Ahn   +4 more
doaj   +1 more source

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Journal of Materials Research and Technology, 2022
Formic acid (FA) atmosphere is promising to achieve chemical reduction at the oxidized surfaces of the solder and matrix material during soldering, replacing chemical flux being challenging as the continuous decrease in the pitch of solder bump in a ...
Siliang He, Yu-An Shen, Bifu Xiong, Fupeng Huo, Jiahui Li, Jinguo Ge, Zhiliang Pan, Wangyun Li, Chuan Hu, Hiroshi Nishikawa   +9 more
doaj   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

Advanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová, Markéta Klimtová, Mohd Faizul Mohd Sabri, Yew Hoong Wong, Petr Veselý, Martin Plaček, Karel Dušek   +6 more
wiley   +1 more source

The Effect of Laser and Conventional Soldering on the Tensile Strength of Co-Cr Frameworks Fabricated by Different Methods

Essentials of Dentistry
Background: This study aimed to evaluate the tensile strength of cobalt-chromium (Co-Cr) frameworks produced using different manufacturing methods (conventional casting, laser sintering, and computer-aided design and manufacturing [CAD/CAM]) and their ...
Kübra Yıldız Domaniç
doaj   +1 more source

Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination

Metals, 2020
The aim of the research was to characterize the soldering alloy type Zn–Al–Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate.
Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Babincova, Martin Sahul   +4 more
doaj   +1 more source

Laser‐Induced Graphene from Waste Almond Shells

Advanced Functional Materials, EarlyView.
Almond shells, an abundant agricultural by‐product, are repurposed to create a fully bioderived almond shell/chitosan composite (ASC) degradable in soil. ASC is converted into laser‐induced graphene (LIG) by laser scribing and proposed as a substrate for transient electronics.
Yulia Steksova, Anna Chiara Bressi, Marina Galliani, Attilio Marino, Gianni Ciofani, Eduardo Machado‐Charry, Hilda Gomez Bernal, Alessandra Francini, Luca Sebastiani, Francesco Greco   +9 more
wiley   +1 more source

Low temperature soldering technology based on superhydrophobic copper microlayer

Heliyon
Cu–Cu soldering is realized under certain pressure and low temperature conditions by using a surface silver film to modify the copper microlayer structure, thus solving the problems of high thermal stress and signal delay aggravation caused by high ...
Jin Xiao, Qian Zhai, Wei Cheng
doaj   +1 more source

Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor

SN Applied Sciences, 2021
This study investigated the effects of silver powder modification on intermetallic compound (IMC) formation and silver leaching during soldering at high temperatures.
Hsing-I Hsiang, Chih-Cheng Chen, Han-Yang Su   +2 more
doaj   +1 more source