Results 231 to 240 of about 2,904,478 (320)

Tribology of ZrC Coatings and Spherical Tips Acquired with Extraordinarily Stiff, Metal Atomic Force Microscopy Probes

Advanced Engineering Materials, EarlyView.
In this research, ZrC coatings are evaluated against various counterprobes at the microscale using novel super‐stiff atomic force microscopy cantilevers. The chemical composition of the coating is shown to be an important factor influencing coating hardness and Young's modulus, while surface roughness, counterprobe hardness, and surface energy are the ...
Piotr Jenczyk, Marcin Michałowski, Bogdan Warcholiński, Michał Milczarek, Adam Gilewicz   +4 more
wiley   +1 more source

Corrected Thermodynamics of Black Holes in f(R) Gravity with Electrodynamic Field and Cosmological Constant. [PDF]

Entropy (Basel)
Xu M, Zhang Y, Yang L, Yang S, Lu J.
europepmc   +1 more source

Fabrication of a Stable, Low‐Cost, Patient‐Specific, Brain Phantom with Ventricles for Ultrasound Imaging

Advanced Engineering Materials, EarlyView.
Patient‐specific brain phantoms can replace animal trials, aid presurgical training, and enable in silico disease research on cerebrospinal fluid and ventricles. This study presents a method to create ventricular brain phantoms from three‐dimensional magnetic resonance images brain scans, resulting in durable, tunable, reproducible models that mimic ...
Kajal Chandraprakash Jain, Ana Belen Amado Rey, Ana Carolina Gonçalves Seabra, Thomas Stieglitz   +3 more
wiley   +1 more source

Influence of a Standard Heat Treatment on the Microstructure and Properties of Inconel X‐750 Produced by Laser Powder Bed Fusion

Advanced Engineering Materials, EarlyView.
Ni‐base superalloys produced using additive manufacturing (AM) have a different response to heat treatments when compared to their conventional counterparts. Due to such unpredictability, various alloys with industrial interest are currently overlooked in most prior AM research.
Guilherme Maziero Volpato, Adriano de Souza Pinto Pereira, Steffen Neumeier, Dachamir Hotza, Mathias Göken, Ulrich Tetzlaff, Márcio Celso Fredel   +6 more
wiley   +1 more source

Nonadditive Entropies and Nonextensive Statistical Mechanics. [PDF]

Entropy (Basel)
Tirnakli U.
europepmc   +1 more source

Quality Enhancement of Laser Powder‐Bed Fusion Parts by Acoustically Assisted Additive Manufacturing by Laser Powder‐Bed Fusion and its Application to Lattice Structures

Advanced Engineering Materials, EarlyView.
Additive manufacturing technologies like laser powder‐bed fusion offer great design freedom and individualization of products down to a batch size of one. However, parts fabricated with this technology suffer from poor quality. Acoustic assistance during the build process can minimize these drawbacks.
Oliver Maurer, Dirk Bähre
wiley   +1 more source

Geometric properties of almost pure metric plastic pseudo-Riemannian manifolds. [PDF]

Heliyon
Karaman C, Gezer A, Khan MNI, Ucan S.
europepmc   +1 more source

First‐Principles Modeling of Solid Solution Softening and Hardening Effects in Al–Mg–Zr–Si Aluminum Alloys

Advanced Engineering Materials, EarlyView.
The role of various alloying elements in face‐centered cubic aluminum on the barrier of a Shockley partial dislocation during its motion is presented. The study aims to understand how alloying atoms such as Mg, Si, and Zr affect the energy landscape for dislocation motion, thus influencing the solid solution hardening and softening in aluminum, which ...
Inna Plyushchay, Zhengqing Wei, Nebahat Bulut, Sibylle Gemming   +3 more
wiley   +1 more source

Model-Informed Clinical Pharmacology Profile of a Novel Fixed-Dose Combination of Nivolumab and Relatlimab in Adult and Adolescent Patients with Solid Tumors. [PDF]

Clin Cancer Res
Zhao Y, Hu Z, Bathena SP, Keidel S, Miller-Moslin K, Statkevich P, Bello A, Roy A, Suryawanshi S.   +8 more
europepmc   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

Advanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan, Tuan‐Khoa Nguyen, Quang Thang Trinh, Nam‐Trung Nguyen, Dzung Viet Dao, Yong Zhu   +5 more
wiley   +1 more source