Results 191 to 200 of about 1,501 (219)
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Characteristics of porosity in solder pastes during infrared reflow soldering
Journal of Materials Science, 1995The effects of solder pastes and infrared reflow temperature profiles on the characteristics of porosity in solder joints are described. Porosity in solder joints can be detected by X-ray radiography. It was found that the composition and structure of solder pastes had the most significant effect on pore formation. However, a lower metal content and/or
Y. C. Chan, D. J. Xie, J. K. L. Lai
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A Comparison of Laser Types for Reflow Soldering
Soldering & Surface Mount Technology, 1992The increasing complexity of microelectronic devices and the advent of surface mount technology has led to interest in alternatives to mass reflow soldering techniques. One method with advantages for rapid automation and minimal heat input, is laser soldering.
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Warping model of high-power IGBT modules subjected to reflow soldering process
International Journal of Mechanical Sciences, 2023Shang Gao, Renke Kang
exaly
Reflow and Electrical Characteristics of Nanoscale Solder
Small, 2006Zhiyong, Gu +4 more
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59‐2: Laser Reflow Soldering Technique for Mini/MicroLed Displays
Digest of Technical Papers SID International Symposium, 2021Haiwei Sun
exaly
Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
Microelectronics International, 2003Bob Willis
exaly +2 more sources