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Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering [PDF]

open access: yes
The laser has been utilized as a alternative heat source for the soldering process because of its unique properties such as localized heating, rapid rise and fall in temperature, non-contact heating and easily automated process. However, there is limited
Iwata, Noriya   +2 more
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Reflow soldering in an oxidant atmosphere

open access: yes, 2015
Reflow soldering process is the most used process in industry to solder the Printed Circuit Boards (PCBs). To ensure a good solder joint reliability, this process are normally made under an inert atmosphere like Nitrogen (N2), in order to reduce soldering defects.
openaire   +1 more source

Numerical Analysis of Lead Free Solder Ball During Reflow Process

open access: yes, 2014
Bachelor of Engineering Technology in Mechanical (Automotive)Reflow soldering is one of the most significant factors in development of surface mount technology (SMT), especially toward the lead-free and miniaturization of the advanced ball grid array ...
Mohamad Faris bin Misbah
core  

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