Results 121 to 130 of about 1,501 (219)

Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling. [PDF]

J Mater Sci Mater Electron
Hsieh CL, Coyle RJ, Belyakov SA, Xian JW, Gourlay CM.   +4 more
europepmc   +1 more source

OpenMCT: an open-source DC motor control educational kit. [PDF]

HardwareX
Von Chong A, Vargas S, Duhé JF, Cárdenas D.   +3 more
europepmc   +1 more source

Enhanced Fringing Field Micro-Moisture Sensor with Elements Optimization. [PDF]

Micromachines (Basel)
Meng X, Li C, Lan Y, Tan L, Zhang X.
europepmc   +1 more source

Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications. [PDF]

Micromachines (Basel)
Werum K, Eberhardt W, Reenaers D, Mager T, Endl M, Zimmermann A, Deferme W.   +6 more
europepmc   +1 more source

Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. [PDF]

J Mater Sci
Hsieh CL, Coyle RJ, Xian JW, Gourlay CM.
europepmc   +1 more source

A low-cost and robust microscope hardware trigger interface board. [PDF]

HardwareX
Walker LA, Michki SN, Li Y, Cai D.
europepmc   +1 more source

Soldering and Bonding in Contemporary Electronic Device Packaging. [PDF]

Materials (Basel)
Li Y, Pan B, Ge Z, Chen P, Bi B, Yi X, Wu C, Wang C.   +7 more
europepmc   +1 more source

Bump-Fabrication Technologies for Micro-LED Display: A Review. [PDF]

Materials (Basel)
Wu X, Zhu X, Wang S, Tang X, Lang T, Belyaev V, Abduev A, Kazak A, Lin C, Yan Q, Sun J.   +10 more
europepmc   +1 more source

Cam Design and Pin Defect Detection of Cam Pin Insertion Machine in IGBT Packaging. [PDF]

Micromachines (Basel)
Tian W, Zhang P, Tian M, Chen S, Ji H, Ma B.   +5 more
europepmc   +1 more source

Underfill: A Review of Reliability Improvement Methods in Electronics Production. [PDF]

Polymers (Basel)
Plachý Z, Pražanová A, Dušek K, Géczy A.   +3 more
europepmc   +1 more source