Results 21 to 30 of about 1,501 (219)
Journal of Materials Research and Technology, 2023 Nanotwinned copper (nt-Cu) is considered to be very desirable choice for a pad material in system-in-package (SiP) devices due to its excellent anti-electromigration and anti-element migration properties.
Zicheng Sa +5 more
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Mathematics, 2022 As a vital component of electronic products, the quality of the printed circuit board (PCB) assembly directly affects the applications and service life. During the reflow soldering process, the PCB assembly may suffer excessive warpage.
Yu Guo +3 more
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Journal of Materials Research and Technology, 2022 Microwave hybrid heating (MHH) is a possible approach for soldering; yet, the long-term reliability of solder joints is still unclear. In this work, a comparative study was carried out on the influence of isothermal aging on SAC305/Cu solder joints by ...
Mardiana Said +4 more
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Wettability study of lead free solder paste and its effect towards multiple reflow
MATEC Web of Conferences, 2016 Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder ...
Idris Siti Rabiatull Aisha +2 more
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Effect of Reflow Soldering Profile on Intermetallic Compound Formation [PDF]
, 2015 Reflow soldering in a nitrogen atmosphere is a common process in surface mount technology assembly since it can increase solder joint reliability. The present study investigated the effect of different reflow soldering atmospheres, either air or nitrogen,
Ourdjini, Ali +3 more
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Joining of Electrodes to Ultra-Thin Metallic Layers on Ceramic Substrates in Cryogenic Sensors
Sensors, 2021 Microjoining technologies are crucial for producing reliable electrical connections in modern microelectronic and optoelectronic devices, as well as for the assembly of electronic circuits, sensors, and batteries.
Marcin Lebioda +2 more
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Discrete Dynamics in Nature and Society, 2021 In this study, a heat convection model of the reflow oven and a heat conduction model of the soldering area are proposed based on heat transfer theory, and a dynamic Thomas algorithm is developed for solving linear equations with coefficient matrix ...
Yongze Xu, Yu Liu, Lei Zhang
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Stress warpage analysis of IGBT module package reflow soldering
Xi'an Gongcheng Daxue xuebao, 2021 In order to explore the impact of reflow soldering process on power device packaging, a 3D package model based on insulated gate bipolar transistor (IGBT) module was established using DesignModeler, and then ANSYS software was used to perform thermal ...
Lipeng TAN +4 more
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IEEE Access, 2021 As the environmental concern is being raised over residues of lead, the trend of transferring from the conventional lead-based soldering to lead-free soldering is overwhelming. Lead-free solders require the peak temperature to be about 30 degrees Celsius
Tin Lun Lam
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A simplified model of the reflow soldering process [PDF]
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258), 2003 Previous models of the reflow soldering process have used commercial finite difference (FD) or computational fluid dynamics simulation software to create detailed representations of the product and/or the reflow furnace. Such models have been shown to be highly accurate at predicting the temperatures a PCB design will achieve during the reflow process.
David C. Whalley, Stuart M. Hyslop
openaire +2 more sources