Results 111 to 120 of about 102,570 (230)

Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. [PDF]

J Mater Sci
Hsieh CL, Coyle RJ, Xian JW, Gourlay CM.
europepmc   +1 more source

Soldering and Bonding in Contemporary Electronic Device Packaging. [PDF]

Materials (Basel)
Li Y, Pan B, Ge Z, Chen P, Bi B, Yi X, Wu C, Wang C.   +7 more
europepmc   +1 more source

Bump-Fabrication Technologies for Micro-LED Display: A Review. [PDF]

Materials (Basel)
Wu X, Zhu X, Wang S, Tang X, Lang T, Belyaev V, Abduev A, Kazak A, Lin C, Yan Q, Sun J.   +10 more
europepmc   +1 more source

Effect of Surface Finish on Electromigration Reliability of Line-Type Sn-3.0Ag-0.5Cu Solder Joints. [PDF]

Materials (Basel)
Meng S, Huang M.
europepmc   +1 more source

Underfill: A Review of Reliability Improvement Methods in Electronics Production. [PDF]

Polymers (Basel)
Plachý Z, Pražanová A, Dušek K, Géczy A.   +3 more
europepmc   +1 more source

Infrared Reflow Soldering Technology.

Journal of Japan Institute of Electronics Packaging, 1999
openaire   +2 more sources

Sintering for High Power Optoelectronic Devices. [PDF]

Micromachines (Basel)
Schwan H, Mohan N, Schmid M, Saha RK, Klassen H, Müller K, Elger G.   +6 more
europepmc   +1 more source

Cam Design and Pin Defect Detection of Cam Pin Insertion Machine in IGBT Packaging. [PDF]

Micromachines (Basel)
Tian W, Zhang P, Tian M, Chen S, Ji H, Ma B.   +5 more
europepmc   +1 more source

Packaging Design and Thermal Characterization of 3D Double-Sided Cooling Automotive SiC Power Modules with Reliable Junction Temperature Sensing. [PDF]

Sensors (Basel)
Li C, Lin T, Guo X, Wang R, Chen Y, Zhou S.   +5 more
europepmc   +1 more source

Tuning intermetallic growth and flexural performance in gallium-based amalgams via Sn/In alloying and solidifying at controlled temperature. [PDF]

Sci Rep
Elliott P, Noori H, Huang H.
europepmc   +1 more source