Results 111 to 120 of about 27,110,016 (404)

FEATS - Finite element thermal stress analysis of plane or axisymmetric solids [PDF]

, 1971
FEATS computer code uses finite element analysis to calculate steady state temperature and thermal stress fields for either axisymmetric or plane two-dimensional bodies with boundary conditions, including specified displacements, loads, and thermal ...
Swanson, J. A.
core   +1 more source

Growth Differentiation Factor 15 Elevation in the Central Nervous System Is Associated With Failure to Thrive in Alexander Disease

Annals of Clinical and Translational Neurology, EarlyView.
ABSTRACT Objective Alexander disease (AxD) is a severe neurodegenerative disorder caused by gain‐of‐function mutations in the gene for GFAP, which lead to protein aggregation and a primary astrocytopathy. Symptoms vary, but failure to thrive (FTT) and frequent emesis are common and cause significant morbidity. Here we investigate GDF15, a member of the
Tracy L. Hagemann, Michelle M. Sonsalla, Cora Luzinski, Fernando Zacahua, David A. Harris, Dudley W. Lamming, Albee Messing   +6 more
wiley   +1 more source

The effect of filler morphology on thermal characteristics of lignocellulose and metal powders composites

Zaštita Materijala, 2015
In this manuscript the results of experimental studies of the properties of composite materials based on lignocellulosic matrix (LC) filled with electrolytic copper powder and chemically obtained silver powder are presented.
Miomir G. Pavlović, Zoran Janković
doaj   +1 more source

Using a Supramolecular Approach to Engineer Modular Hydrogel Platforms for Culturing Protoplasts – from General Tissue Engineering to Cellular Agriculture

Advanced Biology, EarlyView.
Using supramolecular monomers, various hydrogel culture systems were formulated to culture protoplasts; including 2D, 2.5D, and 3D hydrogels. Depending on the culture platform, bioactive functionalization led to protoplast enlargement (2D and 2.5D) or plasmolysis (3D). This work shows the potential to modularly engineer synthetic platforms for cellular
Maritza M. Rovers, Erik J. Slootweg, Ferdinand C. O. Los, Patricia Y. W. Dankers   +3 more
wiley   +1 more source

A mathematical analysis of thermal explosions [PDF]

International Journal of Mathematics and Mathematical Sciences, 2001
This paper is devoted to the study of semilinear degenerate elliptic boundary value problems arising in combustion theory which obey the simple Arrhenius rate law and a general Newton law of heat exchange. We prove that ignition and extinction phenomena occur in the stable steady temperature profile at some critical values of a dimensionless rate of ...
openaire   +3 more sources

Determination of physical properties of the asteroid (41) Daphne from interferometric observations in the thermal infrared

, 2011
We describe interferometric observations of the asteroid (41) Daphne in the thermal infrared obtained with the Mid-Infrared Interferometric Instrument (MIDI) of the Very Large Telescope Interferometer (VLTI).
Crouzet, Nicolas, Delbo, Marco, Ligori, Sebastiano, Matter, Alexis, Tanga, Paolo   +4 more
core   +3 more sources

3D In Vitro Models of Breast Cancer: Current Challenges and Future Prospects Toward Recapitulating the Microenvironment and Mimicking Key Processes

Advanced Biology, EarlyView.
In vitro cancer models are advantageous for studying important processes such as tumorigenesis, cancer growth, invasion, and metastasis. The complexity and biological relevance increase depending on the model structure, organization, and composition of materials and cells.
Kyndra S. Higgins, Ah Joung Yu, Cheryl T. Gomillion   +2 more
wiley   +1 more source

Revealing the Impact of Ga and Y Doping on Thermal and Electrical Behavior of LaMnO₃ Ceramic Materials

Applied Sciences
The synthesis, thermal behavior and electrical properties of a series of undoped and 1% Ga- or Y-doped lanthanum manganite compounds, obtained via the sol–gel technique, are reported.
Paulina Vlazan, Catalin Nicolae Marin, Iosif Malaescu, Gabriela Vlase, Titus Vlase, Maria Poienar, Paula Sfirloaga   +6 more
doaj   +1 more source

3D package thermal analysis and thermal optimization

Case Studies in Thermal Engineering
3D packaging mainly uses TSVs (Through Silicon via) to vertically interconnect multiple chips, achieving the purpose of signal transmission and electrical connection. As a popular advanced packaging method, its research is of great significance. Although stacked chips can achieve stronger performance in smaller spaces, they can also cause a series of ...
Yaohui Deng, Peisheng Liu, Zhao Zhang, Jiajie Jin, Pengpeng Xu, Lei Yan   +5 more
openaire   +2 more sources

Thermal Radiation Analysis System (TRASYS) [PDF]

A user's manual is presented for TRASYS, which is a digital software system with a generalized capability for solving radiation problems. Subroutines, file, and variable definitions are presented along with subroutine and function descriptions for the ...
Connor, R. J., Goble, R. G., Jensen, C. L., Paulson, R. E.   +3 more
core   +1 more source