Results 21 to 30 of about 102,570 (230)
Introduction to Surface-Mount Technology [PDF]
, 2020 In chapter 1, the surface-mount technology and reflow soldering technology are overviewed. A brief introduction is presented into the type of electronic components, including through-hole- and surface-mounted ones.
Illés, Balázs +2 more
core +2 more sources
Journal of Materials Research and Technology, 2021 Improving the reliability of the solder joint has been the recent research focus in the electronic packaging field due to the increasing degree of integration in the electronic devices.
Baishan Chen +4 more
doaj +1 more source
Research on Furnace Temperature Curve Based on Heat Convection and Heat Radiation [PDF]
E3S Web of Conferences, 2021 Insights into the mechanism of reflow soldering temperature curve, a mathematical model of the temperature change of the circuit board surface is established. The heat transfer methods, heat radiation and heat convection is analyzed in detail.
Lei Qiaoyun +3 more
doaj +1 more source
Influences of soldering time on wettability and intermetallic phase between Sn-3.0Cu solder and copper substrate [PDF]
MATEC Web of Conferences, 2018 In this paper, the influences of soldering time on the wettability and intermetallic phase between Sn-3.0Cu lead-free solder and copper substrate were investigated.
Mookam Niwat, Kanlayasiri Kannachai
doaj +1 more source
, 2021 The quality of solder joints formed by reflow soldering is closely related to the temperature profile of solder joint during the hot air reflow soldering process. The temperature profile of solder joint is directly determined by the process parameters of
Chen Ji +6 more
semanticscholar +1 more source
Journal of Materials Research and Technology, 2023 Nanotwinned copper (nt-Cu) is considered to be very desirable choice for a pad material in system-in-package (SiP) devices due to its excellent anti-electromigration and anti-element migration properties.
Zicheng Sa +5 more
doaj +1 more source
Journal of Materials Research and Technology, 2022 Microwave hybrid heating (MHH) is a possible approach for soldering; yet, the long-term reliability of solder joints is still unclear. In this work, a comparative study was carried out on the influence of isothermal aging on SAC305/Cu solder joints by ...
Mardiana Said +4 more
doaj +1 more source
Reflow Soldering Technology [PDF]
, 2010 Bakalářská práce se zabývá problematikou technologie pájení přetavením. V teoretické části se snaží seznámit s obecným principem pájení, významem použití tavidel, pájitelností povrchu, dále potom samotnou metodikou pájení přetavením, teplotním profilem a
Filáková, Denisa
core +2 more sources
CFD Letters, 2020 Article history: Received 19 March 2020 Received in revised form 18 May 2020 Accepted 23 May 2020 Available online 31 May 2020 Surface mount technology (SMT) is a method of electronic components mounting or placed directly on the surface of the circuit ...
Intan Norshalina Sahrudin +3 more
semanticscholar +1 more source
Wettability study of lead free solder paste and its effect towards multiple reflow
MATEC Web of Conferences, 2016 Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder ...
Idris Siti Rabiatull Aisha +2 more
doaj +1 more source