Results 181 to 190 of about 102,570 (230)
Some of the next articles are maybe not open access.
Solder Paste for No Clean Reflow
Soldering & Surface Mount Technology, 1993This article describes a low‐cost approach to the search for alternatives to CFC cleaners. In this approach the cleaning and soldering cycles are combined under nitrogen. The effects of inerted reflow are reviewed and quantified. A no‐clean solder paste to take advantage of the inert atmosphere is described and compared with conventional formulations ...
openaire +1 more source
Vacuum Reflow Process Characterization for Void-Less Soldering Process in Semiconductor Package
International Electronics Manufacturing Technology Symposium, 2018Semiconductor packaging's solder void criteria is getting tighter overtime due to involvement of high usage in automotive industry. Semiconductor packaging component maker starts to strengthen the solder joint quality and electrical power conductivity by
Siang Miang Yeo +2 more
semanticscholar +1 more source
Effect of Reflow Parameters on Solder Wetting
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 2003Reflow parameters during assembly are ramp rate, soak time, soak temperature, peak temperature, time above liquidus, and cooling rate. These reflow parameters constructs the temperature profile of reflow process and determine the quality of interconnects in the electronics products.
Suk Chae Kang, Daniel F. Baldwin
openaire +1 more source
Reflow soldering evaluation of lead free solder alloys
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93), 2002A quantitative dynamic solder wettability measurement was used to evaluate the effects of reflow processing on the wettability parameters associated with the nonlead bearing solders 96.5% Sn/3.5% Ag and 58% Bi/42% Sn. An experimental design approach employing full factorial experiments was formulated to investigate the solder wetting dependence of the ...
openaire +1 more source
Continuous Wetiability Measurement for Solder Reflow
MRS Proceedings, 1991AbstractA quantitative dynamic solder wettability mesurement technique was utilized to evaluate the effects of reflow processing on the wettability parameters associated with solder ball alloys. This technique enables the examination of the final degree of solder wetting and the continuous monitoring of wetting as a function of time during the reflow ...
Cynthia M. Melton +2 more
openaire +1 more source
Void formation during reflow soldering
2012 IEEE 62nd Electronic Components and Technology Conference, 2012In the present study the interaction between solder paste and the PCB surface finish and its impact on void formation was investigated. Therefore, a comprehensive set of tests was performed on test vehicles with different diameter of the solder powder, solder alloy composition, PCB surface finish and flux chemistry.
Thomas D. Ewald +2 more
openaire +1 more source
A Comparison of Laser Types for Reflow Soldering
Soldering & Surface Mount Technology, 1992The increasing complexity of microelectronic devices and the advent of surface mount technology has led to interest in alternatives to mass reflow soldering techniques. One method with advantages for rapid automation and minimal heat input, is laser soldering.
openaire +1 more source
59-2: Laser Reflow Soldering Technique for Mini/MicroLed Displays
Digest of Technical Papers SID International Symposium, 2021Haiwei Sun
exaly
Reflow and Electrical Characteristics of Nanoscale Solder
Small, 2006Zhiyong, Gu +4 more
openaire +2 more sources