Results 81 to 90 of about 102,570 (230)

Modelling thermal behavior of surface mounted components during reflow soldering [PDF]

open access: yes, 2009
Nowadays reflow soldering is the most widespread technology used for electrical and mechanical attachment of surface mount devices (SMDs) to printed wiring boards (PWBs).
Sinkovics, Bálint, Harsányi, Gábor
core   +1 more source

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

open access: yesMaterials & Design, 2019
Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process ...
Yu-An Shen   +6 more
doaj   +1 more source

CB-35 Low-Cost Reflow Soldering: Repurposing a Toaster Oven for Reflow Soldering

open access: yes
This project presents the design and implementation of a reflow oven controller system to convert a standard toaster oven into a functional reflow soldering oven.
Ojo, Stephen A, Mullikin, Benjamin C
core   +1 more source

Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation

open access: yesCrystals
In this study, intense pulsed light (IPL) soldering was employed on Sn-58Bi solder pastes with two distinct particle sizes (T3: 25–45 μm and T9: 1–8 μm) to investigate the correlation between the solder microstructure and mechanical properties as a ...
Hyeri Go   +3 more
doaj   +1 more source

FLATPACK REFLOW SOLDERING. [PDF]

open access: yes, 1970
Bowlen, D. W., Hollingsworth, E.
openaire   +2 more sources

Improving efficiency of vapour phase soldering ovens with pressure and temperature-based process monitoring

open access: yesCase Studies in Thermal Engineering
During vapour phase reflow soldering used in electronics manufacturing, the process control of ovens is usually based on temperature measurements, which can be insufficient due to the saturation differences in the temperature and the vapour concentration.
Gergő Havellant   +3 more
doaj   +1 more source

Tin fog effect analysis during fluxless soldering under reflow with formic acid: Methodology, mechanism, and reliability impact

open access: yesJournal of Materials Research and Technology
Fluxless tin soldering eliminates flux residues but introduces tin fog, which affects the reliability of electronic packaging. The influence of tin fog was first analyzed through the shear strength of the Al wires bonded on DBC substrates. After aging at
Liangzheng Ji   +7 more
doaj   +1 more source

Vapour phase reflow soldering with vertical assembly stacking to improve productivity

open access: yesResults in Engineering
During vapour phase soldering, the lateral size of the specimen tray determines the number of assemblies that can be soldered at once. Our research aimed to find out how we can increase the productivity of an industrial-grade oven, improve the technology
Gergő Havellant   +5 more
doaj   +1 more source

Solder Selection of Lead-Free Reflow Soldering and Optimization of Craft Curve

open access: yes, 2011
Lead-free reflow soldering craft is the most important solder craft in surface mount technology at present. However, the great reduction of crafting window brings challenges to the soldering quality and also poses higher requirement for the stability and
Wan Gang Wang, Yong Peng
core   +1 more source

Study Of Quality And Reliability Of Welding Process Reflow Component Technology BGA

open access: yesITEGAM-JETIA, 2015
In recent years many efforts have been expended by companies in the search for technological improvement of its products by adding features such as light weight, reduced size and high levels of performance at the lowest cost, to meet a worldwide demand ...
Robson Marques Costa
doaj  

Home - About - Disclaimer - Privacy