Results 91 to 100 of about 793 (231)

Transducers Across Scales and Frequencies: A System‐Level Framework for Multiphysics Integration and Co‐Design

open access: yesAdvanced Materials Technologies, EarlyView.
Transducers convert physical signals into electrical and optical representations, yet each mechanism is bounded by intrinsic trade‐offs across bandwidth, sensitivity, speed, and energy. This review maps transduction mechanisms across physical scale and frequency, showing how heterogeneous integration and multiphysics co‐design transform isolated ...
Aolei Xu   +8 more
wiley   +1 more source

Lead‐Free Bismuth Halide Perovskite Memristors: Low‐Voltage Switching and Physical Modeling of Resistive Hysteresis

open access: yesAdvanced Materials Technologies, EarlyView.
Lead‐free bismuth halide perovskite memristors exhibit stable low‐voltage resistive switching behavior. The conductance‐activated quasi‐linear memristor model quantitatively reproduces the experimental hysteresis, confirming ion migration‐driven filament dynamics.
So‐Yeon Kim   +4 more
wiley   +1 more source

Smart Closed‐Loop Systems in Personalized Healthcare: Advances and Outlook

open access: yesAdvanced Materials Technologies, EarlyView.
A smart closed‐loop e‐textile integrates multimodal sensing, onboard processing, wireless communication, and wearable power to enable real‐time physiological/biochemical monitoring and feedback‐controlled therapy. ABSTRACT Smart textiles represent a revolutionary frontier in healthcare, seamlessly blending fabric and advanced technologies to create ...
Safoora Khosravi   +12 more
wiley   +1 more source

Non‐Invasive Multidimensional Capacitive Sensing for In Vivo Traumatic Brain Injury Monitoring

open access: yesAdvanced Materials Technologies, EarlyView.
Single‐electrode, multidimensional capacitive sensors noninvasively assess cerebral autoregulation and compliance for traumatic brain injury monitoring. ABSTRACT Traumatic brain injury (TBI) is a major cause of death and disability, but invasive intracranial pressure (ICP) monitoring is risky, and current non‐invasive methods lack the resolution and ...
Shawn Kim   +8 more
wiley   +1 more source

Low cost and compact six switch seven level grid tied transformerless PV inverter. [PDF]

open access: yesSci Rep
Gopinath NP   +3 more
europepmc   +1 more source

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

open access: yesAdvanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco   +5 more
wiley   +1 more source

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