Results 241 to 250 of about 503,606 (298)

Low Resistance Interphase Formation at the PEO‐LiTFSI|LGPS Interface in Lithium Solid‐State Batteries

open access: yesAdvanced Materials Interfaces, EarlyView.
Interfacial charge transfer and low‐resistance interphase formation between PEO‐based polymer and Li10GeP2S12 solid electrolytes are investigated using multi‐electrode impedance spectroscopy and advanced analytical techniques such as XPS and ToF‐SIMS.
Ujjawal Sigar   +6 more
wiley   +1 more source

Nerve injuries in cervical spine surgery via anterior approach: a comprehensive review. [PDF]

open access: yesJ Spine Surg
Hasan S   +11 more
europepmc   +1 more source

Nonmulberry Silk Fibroin Doping Boosts Charge Transfer and Charge Injection in Aligned Polypyrrole‐Silk Scaffolds for Low‐Voltage Neurostimulation

open access: yesAdvanced Materials Interfaces, EarlyView.
Conductive silk‐polypyrrole scaffolds couple redox stability with cell‐affinitive peptides present innately in an endogenous silk fibroin, enabling optimized electrical stimulation to drive neurite outgrowth. Findings establish electrochemical‐biological link for biomaterial design rules for smart nerve guidance conduits that can provide low voltage ...
Rajiv Borah   +5 more
wiley   +1 more source

Label‐Free Sensing of Coronaviral Sequences via Kretschmann‐Configuration Reflectance Spectroscopic Ellipsometry: Sensitivity, Specificity, and Interfacial Effects

open access: yesAdvanced Materials Interfaces, EarlyView.
Spectroscopic ellipsometry in the Kretschmann‐Raether configuration (KRSE) is employed to characterize a DNA‐functionalized platform for viral sequence recognition. By merging SE with surface plasmon resonance, KRSE outperforms conventional SE, achieving nanomolar targeting through resonance wavelength shifts (δλ) measurements. Its enhanced interfacial
Silvia Maria Cristina Rotondi   +4 more
wiley   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

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