Reflow soldering in an oxidant atmosphere
, 2015 Reflow soldering process is the most used process in industry to solder the Printed Circuit Boards (PCBs). To ensure a good solder joint reliability, this process are normally made under an inert atmosphere like Nitrogen (N2), in order to reduce soldering defects.
openaire +1 more source
Microjoining for biomedical device fabrication: a perspective. [PDF]
Adv Mater JoinZhang K, Zhou YN, Peng P.
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Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering
, 2003 In this project, the effects of oxygen concentration on solder joint during reflow soldering are studied.
Chung, Chee Key
core
Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling. [PDF]
J Mater Sci Mater ElectronHsieh CL +4 more
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Hybrid LTCC-Polyimide Approach for High-Sensitivity Mechanical Sensing Applications. [PDF]
Sensors (Basel)Tounsi F +5 more
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A Low-Stray-Inductance 1200 V/500 A SiC Power Module Based on Multilayer Insulated Metal Substrate. [PDF]
Micromachines (Basel)Yue Y, Che L, Li C, Lei G.
europepmc +1 more source
OpenMCT: an open-source DC motor control educational kit. [PDF]
HardwareXVon Chong A +3 more
europepmc +1 more source
Enhanced Fringing Field Micro-Moisture Sensor with Elements Optimization. [PDF]
Micromachines (Basel)Meng X, Li C, Lan Y, Tan L, Zhang X.
europepmc +1 more source
Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications. [PDF]
Micromachines (Basel)Werum K +6 more
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A low-cost and robust microscope hardware trigger interface board. [PDF]
HardwareXWalker LA, Michki SN, Li Y, Cai D.
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