Results 171 to 180 of about 102,570 (230)
Some of the next articles are maybe not open access.
A comparative study of laser soldering and reflow soldering using Sn–58Bi solder/Cu joints
Journal of materials science. Materials in electronics, 2023M. Jeong +3 more
semanticscholar +1 more source
Simulation of temperature profiles in reflow ovens for soldering area array components
European Microelectronics and Packaging Conference, 2019This paper presents computational fluid dynamics (CFD) simulations in the field of electronics manufacturing technology of area array components, namely a BGA, where the calculation of temperatures within the solder joint during a reflow soldering ...
A. Yuile, Steffen Wiese
semanticscholar +1 more source
Laser reflow soldering of film capacitors
ICALEO '83: Proceedings of the Materials Processing Symposium, 1983Manufacture of miniature film capacitor now utilizes three laser based processes. Paper highlights a CO2 laser used to reflow solder 30,000 capacitor elements to terminal frames each hour of operation. Also described is a YAG laser which demetallizes capacitor’s aluminized polyester films during winding and a CO2 laser marking system.
W. J. Fanning, Edward A. Metzbower
openaire +1 more source
A review on numerical approach of reflow soldering process for copper pillar technology
The International Journal of Advanced Manufacturing Technology, 2022J. Lee +3 more
semanticscholar +1 more source
Important Issues in Reflow Soldering
Soldering & Surface Mount Technology, 1994For reflow soldering in today's changing component and soldering technology, requirements with respect to profiling seem to be difficult to determine and even harder to meet. State‐of‐the‐art reflow trackers can be of help here, but, without some knowledge of the fundamentals in profiling, it will be easy to misunderstand measurements.
openaire +1 more source
Thermal limits in reflow soldering process
53rd Electronic Components and Technology Conference, 2003. Proceedings., 2004One of critical stage of surface assembly process is the thermal process that determines the phase changing of junction material (the solder paste or conductive adhesive). The equipment that does this treatment can transfer heat to assembly by convection, infrared radiation, or both. Each ones the dominant heat transfer inside the reflow oven, for some
P. Svasta, D. Simion-Zanescu
openaire +1 more source
SMTA International, 2015
Printed circuit boards (PCB) used in the consumer electronic products such as smart phones, tablets and mobile client personal computers are commonly assembled by reflow soldering with lead-free SnAgCu (SAC) solder pastes with peak relow temperature in
Olivia H. Chen +5 more
semanticscholar +1 more source
Printed circuit boards (PCB) used in the consumer electronic products such as smart phones, tablets and mobile client personal computers are commonly assembled by reflow soldering with lead-free SnAgCu (SAC) solder pastes with peak relow temperature in
Olivia H. Chen +5 more
semanticscholar +1 more source
Journal of materials science. Materials in electronics, 2022
Yulong Li +4 more
semanticscholar +1 more source
Yulong Li +4 more
semanticscholar +1 more source
Soldering & Surface Mount Technology, 2002
Solder paste printing and reflow are well established processes for producing solder joints in electronic assemblies. Solder paste consists of a dense suspension of solder particles in a liquid medium (vehicle) that acts as an oxide reducing agent (flux) during reflow, cleaning the metal surfaces of oxides.
openaire +1 more source
Solder paste printing and reflow are well established processes for producing solder joints in electronic assemblies. Solder paste consists of a dense suspension of solder particles in a liquid medium (vehicle) that acts as an oxide reducing agent (flux) during reflow, cleaning the metal surfaces of oxides.
openaire +1 more source
Modeling the Reflow Soldering Process in PCB’s
Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, 2015In the present work two different types of case studies are modelled, carried out involving the fusing of a material using the CFD (Computational Fluid Dynamics) software Ansys Fluent, using the VOF method (Volume of Fluid) to capture the position of the existing interfaces and the Solidification/melting method which uses an enthalpy-porosity approach ...
João Costa +7 more
openaire +1 more source