Results 151 to 160 of about 102,570 (230)
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On reflow soldering process and reflow profile
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012In order to obtain good welding quality, some influencing factors of reflow soldering process were studied in this research. A series of welding experiments were conducted in a small reflow soldering oven. Oxidation and surface treatment of soldering materials are important factors in the welding process.
Xulong Gui +3 more
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Solders, Solderable Finishes and Reflowed Solder Coatings
Circuit World, 1977In the production of printed circuit assemblies, the demand for higher reliability levels has increased over the years. In order to achieve a high level of soldering quality, it is essential that solderability is built into the system at all stages and various factors must be taken into account.
M.L. Ackroyd, C.A. MacKay
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Electronic Components and Technology Conference, 2020
High-performance computing and data center demands for complex form factor solid state drives (SSD) are driving the use of thinner electronic components and double-sided printed circuit board (PCB) in the assembly process. The use of thinner and multiple
C. Lau +3 more
semanticscholar +1 more source
High-performance computing and data center demands for complex form factor solid state drives (SSD) are driving the use of thinner electronic components and double-sided printed circuit board (PCB) in the assembly process. The use of thinner and multiple
C. Lau +3 more
semanticscholar +1 more source
Simulation, Optimization and Experimental Verification of the Over–Pressure Reflow Soldering Process
Procedia CIRP, 2017 The advanced technologies for electronics production and convection based soldering technologies are growing steadily. The enhanced reflow soldering oven with an integrated hyper pneumatic module ensures a void-free solder connection, but it requires ...
Jörg Franke +2 more
exaly +2 more sources
Mechanical reliability of self-aligned chip assembly after reflow soldering process
, 2020Purpose This paper focuses on the reliability of the solder joint after the self-alignment phenomenon during reflow soldering. The aim of this study is to analyse the joint quality of the self-alignment assemblies of SnAg alloy solder joints with ...
Mohd Najib Ali Mokhtar +3 more
semanticscholar +1 more source
Solder Reflow Method and Reflow Temperature Profile
Pan Pacific Symposium, 1999ABSTRACT The major cause of integrated circuit package failure mechanisms such as delamination, internal cracking or popcorning is package saturation with moisture and subsequent exposure to high temperature during the solder reflow process.
Yizhe Elisa Huang +3 more
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The reliability of reflow soldering by hot air reflow
Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, 2003The reliability of a solder joint produced on an FR-4 substrate by hot air reflow soldering in SMT (surface mount technology) was investigated. The hot air reflow method is shown to make the temperature of the mounted components and substrate equal to the ambient temperature and does not greatly damage components.
Y. Kojima +3 more
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Implementation the SoC of PCB Reflow Soldering
2019 16th International Joint Conference on Computer Science and Software Engineering (JCSSE), 2019This paper presents a PID temperature control system for the soldering, printed circuit board. By using a thermocouple to measure the temperature inside the oven And processing the signal using a microcontroller to calculate the difference between the set value and the current output value, To reduce errors to a minimum In order to control the infrared
Thanat Sooknuan +4 more
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On-Demand Webinars, 2020
ABSTRACT This webinar is based on the solder reflow fundamentals class and reflow section of the Jump Start Program that has been presented at SMTAI in Rosemont, IL. It is designed for the new SMT engineers/technicians or current engineers that want a better understanding of the reflow process. It discusses recipes vs.
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ABSTRACT This webinar is based on the solder reflow fundamentals class and reflow section of the Jump Start Program that has been presented at SMTAI in Rosemont, IL. It is designed for the new SMT engineers/technicians or current engineers that want a better understanding of the reflow process. It discusses recipes vs.
openaire +1 more source