Results 11 to 20 of about 15,046 (211)
Robot-based resistance soldering of optical components
, 2022 S.112-119Purpose - Laser systems are becoming more and more a commodity in many fields of application and this is driving a strong trend towards increasingly efficient production technologies and miniaturized products.
Gatej, A. +3 more
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Pottery Clay: An Aid to Stabilize the Metal Components During Soldering
Journal of Indian Orthodontic Society, 2021 Lack of stabilization of metal components during soldering is the most common problem encountered in orthodontic lab work. Metal components tend to slip or change from their actual position during soldering.
RSVM Raghu Ram +2 more
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Sensors, 2022 The combination of flexible-printed substrates and conventional electronics leads to flexible hybrid electronics. When fabrics are used as flexible substrates, two kinds of problems arise.
Rocío Silvestre +5 more
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Joining of Electrodes to Ultra-Thin Metallic Layers on Ceramic Substrates in Cryogenic Sensors
Sensors, 2021 Microjoining technologies are crucial for producing reliable electrical connections in modern microelectronic and optoelectronic devices, as well as for the assembly of electronic circuits, sensors, and batteries.
Marcin Lebioda +2 more
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Characterization and solderability of cold sprayed Sn-Cu coatings on Al and Cu substrates [PDF]
, 2010 Cold sprayed Sn-Cu coatings approximately 40 and 25 μm in average thickness were deposited on aluminium and direct bonded copper (DBC) substrates respectively.
Agyakwa, P. A. +5 more
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Comparative study of Through-Hole Soldering processes [PDF]
Journal of Electrical and Electronics Engineering, 2021 Throug-Hole soldering technologies are continuously used and improved because electronic circuit manufacturers want to satisfy their customers' requirements by delivering the required amount of electronic products in the shortest possible time.
DRĂGHICIU Nicolae
doaj
Influence of temperature on the soldering process of CLCC-3 package components using AuSn20 solder
AIP Advances, 2020 In this study, a CLCC-3 shell and a cover were connected via soldering with AuSn20 as the solder. An Au–Sn eutectic reaction occurred during the sealing process. At high soldering temperatures, only the eutectic ζ′-Au5Sn and δ-AuSn phases remained.
Zhihuan Zhao +8 more
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EVALUATION OF SOLDERING RESISTANCE OF CrAlN COATINGS INTENDED FOR APPLICATION ON HIGH PRESSURE DIE CASTING TOOLS [PDF]
Proceedings on Engineering Sciences, 2019 During high-pressure die casting (HPDC) of aluminum alloys the tool surfaces are exposed to extreme conditions as high temperatures, molten metal impact at high velocities, high pressure, corrosive environment, alternate heating and cooling cycles and ...
Dragan KUKURUZOVIĆ +6 more
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The Comparison of Silver and Laser Soldering Techniques on Periodontal Tissues: A Preliminary Study [PDF]
, 2014 Objective:The aim of this study was to compare the inflammatory effects of conventional and laser soldering methods on periodontal tissues in orthodontics.Materials and Method:Forty specimens were acquired from 10 patients whose treatment plan consisted ...
Cenk Ahmet Akcan +5 more
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, 2012 The purpose of this paper is to apply the developed systematic mechanical design methodologies, that are obtained in part I, to investigate their success in designing mechanics of a flexible printed circuit board assembly (PCBA) rework cell. The decision
Geren N., Bayramoğlu M., Sarıgül Ç.
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