Results 161 to 170 of about 102,570 (230)

Displacement of Components and Solder during Reflow Soldering

Soldering & Surface Mount Technology, 1989
During reflow soldering the applied solder paste is melted and the components, previously placed on the solder paste, move into their final position. This process, however, may be accompanied by various unwanted movements of components and solder. Components may move horizontally along the surface of the board (this is called swimming or floating), or ...
R.J. Klein Wassink, J.A.H. van Gerven
openaire   +1 more source

Thermal stress-strain simulation analysis of BGA solder joint reflow soldering process

International Conference on Electronic Packaging Technology, 2018
A three-dimensional finite element analysis model of BGA components was established. Using ANSYS, this model was subjected to stress-strain finite element simulation analysis under thermal-structure coupling conditions. The influence of temperature field
Xiang-Qiong Tang, Sheng-Jun Zhao, Chun-Yue Huang, Liang-kun Lu   +3 more
semanticscholar   +1 more source

The Effect of Product Formulation, Substrate Solderability and Reflow Atmosphere on Solder Paste Reflow Performance

Soldering & Surface Mount Technology, 1995
The resin activators' type and quantity in a solder paste have a significant effect on reflow behaviour. These interact with the effects of the oxygen content of the reflow atmosphere and the condition of the surfaces to be joined. While these parameters might be expected to influence solder paste reflow behaviour, more subtle effects related to the ...
M. Warwick, B.S. Chowdhary, N. Stanton
openaire   +1 more source

The Study of Thermally Induced Warpage of BGA Package during Reflow Soldering

International Conference on Electronic Packaging Technology, 2018
Currently, Ball Grid Array (BGA) package is becoming the most wildly used semiconductor packaging type. When BGA packages are subject to elevated temperatures during reflow soldering, warpage, or shape deformation occurs.
Bin Yao, Xiao-Feng Wang, Ya-Bing Zou
semanticscholar   +1 more source

Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball

Applications of Surface Science, 2018
Reflow soldering using a Bi-coated Sn-3.0(wt%)Ag-0.5Cu (SAC305) solder ball was successfully performed at a low peak temperature of 215 °C. The Bi shell promptly transformed into a Sn-58Bi eutectic alloy by rapid Bi diffusion into the inner SAC305 during
Jun Ho Hwang, Jonghyun Lee
semanticscholar   +1 more source

Use of Nitrogen in Reflow Soldering

Soldering & Surface Mount Technology, 1993
Several effects of the atmosphere in the soldering oven on both the soldering process itself and the soldering results are discussed. Experiments have been undertaken to compare the results of soldering in air and in nitrogen containing 10,100 and 1000 ppm oxygen, in which, e.g., discolouration, wettability, solderability after reflow, solder bridging ...
R.J. Klein Wassink, M.C. Seegers, M.M.F. Verguld   +2 more
openaire   +1 more source

Simulation analysis of residual stress of BGA solder joints after reflow soldering based on element birth and death technology

International Conference on Electronic Packaging Technology, 2018
Based on the theory of thermal elasticity and plasticity and ANSYS software, the finite element model of residual stress after reflow soldering of lead-free peripheral array BGA solder joints was established.
Sheng-Jun Zhao, Chun-Yue Huang, Xiang-Qiong Tang, Liang-kun Lu   +3 more
semanticscholar   +1 more source

A simplified reflow soldering process model

Pan Pacific Symposium, 2002
ABSTRACT Previously reported models of temperature development during the reflow soldering process have generally used commercially available, general purpose, finite difference (FD) or computational fluid dynamics (CFD) modelling tools to create detailed representations of both the product and the reflow furnace.
openaire   +1 more source

Nitrogen in Reflow Soldering of Lead-Free Solders

2007 8th Siberian Russian Workshop and Tutorial on Electron Devices and Materials, 2007
Due to environmental and health demands for lead contamination, there is increasing pressure in legislation and a growing market demand to eliminate toxic materials. Lead-free soldering for the electronic industry is becoming a global trend, and several alloy systems alternatives have been recommended.
openaire   +1 more source

The Future of Solder Paste Printing for SMT Reflow Soldering

Soldering & Surface Mount Technology, 1993
The use of fine‐pitch SMD devices has increased the need for accurate and consistent solder paste deposits for reflow soldering. Continued miniaturisation in PCB and SMD lead sizes is presenting the user, paste supplier and print equipment manufacturer with paste printing challenges.
E.K. Lo, N.N. Ekere, S.H. Mannan, I. Ismail   +3 more
openaire   +1 more source