Results 171 to 180 of about 1,501 (219)
Some of the next articles are maybe not open access.
On-Demand Webinars, 2020
ABSTRACT This webinar is based on the solder reflow fundamentals class and reflow section of the Jump Start Program that has been presented at SMTAI in Rosemont, IL. It is designed for the new SMT engineers/technicians or current engineers that want a better understanding of the reflow process. It discusses recipes vs.
openaire +1 more source
ABSTRACT This webinar is based on the solder reflow fundamentals class and reflow section of the Jump Start Program that has been presented at SMTAI in Rosemont, IL. It is designed for the new SMT engineers/technicians or current engineers that want a better understanding of the reflow process. It discusses recipes vs.
openaire +1 more source
A simplified reflow soldering process model
Pan Pacific Symposium, 2002ABSTRACT Previously reported models of temperature development during the reflow soldering process have generally used commercially available, general purpose, finite difference (FD) or computational fluid dynamics (CFD) modelling tools to create detailed representations of both the product and the reflow furnace.
openaire +1 more source
Soldering & Surface Mount Technology, 1995
The resin activators' type and quantity in a solder paste have a significant effect on reflow behaviour. These interact with the effects of the oxygen content of the reflow atmosphere and the condition of the surfaces to be joined. While these parameters might be expected to influence solder paste reflow behaviour, more subtle effects related to the ...
M. Warwick, B.S. Chowdhary, N. Stanton
openaire +1 more source
The resin activators' type and quantity in a solder paste have a significant effect on reflow behaviour. These interact with the effects of the oxygen content of the reflow atmosphere and the condition of the surfaces to be joined. While these parameters might be expected to influence solder paste reflow behaviour, more subtle effects related to the ...
M. Warwick, B.S. Chowdhary, N. Stanton
openaire +1 more source
Use of Nitrogen in Reflow Soldering
Soldering & Surface Mount Technology, 1993Several effects of the atmosphere in the soldering oven on both the soldering process itself and the soldering results are discussed. Experiments have been undertaken to compare the results of soldering in air and in nitrogen containing 10,100 and 1000 ppm oxygen, in which, e.g., discolouration, wettability, solderability after reflow, solder bridging ...
R.J. Klein Wassink +2 more
openaire +1 more source
The Future of Solder Paste Printing for SMT Reflow Soldering
Soldering & Surface Mount Technology, 1993The use of fine‐pitch SMD devices has increased the need for accurate and consistent solder paste deposits for reflow soldering. Continued miniaturisation in PCB and SMD lead sizes is presenting the user, paste supplier and print equipment manufacturer with paste printing challenges.
E.K. Lo +3 more
openaire +1 more source
Nitrogen in Reflow Soldering of Lead-Free Solders
2007 8th Siberian Russian Workshop and Tutorial on Electron Devices and Materials, 2007Due to environmental and health demands for lead contamination, there is increasing pressure in legislation and a growing market demand to eliminate toxic materials. Lead-free soldering for the electronic industry is becoming a global trend, and several alloy systems alternatives have been recommended.
openaire +1 more source
Void formation during reflow soldering
2012 IEEE 62nd Electronic Components and Technology Conference, 2012In the present study the interaction between solder paste and the PCB surface finish and its impact on void formation was investigated. Therefore, a comprehensive set of tests was performed on test vehicles with different diameter of the solder powder, solder alloy composition, PCB surface finish and flux chemistry.
Thomas D. Ewald +2 more
openaire +1 more source
Numerical Simulation of Reflow Soldering
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019To guarantee a high level of solder joint durability for soft solder die attach, a uniform bond line thickness is crucial. In addition, for high electrical performance, a low void concentration is desirable. However, these goals are difficult to achieve during reflow soldering.
openaire +1 more source
Soldering & Surface Mount Technology, 2002
Solder paste printing and reflow are well established processes for producing solder joints in electronic assemblies. Solder paste consists of a dense suspension of solder particles in a liquid medium (vehicle) that acts as an oxide reducing agent (flux) during reflow, cleaning the metal surfaces of oxides.
openaire +1 more source
Solder paste printing and reflow are well established processes for producing solder joints in electronic assemblies. Solder paste consists of a dense suspension of solder particles in a liquid medium (vehicle) that acts as an oxide reducing agent (flux) during reflow, cleaning the metal surfaces of oxides.
openaire +1 more source
Thermal limits in reflow soldering process
53rd Electronic Components and Technology Conference, 2003. Proceedings., 2004One of critical stage of surface assembly process is the thermal process that determines the phase changing of junction material (the solder paste or conductive adhesive). The equipment that does this treatment can transfer heat to assembly by convection, infrared radiation, or both. Each ones the dominant heat transfer inside the reflow oven, for some
P. Svasta, D. Simion-Zanescu
openaire +1 more source