Results 141 to 150 of about 1,501 (219)

Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste. [PDF]

Nano Converg
Ju YM, Kim TW, Lee SH, Lee HJ, Ahn J, Kim HS.   +5 more
europepmc   +1 more source

Fast solid-phase bonding based on indium film-modified copper crystal structure. [PDF]

Sci Rep
Jin X, Jia L, Qi-Xing Z, Hao Z, Liu JH, Xi-Feng H.   +5 more
europepmc   +1 more source

Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders. [PDF]

Materials (Basel)
Lv X, Zhang C, Liu Y, Pan Z, Wang Z, Sun F.   +5 more
europepmc   +1 more source

A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation. [PDF]

Materials (Basel)
Sorokina K, Dušek K, Bušek D.
europepmc   +1 more source

Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish. [PDF]

Materials (Basel)
Jeyeselan L, Mhd Noor EE.
europepmc   +1 more source

Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint. [PDF]

Polymers (Basel)
Zhang P, Xue S, Liu L, Wang J, Tatsumi H, Nishikawa H.   +5 more
europepmc   +1 more source

Simulation of Mechanical Stresses in BaTiO₃ Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models. [PDF]

Materials (Basel)
Yuile A, Wiss E, Barth D, Wiese S.
europepmc   +1 more source

Heterogeneous integration of micro-LEDs via multiple simultaneous transfer and bonding. [PDF]

Microsyst Nanoeng
Joo J, Choi GM, Lee C, Jang KS, Oh JH, Eom YS, Choi KS, Um BJ, Bae BS, Shin J.   +9 more
europepmc   +1 more source

Miniaturized Mg₃Bi₂-based thermoelectric cooler for localized electronic thermal management. [PDF]

Nat Commun
Lin C, Ma X, Liang K, Xu Y, Yang H, Wang J, Ye S, Qiu J, Song L, Zhi S, Chen J, Zhao P, Duan S, Wu Z, Yin L, Wu L, Jiang F, Tang Z, Cao F, Zhang Q, Mao J.   +20 more
europepmc   +1 more source