Results 131 to 140 of about 1,501 (219)

Infrared Reflow Soldering Technology.

Journal of Japan Institute of Electronics Packaging, 1999
openaire   +2 more sources

Sintering for High Power Optoelectronic Devices. [PDF]

Micromachines (Basel)
Schwan H, Mohan N, Schmid M, Saha RK, Klassen H, Müller K, Elger G.   +6 more
europepmc   +1 more source

Applications and Recent Advances of Low-Temperature Multicomponent Solders in Electronic Packaging: A Review. [PDF]

Micromachines (Basel)
Wu G, Shen J, Zhou D, Khairi Faiz M, Wong YH.   +4 more
europepmc   +1 more source

Strategies for decarbonizing printed circuit board supply chain. [PDF]

iScience
Negi S, Rani A, Pan SY.
europepmc   +1 more source

Reproducible testing for embedded BCIs: a demultiplexing PCB and acquisition system for EEG signal emulation. [PDF]

HardwareX
Enériz D, Antolín D, Medrano N, Calvo B.   +3 more
europepmc   +1 more source

Analysis of Grain Growth Behavior of Intermetallic Compounds on Plated Pure Sn for Micropump Solder Caps. [PDF]

Materials (Basel)
Park HS, Na CY, Kim JW, Jung WS, Park JH, Lim JW, Yang YG.   +6 more
europepmc   +1 more source

Numerical simulation of the reflow soldering process

, 2015
The work developed in this thesis is inserted in a large project involving the University of Minho and the Bosch Car Multimedia, in which it is intended to create a numerical model capable of simulate the Reflow soldering process. Thus, during this thesis will be given a small contribution to the creation of this model by continuing the work already ...
openaire   +1 more source

Ultrasonic-assisted soldering of 7075 Al alloy joint using Ni mesh reinforced SAC305 composite solder: microstructure, bonding ratio, and mechanical properties. [PDF]

Ultrason Sonochem
Li D, Xiao Y, Zhang Y, Zhao Y, Zhang J, Luo D.   +5 more
europepmc   +1 more source

Protocol to design and implement scalable wireless network system for high-throughput, automated behavioral and circuit neuroscience in mice. [PDF]

STAR Protoc
Kim CY, Parker KE, Jeong EY, Han D, Jang Y, Joo SY, Lee J, Chiangchaisakunthai C, Qazi R, Chung J, Ha S, Jeong JW, McCall JG.   +12 more
europepmc   +1 more source

Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity. [PDF]

Polymers (Basel)
Sung YC, Hu CP, Hwang SJ, Shih MH, Liao WH, Zeng YJ, Tsai CT.   +6 more
europepmc   +1 more source