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FEM Simulation of cracks in MLCC during reflow soldering
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2017Joseph Al Ahmar, S. Wiese
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Reflow soldering system for combined convection soldering and condensation soldering
2021openaire +2 more sources
International Conference on Electronic Packaging Technology, 2016
Mengying Tan +5 more
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Mengying Tan +5 more
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Temperature prediction for system in package assembly during the reflow soldering process
, 2016Shang-Shiuan Deng +2 more
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Reflow soldering optimization by using adaptive Kriging-HDMR method
, 2016Liming Chen, Enying Li, Hu Wang
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