Results 181 to 190 of about 1,501 (219)

Important Issues in Reflow Soldering

Soldering & Surface Mount Technology, 1994
For reflow soldering in today's changing component and soldering technology, requirements with respect to profiling seem to be difficult to determine and even harder to meet. State‐of‐the‐art reflow trackers can be of help here, but, without some knowledge of the fundamentals in profiling, it will be easy to misunderstand measurements.
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Effect of Reflow Parameters on Solder Wetting

2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 2003
Reflow parameters during assembly are ramp rate, soak time, soak temperature, peak temperature, time above liquidus, and cooling rate. These reflow parameters constructs the temperature profile of reflow process and determine the quality of interconnects in the electronics products.
Suk Chae Kang, Daniel F. Baldwin
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Components' emissivity in reflow soldering process

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004
Thermal processes encountered in surface mount assembly are very complex. Transferring heat between hot source (reflow oven) to assembly (printed circuit board, components and interconnecting alloy) is done through well known possibilities: convection, infrared radiation, conduction and phase changing.
P. Svasta, D. Simion-Zanescu, R. Ionescu
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Laser reflow soldering of film capacitors

ICALEO '83: Proceedings of the Materials Processing Symposium, 1983
Manufacture of miniature film capacitor now utilizes three laser based processes. Paper highlights a CO2 laser used to reflow solder 30,000 capacitor elements to terminal frames each hour of operation. Also described is a YAG laser which demetallizes capacitor’s aluminized polyester films during winding and a CO2 laser marking system.
W. J. Fanning, Edward A. Metzbower
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Solder Paste for No Clean Reflow

Soldering & Surface Mount Technology, 1993
This article describes a low‐cost approach to the search for alternatives to CFC cleaners. In this approach the cleaning and soldering cycles are combined under nitrogen. The effects of inerted reflow are reviewed and quantified. A no‐clean solder paste to take advantage of the inert atmosphere is described and compared with conventional formulations ...
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Modeling the Reflow Soldering Process in PCB’s

Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, 2015
In the present work two different types of case studies are modelled, carried out involving the fusing of a material using the CFD (Computational Fluid Dynamics) software Ansys Fluent, using the VOF method (Volume of Fluid) to capture the position of the existing interfaces and the Solidification/melting method which uses an enthalpy-porosity approach ...
João Costa, Delfim Soares, Senhorinha F. Teixeira, Fátima Cerqueira, Francisco Macedo, Nelson Rodrigues, Luis Ribas, José Carlos Teixeira   +7 more
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Dissolution of Cu into Sn-based solders during reflow soldering

Metals and Materials International, 2003
Cu contents in pure Sn and Sn-37Pb solders were measured as a function of reflowing time. The results indicated that the contents are significantly higher than that of the Cu solubility limit in each solder. Several plausible causes for the excess dissolution of Cu into the solders were explored with experimental observations.
Jong-Hyun Lee, Dong-Hyuk Shin, Yong-Seog Kim   +2 more
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Flux Spatter During Reflow Soldering

Regional Events, 2011
ABSTRACT The RoHS in the recent years have effectively limited the use of Sn/Pb alloy for use in electronics assembly applications. Of the various candidates to replace the Sn/Pb alloys, the most popular alloy is the Sn/3.0-Ag/0.5Cu (SAC305) alloy. The effects of material properties such as flux chemistry, powder size and also process
Kevin Tan, Casey Ng, Dennis Lim
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Reflow soldering evaluation of lead free solder alloys

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93), 2002
A quantitative dynamic solder wettability measurement was used to evaluate the effects of reflow processing on the wettability parameters associated with the nonlead bearing solders 96.5% Sn/3.5% Ag and 58% Bi/42% Sn. An experimental design approach employing full factorial experiments was formulated to investigate the solder wetting dependence of the ...
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Continuous Wetiability Measurement for Solder Reflow

MRS Proceedings, 1991
AbstractA quantitative dynamic solder wettability mesurement technique was utilized to evaluate the effects of reflow processing on the wettability parameters associated with solder ball alloys. This technique enables the examination of the final degree of solder wetting and the continuous monitoring of wetting as a function of time during the reflow ...
Cynthia M. Melton, Susan M. Yarling, Carl J. Raleigh   +2 more
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