Results 161 to 170 of about 1,501 (219)
Miniaturization Potential of Additive-Manufactured 3D Mechatronic Integrated Device Components Produced by Stereolithography. [PDF]
Micromachines (Basel)Piechulek N +4 more
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Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB). [PDF]
Materials (Basel)Han SE +6 more
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Reflow Soldering Using Flux-sprayed Solder Preforms
2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023 This research paper investigates the use of flux-sprayed solder preforms as an alternative method to reduce flux outgassing in reflow soldering. The study compares the flux volume, void level, solder balling, and solder spattering between the use of ...
Fred Fuliang Le +4 more
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Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design
Processes, 2023 The process design of hot air reflow soldering is one of the key factors affecting the quality of PCBA (Printed Circuit Board Assembly) component products.
Linjie Ran, Yubing Gong, Gong Yubing
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On reflow soldering process and reflow profile
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012In order to obtain good welding quality, some influencing factors of reflow soldering process were studied in this research. A series of welding experiments were conducted in a small reflow soldering oven. Oxidation and surface treatment of soldering materials are important factors in the welding process.
Xulong Gui +3 more
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Solders, Solderable Finishes and Reflowed Solder Coatings
Circuit World, 1977In the production of printed circuit assemblies, the demand for higher reliability levels has increased over the years. In order to achieve a high level of soldering quality, it is essential that solderability is built into the system at all stages and various factors must be taken into account.
M.L. Ackroyd, C.A. MacKay
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The reliability of reflow soldering by hot air reflow
Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, 2003The reliability of a solder joint produced on an FR-4 substrate by hot air reflow soldering in SMT (surface mount technology) was investigated. The hot air reflow method is shown to make the temperature of the mounted components and substrate equal to the ambient temperature and does not greatly damage components.
Y. Kojima +3 more
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Implementation the SoC of PCB Reflow Soldering
2019 16th International Joint Conference on Computer Science and Software Engineering (JCSSE), 2019This paper presents a PID temperature control system for the soldering, printed circuit board. By using a thermocouple to measure the temperature inside the oven And processing the signal using a microcontroller to calculate the difference between the set value and the current output value, To reduce errors to a minimum In order to control the infrared
Thanat Sooknuan +4 more
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Solder Reflow Method and Reflow Temperature Profile
Pan Pacific Symposium, 1999ABSTRACT The major cause of integrated circuit package failure mechanisms such as delamination, internal cracking or popcorning is package saturation with moisture and subsequent exposure to high temperature during the solder reflow process.
Yizhe Elisa Huang +3 more
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Displacement of Components and Solder during Reflow Soldering
Soldering & Surface Mount Technology, 1989During reflow soldering the applied solder paste is melted and the components, previously placed on the solder paste, move into their final position. This process, however, may be accompanied by various unwanted movements of components and solder. Components may move horizontally along the surface of the board (this is called swimming or floating), or ...
R.J. Klein Wassink, J.A.H. van Gerven
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