Results 1 to 10 of about 9,650 (209)

The Influence of Crystal Orientation on Subsurface Damage of Mono-Crystalline Silicon by Bound-Abrasive Grinding [PDF]

Micromachines, 2021
Subsurface damage (SSD) produced in a grinding process will affect the performance and operational duration of single-crystal silicon. In order to reduce the subsurface damage depth generated during the grinding process by adjusting the process ...
Wei Yang, Yaguo Li
doaj   +2 more sources

Study on Nano-Grinding Characteristics and Formation Mechanism of Subsurface Damage in Monocrystalline Silicon [PDF]

Micromachines
Monocrystalline silicon is an excellent semiconductor material for integrated circuits. Its surface quality has an enormous effect on its service life. The surfaces are formed by ultra-precision machining using nano-grinding, one of the technologies that
Haipeng Yan, Haining Zhang, Siyuan Cao, Chao Wang   +3 more
doaj   +2 more sources

Deep Learning-Based Subsurface Damage Localization Using Full-Field Surface Strains [PDF]

Sensors, 2023
Structures in their service life are often damaged as a result of aging or extreme events such as earthquakes or storms. It is essential to detect damage in a timely fashion to ensure the safe operation of the structure.
Ashish Pal, Wei Meng, Satish Nagarajaiah
doaj   +2 more sources

Investigating Surface Morphology and Subsurface Damage Evolution in Nanoscratching of Single-Crystal 4H-SiC [PDF]

Micromachines
Single-crystal 4H silicon carbide (4H-SiC) is a key substrate material for third-generation semiconductor devices, where surface and subsurface integrity critically affect performance and reliability.
Jianpu Xi, Xinxing Ban, Zhen Hui, Wenlan Ba, Lijuan Deng, Hui Qiu   +5 more
doaj   +2 more sources

Evolution of Fused Silica Subsurface Damage in Chemical Etching and Its Influence on Surface Loss [PDF]

Sensors
Mitigating the surface loss induced by subsurface damage is of critical importance in the manufacturing of fused silica devices with ultra-low mechanical loss.
Xiaoqiang Zhang, Chengkui Zu, Lidong Wang, Xuefu Song, Yuancheng Sun, Xiurong Du, Yongchang Zhu   +6 more
doaj   +2 more sources

Atomic-Scale Mechanisms and Damage Suppression in Nanometric Cutting of Polycrystalline Copper: A Molecular Dynamics Study [PDF]

Nanomaterials
Molecular dynamics simulations were performed to investigate the nanometric cutting of polycrystalline oxygen-free copper using a single-crystal diamond tool.
Yang Li, Peng Fu, Huan Gu, Shulin Liang, Lin Li, Hao Jiang, Yuan Hong, Zhan Li, Lei Lu, Rongrong Tang, Zhuo Li, Liqi Li   +11 more
doaj   +2 more sources

Quantitative Evaluation of Subsurface Damage by Improved Total Internal Reflection Microscopy

Applied Sciences (Switzerland), 2019
Subsurface damage (SSD), having a great impact on the laser-induced damage threshold (LIDT) of ultra-smooth optics applied in high-power laser systems, should be tightly controlled.
Cheng Xin, Kaizao Ni, Zhouling Wu
exaly   +3 more sources

Modeling of ultra-thin diamond slice and simulation of SiC wafer cutting based on Python language

Jin'gangshi yu moliao moju gongcheng, 2023
To address issues like edge collapse and subsurface damage during the cutting process of SiC wafers, a model for cutting SiC wafers with ultra-thin diamond blades was established by combining Python language and Abaqus finite element analysis software ...
Yan HE, Xiang LI, Xingjun GAO, Lin FAN, Ming LIU, Zicheng XU   +5 more
doaj   +3 more sources

Diamond grinding quality analysis based on controlled grinding depth

Jin'gangshi yu moliao moju gongcheng, 2023
In order to explore the surface grinding quality and subsurface damage law of the grinding depth on the diamond material, the model of diamond workpiece ground by multi grits is established by molecular dynamics (MD) method.
Fei PANG, Dajiang LEI, Wei WANG
doaj   +3 more sources

Subsurface Damage in Polishing Process of Silicon Carbide Ceramic [PDF]

Materials, 2018
Yan Gu, Mingming Lu, Jieqiong Lin
exaly   +2 more sources