Results 81 to 90 of about 1,501 (219)
Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering
, 2003 In this project, the effects of oxygen concentration on solder joint during reflow soldering are studied.
Chung, Chee Key
core
The application of IR thermography to process monitoring and control of reflow soldering
, 1998 This paper describes a technique for the monitoring and control of the reflow soldering process. The technique combines state‐of‐the‐art infra‐red (IR) sensor technology, coupled with application‐specific process monitoring and control software ...
Michelle Wilkinson +3 more
core +1 more source
CB-35 Low-Cost Reflow Soldering: Repurposing a Toaster Oven for Reflow Soldering
This project presents the design and implementation of a reflow oven controller system to convert a standard toaster oven into a functional reflow soldering oven.
Ojo, Stephen A, Mullikin, Benjamin C
core
Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering
, 2009 Evaluating silver paste strength for die bonding during the reflow soldering process is important, as silver paste fracturing is one of the main causes of package failure.
Nobuya Koike +4 more
core +1 more source
Design Of Reflow Soldering Station For Reballing Of Bga Packages
This article deals with the design of a soldering oven for BGA reballing in a nitrogen atmosphere. The principles of reflow soldering, the advantages of a nitrogen atmosphere regarding the quality of solder joints and the types of soldering devices are ...
Janiš, Adam
core +1 more source
Simulation of Heat Transfer in a Reflow Soldering Oven with Air and Nitrogen Injection,"
, 1995 Reflow soldering with nitrogen injection is simulated.
M T Hyun, Y S Son, T L Bergman
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Study of the effect of latent heat in reflow soldering
, 2015 Práce se zabývá studiem vlivu latentního tepla u pájení přetavením různých pájecích slitin na různých vzorcích. Výsledkem měření jsou teplotní profily pájecích slitin, které se poté vyhodnotí.
Zahradník Vít
core
Effect Of Temperature On Flexible Printed Circuit Board During Reflow Soldering Process [PDF]
, 2018 High demands on flexibility, lighter weight, thinner size and low cost electronic product had increases the application of Flexible Printed Circuit Board (FPCB) over Rigid Printed Circuit Board (RPCB).
Muhammad Rafiq, Mohammad Sabri
core
CFD Modeling the Cooling Stage of Reflow Soldering Process
, 2016 Reflow soldering is one of the most widespread soldering technologies used in the electronics industry. It is a method of attaching surface components to a circuit board with solder paste. The goal of the reflow process is to melt the solder and heat the
Ricardo F. Oliveira +11 more
core +1 more source