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A low-cost modular PCB assembly for functional and in-circuit testing. [PDF]
HardwareXPuentes-Conde GM +5 more
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Leaftronics: Natural lignocellulose scaffolds for sustainable electronics. [PDF]
Sci AdvNair RR +10 more
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High output power low temperature polysilicon thin-film transistor boost converters for large-area sensor and actuator applications. [PDF]
Npj Flex ElectronVelazquez Lopez M +4 more
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Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design
Processes, 2023 The process design of hot air reflow soldering is one of the key factors affecting the quality of PCBA (Printed Circuit Board Assembly) component products.
Yubing Gong, LinJie Ran
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Numerical Simulation of Reflow Soldering
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019To guarantee a high level of solder joint durability for soft solder die attach, a uniform bond line thickness is crucial. In addition, for high electrical performance, a low void concentration is desirable. However, these goals are difficult to achieve during reflow soldering.
M. Stadler
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Warping model of high-power IGBT modules subjected to reflow soldering process
International Journal of Mechanical Sciences, 2023Shang Gao
exaly +2 more sources
Microelectronics international, 2023
Purpose Laser soldering has attracted attention as an alternative soldering process for microsoldering due to its localized and noncontact heating, a rapid rise and fall in temperature, fluxless and easy automation compared to reflow soldering. Design/
Yuehua Wu, Z. Zhang, L.-D. Chen, X. Zhou
semanticscholar +1 more source
Purpose Laser soldering has attracted attention as an alternative soldering process for microsoldering due to its localized and noncontact heating, a rapid rise and fall in temperature, fluxless and easy automation compared to reflow soldering. Design/
Yuehua Wu, Z. Zhang, L.-D. Chen, X. Zhou
semanticscholar +1 more source
2020
This article describes HBR Soldering process, the appropriate joint designs, materials, process setup, working procedures and equipment. For more detailed info please visit our website: www.miyachiamerica.com HBR soldering reflows solder by using a ...
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This article describes HBR Soldering process, the appropriate joint designs, materials, process setup, working procedures and equipment. For more detailed info please visit our website: www.miyachiamerica.com HBR soldering reflows solder by using a ...
openaire +2 more sources
Microelectronics international, 2021
Purpose The purpose of this paper is to present the experimental and simulation studies on the influence of copper pillar bump structure on flip chip packaging during reflow soldering.
M. H. Ishak +3 more
semanticscholar +1 more source
Purpose The purpose of this paper is to present the experimental and simulation studies on the influence of copper pillar bump structure on flip chip packaging during reflow soldering.
M. H. Ishak +3 more
semanticscholar +1 more source
International Conference on Electronic Packaging Technology, 2021
In view of the complexity and high cost of temperature curve setting in reflow soldering process of multi variety and small batch products, and the existing process simulation methods of PCB components lack of comprehensive consideration of solder paste ...
Xing Jin +5 more
semanticscholar +1 more source
In view of the complexity and high cost of temperature curve setting in reflow soldering process of multi variety and small batch products, and the existing process simulation methods of PCB components lack of comprehensive consideration of solder paste ...
Xing Jin +5 more
semanticscholar +1 more source