Results 71 to 80 of about 189,846 (243)
Metasurface‐engineered NC‐TENG arrays integrate tactile pressure mapping, non‐contact gesture sensing, and acoustic signal readouts in one ultrathin module, and outperforms pristine PDMS in terms of electrical output and real‐time spatial mapping for next‐gen wearables.
Injamamul Arief +12 more
wiley +1 more source
Dynamic Mitigation Mechanisms of Rime Icing with Propagating Surface Acoustic Waves. [PDF]
Yang D +9 more
europepmc +1 more source
Atomically Resolved Acoustic Dynamics Coupled with Magnetic Order in a Van der Waals Antiferromagnet
Magnetically coupled acoustic phonon modes (f1, f2, f3) are captured by ultrafast X‐ray diffraction in a prototypical van der Waals antiferromagnet FePS3, including their atomic displacement vectors (u) and the acoustic propagation wave vectors (k). Notably, the atomic displacement vector and amplitude of these modes, represented by the direction and ...
Faran Zhou +24 more
wiley +1 more source
Extended topological valley-locked surface acoustic waves. [PDF]
Wang JQ +11 more
europepmc +1 more source
Optical fiber interferometer for the study of ultrasonic waves in composite materials [PDF]
The possibility of acoustic emission detection in composites using embedded optical fibers as sensing elements was investigated. Optical fiber interferometry, fiber acoustic sensitivity, fiber interferometer calibration, and acoustic emission detection ...
Claus, R. O. +5 more
core +1 more source
Hybrid piezoelectric scaffolds offer a promising route for Central Nervous System regeneration by combining structural and electrical cues to support neural stem cell growth. This review highlights their potential to overcome current challenges in neural tissue engineering by exploring porous hybrid materials, their biological interactions, and ...
Heather F. Titterton +2 more
wiley +1 more source
Bubble-Enhanced Mixing Induced by Standing Surface Acoustic Waves (SSAWs) in Microchannel. [PDF]
Zhang J +5 more
europepmc +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Numerical Study of Particle Separation through Integrated Multi-Stage Surface Acoustic Waves and Modulated Driving Signals. [PDF]
Jiang Y +8 more
europepmc +1 more source
Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley +1 more source

