Results 71 to 80 of about 109,368 (283)

A Universal Interfacial Dipole Strategy for Defect Suppression in Inverted Perovskite Solar Cells With Tunable Bandgaps

Advanced Functional Materials, EarlyView.
A 2D heterointerface with a two‐site anchor bridge suppresses nonradiative recombination at the perovskite/C₆₀ interface by reducing surface defects, elevating the Fermi level, and strengthening the electric field. This strategy enables efficient electron extraction, delivering 26.32% efficiency, 1.217 V Voc, excellent operational stability, and broad ...
Chaohui Li, Hyoungwon Park, Fabian Streller, Klaus Götz, Jiwon Byun, Shudi Qiu, Zhangyu Yuan, Jonas Englhard, Andrej Vincze, Zijian Peng, Lirong Dong, Yanxue Wang, Chao Liu, Jingjing Tian, Mingjie Feng, Peichun Liao, Fu Yang, Andreas Späth, Andres Osvet, Thomas Heumueller, Marcus Halik, Silke H. Christiansen, Tobias Unruh, Julien Bachmann, Rainer H. Fink, Ning Li, Larry Lüer, Christoph J. Brabec   +27 more
wiley   +1 more source

Design and Fabrication of Full Wheatstone-Bridge-Based Angular GMR Sensors

Sensors, 2018
Since the discovery of the giant magnetoresistive (GMR) effect, GMR sensors have gained much attention in last decades due to their high sensitivity, small size, and low cost.
Shaohua Yan, Zhiqiang Cao, Zongxia Guo, Zhenyi Zheng, Anni Cao, Yue Qi, Qunwen Leng, Weisheng Zhao   +7 more
doaj   +1 more source

A New Embedded Key–Value Store for NVM Device Simulator

Micromachines, 2020
The non-volatile memory (NVM) device is a useful way to solve the memory wall in computers. However, the current I/O software stack in operating systems becomes a performance bottleneck for applications based on NVM devices, especially for key–value ...
Tao Cai, Qingjian He, Dejiao Niu, Fuli Chen, Jie Wang, Lei Li   +5 more
doaj   +1 more source

Design Strategies and Emerging Applications of High‐Performance Flexible Piezoresistive Pressure Sensors

Advanced Functional Materials, EarlyView.
Flexible piezoresistive pressure sensors underpin wearable and soft electronics. This review links sensing physics, including contact resistance modulation, quantum tunneling and percolation, to unified materials/structure design. We highlight composite and graded architectures, interfacial/porous engineering, and microstructured 3D conductive networks
Feng Luo, Artur Ciesielski, Paolo Samorì   +2 more
wiley   +1 more source

Reducing optical and resistive losses in graded silicon-germanium buffer layers for silicon based tandem cells using step-cell design

AIP Advances, 2015
Si solar cells with a SiGe graded buffer on top are fabricated as the initial step in GaAsP/Si tandem cell fabrication. Using this structure, the impact of the SiGe buffer layer on the Si solar cells is characterized. To mitigate the impact of the narrow-
Evelina Polyzoeva, Sabina Abdul Hadi, Ammar Nayfeh, Judy L. Hoyt   +3 more
doaj   +1 more source

Memristor‐Driven Active‐Matrix Organic Light‐Emitting Diode for Energy Efficient and High‐Resolution Displays

Advanced Functional Materials, EarlyView.
This study demonstrates that memristors can replace conventional 2T–1C driving circuits with simplified 1T–1 m architectures by exploiting resistance switching. With ultra‐low switching voltages (< ±0.2 V) and multi‐level resistance states, the memristors precisely control the current injected into organic light‐emitting diodes (OLEDs).
Dong Hyun Kim, Nahyun Kim, Seok Hee Hong, Ho Jin Lee, Jin Suk Oh, Jae Seong Park, Tae Geun Kim   +6 more
wiley   +1 more source

Ta/CoFeB/MgO analysis for low power nanomagnetic devices

AIP Advances, 2020
The requirement of high memory bandwidth for next-generation computing systems moved the attention to the development of devices that can combine storage and logic capabilities.
F. Riente, S. Mendisch, L. Gnoli, V. Ahrens, M. Ruo Roch, M. Becherer   +5 more
doaj   +1 more source

CUP: Comprehensive User-Space Protection for C/C++

, 2017
Memory corruption vulnerabilities in C/C++ applications enable attackers to execute code, change data, and leak information. Current memory sanitizers do no provide comprehensive coverage of a program's data. In particular, existing tools focus primarily
Akritidis Periklis, Eigler Frank Ch, Jim Trevor, Nagarakatte Santosh, Serebryany Konstantin   +4 more
core   +1 more source

Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout [PDF]

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2009
The technology of through-silicon vias (TSVs) enables fine-grained integration of multiple dies into a single 3-D stack. TSVs occupy significant silicon area due to their sheer size, which has a great effect on the quality of 3-D integrated chips (ICs).
Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim   +2 more
openaire   +1 more source

Transfer Printing and Reconfiguration of Soft Electronics Using Digital Microfluidics and Laser Machining

Advanced Functional Materials, EarlyView.
This paper presents a digital microfluidics‐based technique for transferring and reconfiguring soft nanomembranes. Laser‐machined nanothin membranes are picked up, transported, and aligned via tailored surface tension and the actuation of water droplets, enabling the development of flexible electronics, the integration of functional materials on 3D ...
Quang Anh Nguyen, Chi Cong Nguyen, Tran Bach Dang, Phuoc Thien Phan, Jordan Thorpe, Michael Listyawan, Nhat Minh Doan, Sinuo Zhao, Hongru Chen, Trung Thien Hoang, Mingsheng Xu, Jisheng Han, Thanh Nho Do, Adam Hill, Timothée Mouterde, Hoang‐Phuong Phan   +15 more
wiley   +1 more source