Results 41 to 50 of about 11,543 (271)

Laser‐Based Solidification of Cermets/Cemented Carbides: Processing‐Microstructure‐Property Relationships

Advanced Materials Technologies, EarlyView.
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya, Farid Akhtar, Konda Gokuldoss Prashanth   +2 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

Advanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal, Davey Boss, René H. Poelma, Elias Vlieg, John J. Schermer   +4 more
wiley   +1 more source

Ceramic material suitable for repair of a space vehicle component in a microgravity and vacuum environment, method of making same, and method of repairing a space vehicle component [PDF]

, 2009
A precursor of a ceramic adhesive suitable for use in a vacuum, thermal, and microgravity environment. The precursor of the ceramic adhesive includes a silicon-based, preceramic polymer and at least one ceramic powder selected from the group consisting ...
Easler, Timothy E., Riedell, James A.
core   +1 more source

Advances in Safe, Flexible, and Stretchable Batteries for Wearable Applications

Advanced Materials Technologies, EarlyView.
Unlike previous reviews centered on component‐based deformability, this work highlights safety‐driven design strategies for flexible and stretchable batteries. By integrating material‐level engineering, geometry‐controlled structures, biocompatibility, and self‐protection mechanisms, it establishes a unified framework that connects mechanical ...
Hyewon Kang, Garan Byun, Seunghyeb Ban, Yunuo Huang, Woon‐Hong Yeo   +4 more
wiley   +1 more source

Hot-Pressing of Tantalum Carbide (I)

Journal of the Japan Society of Powder and Powder Metallurgy, 1970
Carbides of Groups IVb, Vb, and VIb metals have high melting point, high hardness, and good electrical conductivity as well as good thermionic emissivity. Moreover, they exhibit high mechanical strength at elevated temperatures.Among these, ZrC, HfC, TaC and their solid solutions are important as high temperature materials because of their high melting
Shigetomo Matsuo, Michihiko Horie, Yoshio Jumi   +2 more
openaire   +2 more sources

High-temperature toughening in ternary medium-entropy (Ta1/3Ti1/3Zr1/3)C carbide consolidated using spark-plasma sintering

Journal of Asian Ceramic Societies, 2020
We report for the first time the effect of temperature on the mechanical properties of (Ta1/3Ti1/3Zr1/3)C carbide. Flexural strength and fracture toughness were investigated using the three-point bending technique in argon.
D. Demirskyi, T. Nishimura, T.S. Suzuki, Y. Sakka, O. Vasylkiv, K. Yoshimi   +5 more
doaj   +1 more source

Tunable Electronic and Optoelectronic Properties of MoS2 Through Molecular Coverage‐Controlled Polyoxometalate Doping

Advanced Electronic Materials, EarlyView.
Molecular charge transfer at the V12‐DyPc/MoS2 interface stabilizes trions, suppressing neutral A‐exciton emission and enabling controlled modulation of the A–‐trion population, bridging excitonic physics with polyoxometalate charge‐transport functionality.
Jean‐Pierre Glauber, Marco Moors, Dmitry A. Ryndyk, Emad Najafidehaghani, Jonas Lorenz, Rahel‐Manuela Maas, Nils Boysen, Harish Parala, Thomas Heine, Anjana Devi, Kirill Monakhov   +10 more
wiley   +1 more source

Thin film process forms effective electrical contacts on semiconductor crystals [PDF]

, 1967
Process makes microscopic, low-resistance electrical contacts on hexagonal n-type silicon carbide crystals used for microelectronic devices. A vacuum deposition of aluminum is etched to expose the bare silicon carbide where the electrical contacts are ...
Formigoni, N. P., Roberts, J. S.
core   +1 more source

Structural Aspects of Lithium‐Ion Conduction in the Phosphidotitanate Li8TiP4 and Its Comparison With Li7+5xTa1−xP4 and Li8−xTi1−xTaxP4

Chemistry – A European Journal, EarlyView.
ABSTRACT The chemical system Li/Ti/P has previously been subject to intensive investigation. However, reliable structural data for the reported phases have remained elusive. Motivated by the growing interest in phosphorus‐based lithium‐ion conductors, we have reinvestigated the synthesis, crystal structure, and physical properties of Li8TiP4.
David Müller, Tobias Kutsch, Sabine Zeitz, Viktor Hlukhyy, Gabriele Raudaschl‐Sieber, Wilhelm Klein, Thomas F. Fässler   +6 more
wiley   +1 more source

Wear behavior of aluminum LM4 reinforced with WC and TA/NbC hybrid nano-composites fabricated through powder metallurgy technique [PDF]

FME Transactions, 2019
The present investigation aims to understand the wear behavior of aluminum LM4 matrix reinforced with the different weight percentage of tungsten carbide and tantalum-niobium carbide (0.5, 1.0, 1.5 and 2wt %) hard particles.
Sačit T.S., Mohan N.
doaj