Results 141 to 150 of about 3,124 (157)

Identification of two novel membrane proteins from the Tiger frog virus (TFV)

Virus Research, 2008
The Tiger frog virus (TFV) belongs to the genus Ranavirus in the family Iridoviridae, and its genome was completely sequenced in 2002. In order to better understand the viral structure and functional genes involved in infection and virus-host interactions, two candidate genes, ORF001L and ORF020R, were selected for our study.
Qing, Wang, Yongwen, Luo, Junfeng, Xie, Chuanfu, Dong, Shaoping, Weng, Huashui, Ai, Ling, Lü, Xiuqun, Yang, Xiaoqiang, Yu, Jianguo, He   +9 more
openaire   +2 more sources

An LC-MS/MS method for determination of tenofovir (TFV) in human plasma following tenofovir alafenamide (TAF) administration: Development, validation, cross-validation, and use of formic acid as plasma TFV stabilizer

Analytical Biochemistry, 2020
Tenofovir disoproxil fumarate (TDF) and tenofovir alafenamide (TAF) are both tenofovir (TFV) prodrugs, with the same active intracellular metabolite, TFV-diphosphate (TFV-DP). TAF delivers TFV-DP to target cells more efficiently and at lower doses than TDF, thereby substantially reducing systemic exposure to TFV, which results in improved bone and ...
Deqing, Xiao, Kah Hiing John, Ling, Thomas, Tarnowski, Sophia R, Majeed, Polina, German, Brian P, Kearney, Yuwen, Zhao, Yuan-Shek, Chen, Lili, Ma, Tianyi, Zhang   +9 more
openaire   +2 more sources

3D Integrated Through Fused Silica Via (TFV) Based Array Antenna for mm Wave Communications

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020
In this paper we report the demonstration of a multilayer 4X4 array antenna using Through Fused Silica Via (TFV) glass technology targeting 28 GHz as the operational frequency for 5G applications. Due to its low loss tangent, smooth surface and excellent Coefficient of Thermal Expansion (CTE) match with silicon, glass possesses several advantages ...
Renuka Bowrothu, Haein Kim, Yong Kyu Yoon, Stephan Schmidt   +3 more
openaire   +1 more source

Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021
In this work, a substrate integrated 3D solenoid inductor with an ultra-high quality factor (Q-factor) is demonstrated using the combination of Through Fused-silica Vias (TFVs) for low substrate loss and Copper (Cu) / Cobalt (Co) metaconductors for low conductor loss for millimeter wave (mmWave) applications.
Hae-In Kim, Renuka Bowrothu, Woosol Lee, Yong-Kyu Yoon   +3 more
openaire   +1 more source

Face Image Retrieval System Using TFV and Combination of Subimages

2007
Face image can be seen as a complex visual object, which combines a set of characterizing facial features. These facial features are crucial hints for machine to distinguish different face images. However, the face image also contains certain amount of redundant information which can not contribute to the face image retrieval task.
Daidi Zhong, Irek Defée
openaire   +1 more source

Paralelismo entre la teoría Transformación-Flujo-Valor (TFV) y los tipos de fabricación

Dirección y Organización, 2005
Históricamente, los tipos de fabricación se han clasificado utilizando distintos criterios. El resultado es un conjunto numeroso y heterogéneo de clasificaciones. En este artículo se repara en que este conjunto heterogéneo está formado principalmente por tres grupos homogéneos independientes: clasificaciones producto- proceso, clasificaciones push-pull
Miguel Gutiérrez, Francisco A. Rivera, Alfonso Durán, Francisco Sastrón   +3 more
openaire   +1 more source

Low Loss Cu/Co Multilayer Metaconductor Based Band Pass Filter Using Through Fused Silica Via (TFV) Technology

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021
In this work, for the first time we demonstrate a miniaturized band pass filter using the combination of the Cu/Co multilayer metaconductor and the through fused silica via (TFVs) architecture for 5G and millimeter applications. The performance of a 10 paired Cu/Co metaconductor based filter, where the thickness of each Cu and Co metal layer is 150 nm ...
Renuka Bowrothu, Hae-in Kim, Yong Kyu Yoon, Stephan Schmidt, Rafael Santos   +4 more
openaire   +1 more source

28GHz Through Glass Via (TGV) Based Band Pass Filter Using Through Fused Silica Via (TFV) Technology

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019
We present the design, fabrication, and characterization of a band pass filter with a center frequency of 28 GHz using a Half Mode Substrate Integrated Waveguide (HMSIW) architecture on a smooth and thin fused silica substrate for the reduction of insertion loss.
Renuka Bowrothu, Seahee Hwangbo, Todd Schumann, Yong-Kyu Yoon   +3 more
openaire   +1 more source

Molecular characterization of a major outer capsid protein encoded by the Threadfin aquareovirus (TFV) gene segment 10 (S10)

Archives of Virology, 2005
Genome segment 10 (S10) of Threadfin aquareovirus (TFV) was cloned, sequenced, analyzed and found to be 987 bp long encoding a protein of 298 aa with a predicted molecular mass of 32.0 kDa. The TFV S10 gene possesses terminal motifs, (5' GTTTTA and ATTCATC 3') which are also conserved in the S6 and S11 TFV gene segments.
Seng, E.K., Fang, Q., Sin, Y.M., Lam, T.J.   +3 more
openaire   +2 more sources

Türk Bankacılık Sektörünün Etkinlik ve Verimlilik Analizi: 2012-2017 VZA ve Malmquist TFV Endeksi Uygulaması

2020
Bu çalışmada Türkiye’de 2012-2017 yılları arasında sürekli olarak faaliyet gösteren ticari bankaların etkinlik ve verimliliklerinin Veri Zarflama Analizi (VZA) ve Malmquist Toplam Faktör Verimlilik Endeksi (MTFVE) yöntemi ile ölçülmesi amaçlanmıştır. Çalışma kapsamında yapılan analizlerde CCR modeli sonuçları da alınmakla birlikte, çalışmanın yazımında
openaire   +2 more sources