Results 101 to 110 of about 1,501 (219)
Study Of Quality And Reliability Of Welding Process Reflow Component Technology BGA
In recent years many efforts have been expended by companies in the search for technological improvement of its products by adding features such as light weight, reduced size and high levels of performance at the lowest cost, to meet a worldwide demand ...
Robson Marques Costa
doaj
Design of Reflow Soldering Station for Reballing of BGA Packages
This thesis deals with the design of a soldering oven for BGA reballing in a nitrogen protective atmosphere. The principles of reflow soldering, the advantages of a nitrogen protective atmosphere on the quality of solder joints and the types of soldering
Janiš, Adam
core
Electrochemical Migration Behaviour of Surface Finishes after Vapour Phase Reflow Soldering
This paper presents a comparative study of electrochemical migration behaviour of different surface finishes subjected to vapour phase soldering or infrared reflow process.
Illés, Balázs +5 more
core +1 more source
Automated adaptive control of the reflow soldering of electronic assemblies
This paper describes a new technique for the monitoring and automated control of the reflow soldering process. The new technique combines state of the art infra-red (IR) sensor technology, coupled with application specific process control software, to ...
M. Wilkinson (7210100) +3 more
core
Flux residues after reflow soldering
Tato bakalářská práce se zabývá problematikou tavidlových zbytků po pájení přetavením. První čás je zaměřena na problematiku pájecích past. Je zde vysvětleno, z čeho se pájecí pasta skládá a jakými způsoby se dá nanášet. V druhé části jsou popsána pájecí
Konvička, Tomáš
core
Terjadi keretakaan pada komponen surface mount induktor akibat suhu tinggi yang didapat dari proses reflow soldering, sehingga dibutuhkan peningkatan keandalam thermal-shock pada komponen ini.
FILDZAH FAJRINA
core
Optimization of soldering profiles for continuous reflow oven
Předkládaná bakalářská práce je zaměřena na optimalizaci pájecích profilů u průběžné přetavovací pece Mistral 260. V teoretické části jsou uvedeny základní poznatky o pájení olovnatém i bezolovnatém, dále hlavní technologické postupy pájení, zaměřené ...
Jakoubek, Jakub
core
Development of a reflow soldering process without N2
Dissertação de mestrado em Técnicas de Caracterização e Análises QuímicasReflow soldering in a nitrogen atmosphere has become a common practice in surface mount technology (SMT) processes.
Vilaça, Alexandre Ferreira
core
Experimental study of self-alignment during reflow soldering process
Self-alignment forces induced by solder reflow are pivotal to many relevant technologiesincluding precision micro-objects manipulation and chip component assembly especially in high density interconnect PCB.
Amirah Afiqah binti Jin Azman
core +1 more source
Modeling of the soldering process for components of radio-electronic units of on-board equipment
The technological route for the production of radio electronic printed units is considered. Determined that he most critical operation is reflow soldering in the vapor-gas phase.
S.V. Tyulevim
doaj

