Results 21 to 30 of about 15,046 (211)
Physics Letters B, 2007 In two dimensions the simple addition of two chiral bosons of opposite chiralities does not lead to a full massless scalar field. Similarly, in three dimensions the addition of two Maxwell-Chern-Simons fields of opposite helicities $\pm 1$ will not produce a parity invariant Maxwell-Proca theory.
Dalmazi, D., Dutra, Alvaro de Souza
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Cailiao gongcheng, 2018 The full Cu3Sn solder joint has been widely used in 3D packaging gradually. 270℃ and 1N were chosen as soldering temperature and pressure respectively to fabricate solder joints under different soldering time in order to analyze the process of ...
LIANG Xiao-bo +4 more
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Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere
Journal of Materials Research and Technology, 2022 Formic acid (FA) atmosphere is promising to achieve chemical reduction at the oxidized surfaces of the solder and matrix material during soldering, replacing chemical flux being challenging as the continuous decrease in the pitch of solder bump in a ...
Siliang He +9 more
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Metals, 2020 In this work, we have investigated the role of high-energy ball milling (HEBM) on the evolution of microstructure, thermal, and wetting properties of an Sn-0.7Cu alloy.
Ashutosh Sharma +4 more
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Materials & Design, 2022 Cu-based component/aluminum substrate solder joint is achieved through laser soldering technology in this paper. The solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum substrate laser soldering joint are
Peng-Cheng Huan +8 more
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Metals, 2020 The aim of the research was to characterize the soldering alloy type Zn–Al–Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate.
Roman Kolenak +4 more
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SN Applied Sciences, 2021 This study investigated the effects of silver powder modification on intermetallic compound (IMC) formation and silver leaching during soldering at high temperatures.
Hsing-I Hsiang +2 more
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Nanoshell assisted laser soldering of vascular tissue
, 2011 Laser tissue soldering (LTS) is a promising technique for tissue fusion but is limited by the lack of reproducibility particularly when the amount of indocyanine green (ICG) applied as energy absorber cannot be controlled during the soldering procedure ...
Uwe Pieles +17 more
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Low temperature soldering technology based on superhydrophobic copper microlayer
HeliyonCu–Cu soldering is realized under certain pressure and low temperature conditions by using a surface silver film to modify the copper microlayer structure, thus solving the problems of high thermal stress and signal delay aggravation caused by high ...
Jin Xiao, Qian Zhai, Wei Cheng
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Solderability of Solder-Coated Surfaces.
Circuit Technology, 1993 表面実装における微細パターン化に伴い, プリント配線板の前処理であるソルダコート (予備はんだ被膜) の薄膜化が要求されている。しかし, 薄いソルダコート表面では, はんだペーストとの濡れ性低下が問題となる。そこで, メニスコグラフ濡れ性試験, オージェ分光分析, X線マイクロアナライザにより, 薄いソルダコート表面でのはんだ濡れ性低下のメカニズムの解明と, 薄いソルダコート用はんだ材料について検討した。その結果以下のことが明らかとなった。母材からのCuの拡散によってCu-はんだ界面に生成するCu-Sn金属間化合物ははんだ表面まで成長し, 表面に露出した化合物中の過剰なCuが酸化することによって, 薄いソルダコート表面でのはんだ濡れ性が低下する。ソルダコート用共晶はんだ浴に0.3wt%のCu添加は,
SAKUYAMA, Seiki +3 more
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