Results 91 to 100 of about 1,501 (219)

Improving efficiency of vapour phase soldering ovens with pressure and temperature-based process monitoring

Case Studies in Thermal Engineering
During vapour phase reflow soldering used in electronics manufacturing, the process control of ovens is usually based on temperature measurements, which can be insufficient due to the saturation differences in the temperature and the vapour concentration.
Gergő Havellant, Balázs Illés, David Bušek, Attila Géczy   +3 more
doaj   +1 more source

SOLDERING CHARACTERISTICS AND THERMO- MECHANICAL PROPERTIES OF Pb-FREE SOLDER PASTE FOR REFLOW SOLDERING

, 2019
A deep understanding in thermal characteristics of lead-free solder paste grades is one of the most crucial factors when dealing with reflow soldering process.
Saad, Abdullah Aziz, Samsudin, Zambri, Abdullah, M.Z., Saad, A.A, Mohammed Zulkifly, Abdullah, Che Ani, F., Samsudin, Z., Ali Mokhtar, Mohd Najib, Najib, A.M., Che Ani, Fakhrozi   +9 more
core  

Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering [PDF]

, 2019
Consumer electronics market is one of the fastest growing markets in the world. Flip chip (FC) technology is one of the technologies for interconnecting semiconductor devices, and with the demand for shrinking in footprint of electronic packages, FC ...
Chong, Jia Jun
core  

Tin fog effect analysis during fluxless soldering under reflow with formic acid: Methodology, mechanism, and reliability impact

Journal of Materials Research and Technology
Fluxless tin soldering eliminates flux residues but introduces tin fog, which affects the reliability of electronic packaging. The influence of tin fog was first analyzed through the shear strength of the Al wires bonded on DBC substrates. After aging at
Liangzheng Ji, Xinyue Wang, Wenting Liu, Xin Wang, Wenwu Guo, Guoqi Zhang, Jing Zhang, Pan Liu   +7 more
doaj   +1 more source

Sistemática para implantação da garantia da qualidade em empresas montadoras de placas de circuito impresso [PDF]

, 2004
Dissertação (mestrado) - Universidade Federal de Santa Catarina, Centro Tecnológico.
Doro, Marcos Marinovic
core  

Vapour phase reflow soldering with vertical assembly stacking to improve productivity

Results in Engineering
During vapour phase soldering, the lateral size of the specimen tray determines the number of assemblies that can be soldered at once. Our research aimed to find out how we can increase the productivity of an industrial-grade oven, improve the technology
Gergő Havellant, Balázs Illés, Patrik Kovács, David Bušek, Karel Dušek, Attila Géczy   +5 more
doaj   +1 more source

Solder Reflow Failures in Electronic Components During Manual Soldering

, 2008
This viewgraph presentation reviews the solder reflow failures in electronic components that occur during manual soldering. It discusses the specifics of manual-soldering-induced failures in plastic devices with internal solder joints.
Felt, Frederick, Greenwell, Chris, Teverovsky, Alexander   +2 more
core  

Influences on the reflow soldering process by components with specific thermal properties

, 2013
Purpose – The purpose of the paper is to focus on the research into components with specific thermal properties and their influences on the reflow soldering process. Design/methodology/approach – After a brief introduction, the paper gives an overview of
Kozic, Denis, Franke, Jörg, Schuessler, Florian   +2 more
core  

Reliable and robust integration of SAW strain sensor through reflow soldering

International audienceSurface Acoustic Wave (SAW) sensors represent a prominent technological avenue for quantifying mechanical stress-induced deformations.
Viard, R., Tounzi, A., Matar, O. Bou, Tiercelin, N., Benabou, A., Maurice, V., Dusch, Y., Laloy, D., Marbouh, Othmane, Talbi, A., Mazzamurro, A., Ettihir, K., Pernod, P.   +12 more
core   +1 more source

Latent heat dissipation in printed circuit boards for reflow soldering

, 2022
Tato diplomová práce se zaměřuje na matematický model disipace skupenského tepla na desce plošného spoje při pájení přetavením. Teoretická část práce je rozdělena do tří tematických okruhů.
Dominika Dusíková
core