Diffusion Barrier Performance of Ni-W Layer at Sn/Cu Interfacial Reaction. [PDF]
Yao J +7 more
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Ceramic-to-metal bonding using rare-earth containing Sn-Bi solder. [PDF]
Feng T, Pati B, Chung KM, Pei Y, Chen R.
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High output power low temperature polysilicon thin-film transistor boost converters for large-area sensor and actuator applications. [PDF]
Velazquez Lopez M +4 more
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Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature. [PDF]
He S +6 more
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Tailored-Reflectivity Microstructures for Measuring Signal Sensitivity of Optical Coherence Tomography Medical Imaging Systems. [PDF]
Fitzgerald DM +7 more
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Protocol for contactless electric current sensing, processing, and storage using a drone-integrable sensor. [PDF]
Osmani K, Schulz D.
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Leaftronics: Natural lignocellulose scaffolds for sustainable electronics. [PDF]
Nair RR +10 more
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Interfacial Behavior During Reactions Between Sn and Electroplated Co-Zn Alloys. [PDF]
Wang CH, Lin CY.
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Impact of Bonding Pressure on the Reactive Bonding of LTCC Substrates. [PDF]
Wiss E, Jaziri N, Müller J, Wiese S.
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PCB Electronic Component Soldering Defect Detection Using YOLO11 Improved by Retention Block and Neck Structure. [PDF]
Xu Y, Wu H, Liu Y, Zhang X.
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