Thermal/Mechanical Characteristics Simulation Analysis of Solder Layer Damage in IGBT Modules. [PDF]
Micromachines (Basel)Zhou J, Chen J, He L, Tang H, Wu X.
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Applications and Recent Advances of Low-Temperature Multicomponent Solders in Electronic Packaging: A Review. [PDF]
Micromachines (Basel)Wu G +4 more
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Strategies for decarbonizing printed circuit board supply chain. [PDF]
iScienceNegi S, Rani A, Pan SY.
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Reproducible testing for embedded BCIs: a demultiplexing PCB and acquisition system for EEG signal emulation. [PDF]
HardwareXEnériz D +3 more
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Analysis of Grain Growth Behavior of Intermetallic Compounds on Plated Pure Sn for Micropump Solder Caps. [PDF]
Materials (Basel)Park HS +6 more
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Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity. [PDF]
Polymers (Basel)Sung YC +6 more
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Simulation of Mechanical Stresses in BaTiO3 Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models. [PDF]
Materials (Basel)Yuile A, Wiss E, Barth D, Wiese S.
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Fast solid-phase bonding based on indium film-modified copper crystal structure. [PDF]
Sci RepJin X +5 more
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Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste. [PDF]
Nano ConvergJu YM +5 more
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A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation. [PDF]
Materials (Basel)Sorokina K, Dušek K, Bušek D.
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