Results 11 to 20 of about 1,501 (219)

The Impact of Baseplate Bow on Vacuum Reflow Soldering

Kongzhi Yu Xinxi Jishu, 2011
The impact of IGBT baseplate bow on reflow soldering is analyzed. And the process parameters are adjusted to eliminate the influence of baseplate bow on soldering quality.
曾雄, 张泉
doaj   +2 more sources

The combined effect of reflow soldering time and Bi doping on the interfacial behavior and shear properties of Sn-0.7Cu-0.8Zn/Cu solders joint

Journal of Materials Research and Technology
The interfacial intermetallic compounds (IMC) layers evolution and shear properties in Sn-0.7Cu-0.8Zn/Cu and Sn-0.7Cu-0.8Zn–5Bi/Cu solder joint at different reflow soldering time were investigated.
Wenbin Tu, Shanlin Wang, Weihua Chen, Pengfei Wang, Jilin Xie, Si Chen, Min Zheng, Mingwei Wei, Yuhua Chen, Fan Wu   +9 more
doaj   +2 more sources

Research on Substrate Soldering of High-voltage IGBT Modules

Kongzhi Yu Xinxi Jishu, 2011
It is analyzed physical process and temperature characteristics of vacuum reflow soldering, and also summarized the influence of variables for vacuum reflow soldering process on the quality of IGBT substrate soldering through experiments analysis.
赵洪涛
doaj   +2 more sources

Research forecasting model to solve the problem of marketing needs of enterprises [PDF]

E3S Web of Conferences, 2021
This essay focuses on the temperature variation law of the center of the target board soldering area at a certain position when the reflow oven starts working as the core discussion.
Jing-lan Mo, Yang-yang Wu, Yao Wang, Yu-ting Huang   +3 more
doaj   +1 more source

Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows

Journal of Materials Research and Technology, 2023
Multiple reflow processes are utilized in complex electronic devices with multi-layered PCBs, stacked components, or 3D configurations to ensure reliable connections and minimize defects.
M.S. Chang, M.A.A. Mohd Salleh, D.S.C. Halin, F. Somidin, H. Yasuda, K. Nogita   +5 more
doaj   +1 more source

Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment

Case Studies in Thermal Engineering, 2022
In this paper, the effect of different thermocouple constructions on the hot spot temperature are investigated with a modelling approach to achieve more precise soldering profile acquisition and failure analysis at different reflow soldering heat ...
Dániel Straubinger, Balázs Illés, David Busek, Norocel Codreanu, Attila Géczy   +4 more
doaj   +1 more source

Introduction to Surface-Mount Technology [PDF]

, 2020
In chapter 1, the surface-mount technology and reflow soldering technology are overviewed. A brief introduction is presented into the type of electronic components, including through-hole- and surface-mounted ones.
Illés, Balázs, Attila Géczy, Balázs Illés, Olivér Krammer, Krammer, Olivér, Géczy, Attila   +5 more
core   +1 more source

Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint by ultrasonic-assisted soldering method

Journal of Materials Research and Technology, 2021
Improving the reliability of the solder joint has been the recent research focus in the electronic packaging field due to the increasing degree of integration in the electronic devices.
Baishan Chen, Yufeng Huang, Siwei Tang, Wensheng Liu, Yunzhu Ma   +4 more
doaj   +1 more source

Research on Furnace Temperature Curve Based on Heat Convection and Heat Radiation [PDF]

E3S Web of Conferences, 2021
Insights into the mechanism of reflow soldering temperature curve, a mathematical model of the temperature change of the circuit board surface is established. The heat transfer methods, heat radiation and heat convection is analyzed in detail.
Lei Qiaoyun, Zhang Ziyou, Zhuo Songyi, Lin Kangju   +3 more
doaj   +1 more source

Influences of soldering time on wettability and intermetallic phase between Sn-3.0Cu solder and copper substrate [PDF]

MATEC Web of Conferences, 2018
In this paper, the influences of soldering time on the wettability and intermetallic phase between Sn-3.0Cu lead-free solder and copper substrate were investigated.
Mookam Niwat, Kanlayasiri Kannachai
doaj   +1 more source