Results 11 to 20 of about 102,570 (230)
Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications
Energies, 2023 This paper gives a review of different applications in the numerical modelling of reflow soldering technology from recent years. The focus was on detailing the different process types, the physical background, and related mathematical models.
István Bozsóki +2 more
doaj +2 more sources
Mathematics, 2022 As a vital component of electronic products, the quality of the printed circuit board (PCB) assembly directly affects the applications and service life. During the reflow soldering process, the PCB assembly may suffer excessive warpage.
Yu Guo +3 more
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Discrete Dynamics in Nature and Society, 2021 In this study, a heat convection model of the reflow oven and a heat conduction model of the soldering area are proposed based on heat transfer theory, and a dynamic Thomas algorithm is developed for solving linear equations with coefficient matrix ...
Yongze Xu, Yu Liu, Lei Zhang
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Effect of reflow soldering profile on intermetallic compound formation [PDF]
International journal of computer application and technology, 2015 Reflow soldering in a nitrogen atmosphere is a common process in surface mount technology assembly since it can increase solder joint reliability. The present study investigated the effect of different reflow soldering atmospheres, either air or nitrogen,
I. Aisha +3 more
semanticscholar +2 more sources
The Impact of Baseplate Bow on Vacuum Reflow Soldering
Kongzhi Yu Xinxi Jishu, 2011 The impact of IGBT baseplate bow on reflow soldering is analyzed. And the process parameters are adjusted to eliminate the influence of baseplate bow on soldering quality.
曾雄, 张泉
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Analysis of surface mount technology solder joints [PDF]
, 1996 This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex.
Hui, Ip Kee
core +7 more sources
Reflow soldering process simulation: a simplified model [PDF]
, 2002 Established models of temperature development during reflow soldering have used general purpose, finite difference (FD) or computational fluid dynamics modelling tools to create detailed representations of both the product and the reflow furnace.
David Whalley (1248297)
core +6 more sources
Research forecasting model to solve the problem of marketing needs of enterprises [PDF]
E3S Web of Conferences, 2021 This essay focuses on the temperature variation law of the center of the target board soldering area at a certain position when the reflow oven starts working as the core discussion.
Jing-lan Mo +3 more
doaj +1 more source
MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes
Journal of Welding and Joining, 2021 After the joining of small 1005 and 0603 multilayer ceramic capacitor (MLCC) components for a semiconductor package using Type 4 (T4) and Type 7 (T7) Sn-3.0Ag-0.5Cu (SAC305), T4 Sn-1.0Ag-0.5Cu (SAC105), and T4 Sn-0.3Ag-0.7Cu (SAC0307) solder pastes, the ...
W. Hong, Mi-Song Kim, Myeongin Kim
semanticscholar +1 more source
Case Studies in Thermal Engineering, 2022 In this paper, the effect of different thermocouple constructions on the hot spot temperature are investigated with a modelling approach to achieve more precise soldering profile acquisition and failure analysis at different reflow soldering heat ...
Dániel Straubinger +4 more
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