Results 131 to 140 of about 102,570 (230)

Ultrasonic-assisted soldering of 7075 Al alloy joint using Ni mesh reinforced SAC305 composite solder: microstructure, bonding ratio, and mechanical properties. [PDF]

Ultrason Sonochem
Li D, Xiao Y, Zhang Y, Zhao Y, Zhang J, Luo D.   +5 more
europepmc   +1 more source

Diffusion Barrier Performance of Ni-W Layer at Sn/Cu Interfacial Reaction. [PDF]

Materials (Basel)
Yao J, Li C, Shang M, Chen X, Wang Y, Ma H, Ma H, Liu X.   +7 more
europepmc   +1 more source

Protocol to design and implement scalable wireless network system for high-throughput, automated behavioral and circuit neuroscience in mice. [PDF]

STAR Protoc
Kim CY, Parker KE, Jeong EY, Han D, Jang Y, Joo SY, Lee J, Chiangchaisakunthai C, Qazi R, Chung J, Ha S, Jeong JW, McCall JG.   +12 more
europepmc   +1 more source

Advanced Electronic Packaging Technologies: A Comparative Review of Architectures, Applications, Reliability. [PDF]

Micromachines (Basel)
Huang Y, Wang D, Li Q, Pan Z.
europepmc   +1 more source

Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint. [PDF]

Polymers (Basel)
Zhang P, Xue S, Liu L, Wang J, Tatsumi H, Nishikawa H.   +5 more
europepmc   +1 more source

Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders. [PDF]

Materials (Basel)
Lv X, Zhang C, Liu Y, Pan Z, Wang Z, Sun F.   +5 more
europepmc   +1 more source

Ceramic-to-metal bonding using rare-earth containing Sn-Bi solder. [PDF]

J Mater Sci Mater Electron
Feng T, Pati B, Chung KM, Pei Y, Chen R.
europepmc   +1 more source

Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature. [PDF]

Materials (Basel)
He S, Jiang J, Shen YA, Mo L, Bi Y, Wu J, Guo C.   +6 more
europepmc   +1 more source

Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish. [PDF]

Materials (Basel)
Jeyeselan L, Mhd Noor EE.
europepmc   +1 more source

Heterogeneous integration of micro-LEDs via multiple simultaneous transfer and bonding. [PDF]

Microsyst Nanoeng
Joo J, Choi GM, Lee C, Jang KS, Oh JH, Eom YS, Choi KS, Um BJ, Bae BS, Shin J.   +9 more
europepmc   +1 more source